Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed
TDA4VL21HGAALZRQ1	Texas Instruments	SYSTEM ON CHIP	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	23 mm			23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3	1200 rpm
DRA821U4TCBALMRQ1	Texas Instruments	SoC	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	17.2 mm		250	17.2 mm	CMOS	.8 V	.8 mm	S-PBGA-B433	3	2000 rpm
DRA821U4TCBALMQ1	Texas Instruments	SoC	BALL	433	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA433,21X21,32	.76 V	125 Cel	-40 Cel	BOTTOM	2.57 mm	17.2 mm		250	17.2 mm	CMOS	.8 V	.8 mm	S-PBGA-B433	3	2000 rpm
P1025NSE5DFB	NXP Semiconductors	SoC	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel	BOTTOM	2.3 mm	23 mm			23 mm	CMOS	1 V	.8 mm	S-PBGA-B561	3
NRF52811-QFAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
NRF52811-QCAA-T	Nordic Semiconductor Asa	MICROPROCESSOR CIRCUIT	NO LEAD	32	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	1.7 V	85 Cel	-40 Cel	QUAD	.9 mm	5 mm			5 mm	CMOS	3 V	.5 mm	S-XQCC-N32
CY8C20055-24SXI	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	16		RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V				1.71 V	85 Cel	-40 Cel	DUAL						CMOS			R-PDSO-G16	3
CY8C614ALQI-S2F02	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm			8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68
CY8C614ALQI-S2F42	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel	QUAD	1 mm	8 mm			8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68
P1015NSN5DFB	NXP Semiconductors	SoC	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V		GRID ARRAY, FINE PITCH	BGA561,27X27,32	.95 V	125 Cel	0 Cel	BOTTOM	1.79 mm	23 mm	40	260	23 mm	CMOS	1 V	.8 mm	S-PBGA-B561	3
AM62A74AUMHAAMBR	Texas Instruments	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	105 Cel	-40 Cel	BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM62A74AUMSIAMBRQ1	Texas Instruments	SoC	BALL	484	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA484,22X22,32	.715 V	125 Cel	-40 Cel	BOTTOM	2.556 mm	18 mm			18 mm	CMOS	.75 V	.8 mm	S-PBGA-B484
AM68A92ATGGHAALZR	Texas Instruments	SoC	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	105 Cel	-40 Cel	BOTTOM	2.57 mm	23 mm	30	260	23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3
XAM69A98ATNGHAALY	Texas Instruments	SoC	BALL	1414	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V		GRID ARRAY, FINE PITCH	BGA1414,38X38,32	.76 V	105 Cel	-40 Cel	BOTTOM	3.341 mm	31 mm			31 mm	CMOS	.8 V	.8 mm	S-PBGA-B1414
NRF52805-CAAA-B-R	Nordic Semiconductor Asa	SoC	BALL	28	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	3.6 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA28,6X7,16	1.7 V	85 Cel	-40 Cel	BOTTOM	.535 mm	2.464 mm			2.482 mm	CMOS	3 V	.4 mm	R-PBGA-B28
AM6251ATCGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel	BOTTOM	.89 mm	13 mm		250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
AM6231ATCGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel	BOTTOM	.89 mm	13 mm		250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
AM6232ATCGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel	BOTTOM	.89 mm	13 mm		250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
OSD3358-1G-ISM	Octavo Systems	SoC	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY	BGA256,16X16,50		85 Cel	-40 Cel	BOTTOM	2.58 mm	21 mm			21 mm	CMOS	1.1 V	1.27 mm	S-PBGA-B256

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.