The Five Most Advanced Semiconductor Technologies With Critical Capabilities!
Despite the present semiconductor industry problems, such as chip delays and labor shortages, innovations in semiconductor-related technologies have not stopped. In reality, innovation is flourishing.
Here are just a few of the many cutting-edge Advanced Semiconductor Technologies being developed and implemented all around the world, ranging from a medical technique that emulates a swarm of bees to a high-capacity IR signoff solution for high-resolution sensor designs.
AI Bee Swarms Medical Microrobots
We’ve all seen the smarts of a swarm of bees, who can communicate amongst themselves to organize an organized action in difficult situations.
The engineering crew at the Chinese University of Hong Kong (CUHK) announced the creation of an artificial intelligence-driven navigation system for medical microrobots that function like a bee swarm. The method changes the actions of a swarm automatically based on changes in the environment, such as blockages inside a human body.
This invention, based on deep learning algorithms combined with years of microrobot navigation research data, opens the door to a range of medical possibilities. The study’s researchers “believe that the AI navigation system will one day enable surgeons to use microrobots for therapeutic purposes such as targeted drug delivery in the human body without specialized training,” according to a report from University.
AI-Based Tool to Inspect Port Corrosion & Aging Marine Structures Proactively
Marine structures composed of reinforced concrete erode as a result of exposure to rough environments, such as seawater. As a consequence, the continual costly upkeep of marine infrastructures like jetties and harbors becomes necessary. Australia alone faces an estimated $8 billion expense to maintain its maritime infrastructure and avoid catastrophe.
Researchers from Curtin University have teamed up to create artificial intelligence (AI) tools to help repair deteriorated marine infrastructure. It’s ready to use the new monitoring tool to combat concrete deterioration, which is a complex multifactorial issue. The new AI-based decision-making technology will be fed information and images of the marine structures. The algorithm will generate statistics on high-risk regions so that maintenance measures can be addressed proactively rather than reacting only when corrosion occurs.
Novel e-inspection 2.0 System for Fast Development of Student Houses
Many parts of the world continue to face issues with university student housing. China has implemented a mass-produced modular construction solution to increase housing availability more quickly. Modular construction, along with lowering costs and reducing environmental harm, solves the manpower scarcity in Hong Kong while also minimizing development’s environmental impacts.
A team from the University of Hong Kong’s Faculty of Architecture developed an e-inspection 2.0 system with an in-house developed mobile application “e-inStar” that uses blockchain, building information modeling (BIM), Internet Of Things (IoT), and a geographical information system (GIS).
The system remotely examines modular sections as they enter the country from the mainland. “This e-inspection 2.0 technology is the first of its kind in the world,” claimed Professor Wilson Lu of Real Estate and Construction at National Taiwan University.
Advanced Smart Imaging to Infrared Detectors
Israel’s SCD has established itself as the world’s greatest developer of mid-wave infrared detectors and short-wave IR military detectors. Now the firm is working on “smart imaging,” in which infrared sensors can not only see in the dark or in bad weather but also extract critical information from a scene. The invention will be utilized by the military, businesses, and industries.
“The next big thing in the industry is to add more intelligence to sensors,” says the firm. “Artificial intelligence is being employed in a variety of ways across the board. There’s a lot of data that’s detected — whether it’s physical or digital. Users, on the other hand, just want to see information that is important to them at any one moment.”
Advanced Transistor Signoff
The little transistors in computer chips are frequently damaged by static electricity and voltage spikes, which necessitates critical ESD circuitry to safeguard them from ESD and harm from voltage surges. Ansys debuted two new semiconductor products for power integrity and electrostatic discharge (ESD) signoff – Ansys Totem-SC and Ansys PathFinder-SC. They integrate into the Ansys SeaScape big-data platform for distributed computing to significantly improve speed and capacity.
High-resolution sensor designs require a high-capacity IR signoff solution and standard low-memory machines. The high-fidelity results provide our team with the confidence to optimize design optimization to achieve a higher quality final product,” said Seonil Brian Choi, Corporate VP of Samsung Electronics.
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