LSSOP Buffer Amplifiers 12
| Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
20 mV |
20 uA |
Yes |
1 |
0 V |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
600 V/us |
12 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
60 mA |
140 MHz |
e0 |
0.114 in (2.9 mm) |
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|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
10 uA |
Yes |
1 |
Bipolar |
7.4 mA |
3 V |
3/5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
7 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
1 |
Bipolar |
4 mA |
-5 V |
5 V |
±5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP5/6,.11,37 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
780 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
1 |
Bipolar |
4 mA |
-5 V |
5 V |
±5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP5/6,.11,37 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
780 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
0 V |
No |
12 mV |
35 uA |
Yes |
1 |
Bipolar |
28 mA |
0 V |
Voltage Feedback |
No |
3 V |
±1.425/±3.25/2.85/6.5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP6,.11,37 |
Buffer Amplifiers |
350 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
Yes |
1000 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
No |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
106 mA |
250 MHz |
No |
e0 |
0.114 in (2.9 mm) |
Yes |
No |
||||||||||||
|
STMicroelectronics |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
30 mV |
16 uA |
Yes |
1 |
12.8 mA |
5 V |
5 V |
Small Outline, Low Profile, Shrink Pitch |
TSOP5/6,.11,37 |
Buffer Amplifiers |
780 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
16 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.11 in (2.8 mm) |
No |
87 mA |
320 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||
|
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
-6.5 V |
2 mV |
Yes |
1 |
Bipolar |
13 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
2500 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
45 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
70 A |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
15 mV |
12 uA |
Yes |
1 |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
600 V/us |
12 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
60 mA |
220 MHz |
e0 |
0.114 in (2.9 mm) |
||||||||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
35 uA |
Yes |
1 |
BICMOS |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
275 V/us |
6 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
R-PDSO-G6 |
1 |
0.057 in (1.45 mm) |
0.064 in (1.625 mm) |
No |
40 mA |
45 MHz |
e0 |
0.114 in (2.9 mm) |
|||||||||||||||||||||||||||
|
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
5 |
LSSOP |
Rectangular |
Plastic/Epoxy |
80 MHz |
-6.5 V |
7 mV |
13 uA |
Yes |
1 |
72 dB |
Bipolar |
72 dB |
4.7 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
350 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G5 |
1 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
55 A |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
||||||||||||||||
|
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
6 |
LSSOP |
Rectangular |
Plastic/Epoxy |
280 MHz |
-6.5 V |
2.5 mV |
Yes |
1 |
Bipolar |
5.1 mA |
-5 V |
Tape And Reel |
5 V |
Small Outline, Low Profile, Shrink Pitch |
Buffer Amplifiers |
2100 V/us |
6.5 V |
0.037 in (0.95 mm) |
85 °C (185 °F) |
45 uA |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
R-PDSO-G6 |
2 |
0.057 in (1.45 mm) |
0.063 in (1.6 mm) |
No |
10 A |
280 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.114 in (2.9 mm) |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.