Other Function uPs,uCs & Peripheral ICs

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

ECS300

Ecs International

230

1

136PC15A2L

Honeywell Sensing And Control

CCZACC06A1RTC

Texas Instruments

INDUSTRIAL

NO LEAD

48

QCCN

SQUARE

PLASTIC/EPOXY

YES

3

CHIP CARRIER

LCC48,.27SQ,20

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

30

260

CMOS

3 V

Other Microprocessor ICs

.5 mm

S-PQCC-N48

3

Not Qualified

e4

AGB75LC04-QU-E

Amulet Technologies

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

208

FQFP

SQUARE

PLASTIC/EPOXY

YES

1.32 V

FLATPACK, FINE PITCH

QFP208,1.2SQ,20

1.08 V

85 Cel

-40 Cel

QUAD

4.1 mm

28 mm

28 mm

CMOS

1.2 V

.5 mm

S-PQFP-G208

3

XOMAPL137AZKB3

Texas Instruments

COMMERCIAL

BALL

256

BGA

SQUARE

PLASTIC/EPOXY

YES

1.2,1.8/3.3

GRID ARRAY

BGA256,16X16,40

70 Cel

0 Cel

BOTTOM

Other Microprocessor ICs

1 mm

S-PBGA-B256

Not Qualified

TDA8029HL/C207,151

NXP Semiconductors

MICROPROCESSOR CIRCUIT

INDUSTRIAL

GULL WING

32

QFP

SQUARE

PLASTIC/EPOXY

YES

1.8/5,3/5

FLATPACK

QFP32,.35SQ,32

90 Cel

-40 Cel

QUAD

260

Other Microprocessor ICs

.8 mm

S-PQFP-G32

1

Not Qualified

MFRC53001T/0FE,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

32

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

5

SMALL OUTLINE

SOP32,.4

85 Cel

-25 Cel

DUAL

250

40 mA

5 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G32

3

Not Qualified

TDA8026ET/C2,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

30

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

e1

TDA8026ET/C2,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

TDA8026ET/C2,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

BALL

64

FBGA

SQUARE

PLASTIC/EPOXY

YES

3.3

GRID ARRAY, FINE PITCH

BGA64,8X8,32

85 Cel

-25 Cel

BOTTOM

260

260 mA

3.3 V

Other Microprocessor ICs

.8 mm

S-PBGA-B64

2

Not Qualified

MF0ICU1001W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

MF0ICU1001W/U7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

MF0ICU1101W/U7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

MF0ICU1101W/S7DL,0

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

DIE OR CHIP

70 Cel

-25 Cel

Other Microprocessor ICs

Not Qualified

TDA8035HN/C1,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

5.5 V

3.3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

2.7 V

85 Cel

-25 Cel

QUAD

1 mm

5 mm

260

5 mm

CMOS

220 mA

3.3 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

MFRC52301HN1,151

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

30

260

10 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

e4

MFRC52301HN1,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

NICKEL PALLADIUM GOLD

QUAD

30

260

10 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

e4

MFRC52201HN1,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

100 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

MFRC52202HN1,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/3.3

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

100 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

CY8C5466LTI-063T

Cypress Semiconductor

INDUSTRIAL

NO LEAD

68

QCCN

SQUARE

PLASTIC/EPOXY

YES

3/5

CHIP CARRIER

LCC68,.32SQ,16

85 Cel

-40 Cel

N

QUAD

524288 Bits

CMOS

Other Microprocessor ICs

.4 mm

S-PQCC-N68

Not Qualified

TEA1792T/N1,118

NXP Semiconductors

GULL WING

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE

SOP8,.25

DUAL

260

20 V

Other Microprocessor ICs

1.27 mm

R-PDSO-G8

1

Not Qualified

CY8C5568LTI-114T

Cypress Semiconductor

TEA1792TS/1,115

NXP Semiconductors

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

DUAL

260

20 V

Other Microprocessor ICs

.95 mm

R-PDSO-G6

1

Not Qualified

MFRC63102HN,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

MFRC63102HN,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

MFRC63102HN,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

MFRC63102HN,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

5 V

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

TEA1792ATS/1,115

