Part | RoHS | Manufacturer | Polarity or Channel Type | Configuration | Surface Mount | Nominal Transition Frequency (fT) | Maximum Power Dissipation (Abs) | Maximum Collector Current (IC) | Package Body Material | Transistor Application | Maximum VCEsat | Minimum Power Gain (Gp) | Terminal Form | Package Shape | No. of Elements | Highest Frequency Band | No. of Terminals | Package Style (Meter) | Sub-Category | Maximum Power Dissipation Ambient | Minimum DC Current Gain (hFE) | Maximum Operating Temperature | Maximum Collector-Base Capacitance | Transistor Element Material | Maximum Collector-Emitter Voltage | Maximum Turn On Time (ton) | Minimum Operating Temperature | Maximum Turn Off Time (toff) | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Case Connection | Qualification | Additional Features | JEDEC-95 Code | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Reference Standard |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
National Semiconductor |
PNP |
SINGLE |
YES |
600 MHz |
.05 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
1 |
VERY HIGH FREQUENCY BAND |
3 |
SMALL OUTLINE |
.85 pF |
SILICON |
20 V |
DUAL |
R-PDSO-G3 |
Not Qualified |
TO-236AB |
||||||||||||||||||||
National Semiconductor |
NPN |
YES |
.273 W |
.025 A |
1 |
BIP RF Small Signal |
40 |
SILICON |
Tin/Lead (Sn/Pb) |
e0 |
||||||||||||||||||||||||||||||
National Semiconductor |
NPN |
COMPLEX |
NO |
500 MHz |
.05 A |
PLASTIC/EPOXY |
AMPLIFIER |
THROUGH-HOLE |
RECTANGULAR |
5 |
VERY HIGH FREQUENCY BAND |
14 |
IN-LINE |
30 |
85 Cel |
SILICON |
30 V |
TIN LEAD |
DUAL |
R-PDIP-T14 |
Not Qualified |
e0 |
||||||||||||||||||
National Semiconductor |
NPN |
COMPLEX |
YES |
550 MHz |
.05 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
5 |
VERY HIGH FREQUENCY BAND |
14 |
SMALL OUTLINE |
40 |
85 Cel |
SILICON |
15 V |
TIN LEAD |
DUAL |
R-PDSO-G14 |
Not Qualified |
LOW NOISE |
e0 |
|||||||||||||||||
National Semiconductor |
NPN |
COMPLEX |
YES |
500 MHz |
.05 A |
PLASTIC/EPOXY |
AMPLIFIER |
GULL WING |
RECTANGULAR |
5 |
VERY HIGH FREQUENCY BAND |
14 |
SMALL OUTLINE |
30 |
85 Cel |
SILICON |
30 V |
TIN LEAD |
DUAL |
R-PDSO-G14 |
Not Qualified |
LOW NOISE |
e0 |
|||||||||||||||||
National Semiconductor |
NPN |
SINGLE |
NO |
900 MHz |
PLASTIC/EPOXY |
AMPLIFIER |
.4 V |
15 dB |
THROUGH-HOLE |
ROUND |
1 |
VERY HIGH FREQUENCY BAND |
3 |
CYLINDRICAL |
25 |
1 pF |
SILICON |
12 V |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
TO-92 |
||||||||||||||||||
National Semiconductor |
PNP |
SINGLE |
NO |
700 MHz |
.625 W |
.2 A |
PLASTIC/EPOXY |
SWITCHING |
.6 V |
THROUGH-HOLE |
ROUND |
1 |
3 |
CYLINDRICAL |
Other Transistors |
40 |
150 Cel |
3 pF |
SILICON |
15 V |
15 ns |
20 ns |
Tin/Lead (Sn/Pb) |
BOTTOM |
O-PBCY-T3 |
Not Qualified |
HIGH SPEED SATURATED SWITCHING |
TO-92 |
e0 |
RF Small Signal Bipolar Junction Transistors (BJT) are electronic devices used in low-power RF (radio frequency) applications to amplify and control small signals. They are commonly used in applications such as wireless communication, GPS, and radio broadcasting.
RF Small Signal BJTs are designed to handle low-power levels and operate at high frequencies, typically in the range of a few MHz to several GHz. They have a high gain and low noise figure, making them suitable for small signal amplification.
The RF Small Signal BJT consists of an emitter, base, and collector region, and works by controlling the flow of majority charge carriers (electrons or holes) between the emitter and collector through the base region. When a voltage is applied to the base-emitter junction, a small current flows through the base, allowing a larger current to flow from the emitter to the collector.
RF Small Signal BJTs are available in various types and configurations, including NPN and PNP bipolar transistors, and can handle power levels ranging from a few milliwatts to a few watts. They are subject to various standards and regulations, such as JEDEC (Joint Electron Device Engineering Council) and RoHS (Restriction of Hazardous Substances), to ensure their safety and performance.