NXP Semiconductors

GULL WING

6

TSOP

RECTANGULAR

PLASTIC/EPOXY

YES

20

SMALL OUTLINE, THIN PROFILE

TSOP6,.11,37

DUAL

260

1.2 mA

20 V

Other uPs/uCs/Peripheral ICs

.95 mm

R-PDSO-G6

1

Not Qualified

SLRC61002HN,157

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

30

260

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

1

Not Qualified

SLRC61002HN,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

SLRC61002HN,551

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

SLRC61002HN,518

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

NO LEAD

32

QCCN

SQUARE

PLASTIC/EPOXY

YES

3.3/5

CHIP CARRIER

LCC32,.2SQ,20

85 Cel

-25 Cel

QUAD

20 mA

Other Microprocessor ICs

.5 mm

S-PQCC-N32

Not Qualified

PR601HL/C1,557

NXP Semiconductors

MICROPROCESSOR CIRCUIT

OTHER

GULL WING

100

QFP

SQUARE

PLASTIC/EPOXY

YES

3.3,5

FLATPACK

QFP100,.63SQ,20

70 Cel

-25 Cel

QUAD

Other Microprocessor ICs

.5 mm

S-PQFP-G100

Not Qualified

MF0UL1101DUD,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

MF0UL1101DUF,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

MF0UL2101DUD,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

MF0UL2101DUF,005

NXP Semiconductors

MICROPROCESSOR CIRCUIT

COMMERCIAL

DIE OR CHIP

70 Cel

-20 Cel

Other Microprocessor ICs

Not Qualified

SL2MOS5301EV,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PLASTIC/EPOXY

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Microprocessor ICs

Not Qualified

SL2MOS5401EV,118

NXP Semiconductors

MICROPROCESSOR CIRCUIT

PLASTIC/EPOXY

MICROELECTRONIC ASSEMBLY

MODULE(UNSPEC)

Other Microprocessor ICs

Not Qualified

PN7120A0EV/C10801E

NXP Semiconductors

OTHER

BALL

49

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8

GRID ARRAY, FINE PITCH

BGA49,7X7,20

85 Cel

-30 Cel

TIN SILVER COPPER

BOTTOM

30

260

1.8 V

Other uPs/uCs/Peripheral ICs

.5 mm

S-PBGA-B49

3

Not Qualified

e1

TMS320DM335CZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM335DZCE135

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

TMS320DM335DZCE216

Texas Instruments

MICROPROCESSOR CIRCUIT

OTHER

BALL

337

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.365 V

32

1.3,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA337,19X19,25

1.235 V

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.3 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B337

3

Not Qualified

e1

MCIMX535DVV1B

Freescale Semiconductor

SYSTEM ON CHIP

BALL

529

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.3 V

GRID ARRAY, FINE PITCH

BGA529,23X23,32

1.2 V

85 Cel

-20 Cel

Tin/Silver (Sn/Ag)

BOTTOM

1.85 mm

19 mm

40

260

19 mm

CMOS

1.25 V

.8 mm

S-PBGA-B529

3

Not Qualified

e2

OMAPL132BZWTA2E

Texas Instruments

MICROPROCESSOR CIRCUIT

BALL

361

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.05 V

1.2,1.8/3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA361,19X19,32

.95 V

TIN SILVER COPPER

BOTTOM

1.4 mm

16 mm

ALSO OPERATES AT 1.2 V AND 1.1 V TYP

30

260

16 mm

CMOS

1 V

Other Microprocessor ICs

.8 mm

S-PBGA-B361

3

Not Qualified

e1

CC2571RHAR

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

6 mm

0

30

260

6 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

SPI; UART

.5 mm

S-PQCC-N40

3

Not Qualified

e4

CC2571RHAT

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

3

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2 V

85 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

1 mm

6 mm

0

30

260

6 mm

CMOS

3 V

Other uPs/uCs/Peripheral ICs

SPI; UART

.5 mm

S-PQCC-N40

3

Not Qualified

e4

TMS320DM368ZCEDF

Texas Instruments

MICROPROCESSOR CIRCUIT

INDUSTRIAL

BALL

338

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.42 V

32

1.35,1.8,3.3

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA338,19X19,25

1.28 V

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

1.3 mm

8192

13 mm

32

30

260

13 mm

CMOS

1.35 V

Digital Signal Processors

I2C; SPI; UART; USB

.65 mm

FIXED POINT

S-PBGA-B338

3

Not Qualified

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.