Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
AM6231AKGGHHALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	95 Cel	0 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425
AM6234ATGGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425
AM6254ASGGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425
AM6254ATGGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425
AM6232ASGGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425
AM6231ASGGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm				13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425
AM6234ATCGHAALW	Texas Instruments	SoC	BALL	425	VFBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA425,25X25,20	.715 V	105 Cel	-40 Cel		BOTTOM	.89 mm	13 mm			250	13 mm	CMOS	.75 V	.5 mm	S-PBGA-B425	3
ESP32-S3-WROOM-1U-N4R2	Espressif Systems (Shanghai)	SoC	NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N16	Espressif Systems (Shanghai)	SoC	NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1U-N8	Espressif Systems (Shanghai)	SoC	NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm				19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
ESP32-S3-WROOM-1-N16R2	Espressif Systems (Shanghai)	SoC	NO LEAD	41	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.25 mm	18 mm				25.5 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N41
LS1023AXE7MQB	NXP Semiconductors	SoC	BALL	621		SQUARE	PLASTIC/EPOXY	YES						105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM				30	250		CMOS			S-PBGA-B621	3		e1
LS1043AXE7MQB	NXP Semiconductors	SoC	BALL	621		SQUARE	PLASTIC/EPOXY	YES						105 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	1.92 mm	21 mm		30	250	21 mm	CMOS		.8 mm	S-PBGA-B621	3		e1
MCIMX6S5EVM10ADR	NXP Semiconductors	SoC	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	105 Cel	-20 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm		40	260	21 mm	CMOS		.8 mm	S-PBGA-B624	3		e1
CY8C4248BZS-L489	Infineon Technologies	PROGRAMMABLE SoC	BALL	124	VFBGA	SQUARE	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA124,13X13,25	1.71 V	105 Cel	-40 Cel		BOTTOM	1 mm	9 mm				9 mm	CMOS	3.3 V	.65 mm	S-PBGA-B241	3
CYPM1211-42FNXIT	Infineon Technologies	CRYPTOGRAPHIC AUTHENTICATOR	BALL	42	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	5.5 V		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA42,6X7,16	2.7 V	105 Cel	-40 Cel		BOTTOM	.55 mm	2.633 mm				3.184 mm	CMOS	3.3 V	.4 mm	R-PBGA-B42
ESP32-WROOM-32UE-N8	Espressif Systems (Shanghai)	SoC	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES	3.6 V		MICROELECTRONIC ASSEMBLY		3 V	85 Cel	-40 Cel		UNSPECIFIED	3.35 mm	18 mm		30	250	19.2 mm	CMOS	3.3 V	1.27 mm	R-XXMA-N38	3
AM6421BSFGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6441BSFFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6442BSFGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6411BKCGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6412BSCGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6441BSEFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6442BSDGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6442BSFFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6411BSCGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6421BSFFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY		250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3
AM6442BSEFHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
AM6442BSEGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY			17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441		1000 rpm
CY8C4045AZQ-S413	Infineon Technologies	PSoC	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.89 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20	1.71 V	105 Cel	-40 Cel		QUAD	1.6 mm	7 mm				7 mm	CMOS	1.8 V	.5 mm	S-PQFP-G48
XCVE1752-1MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-2LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-2MLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-2MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-2HSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.906 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.854 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.88 V	.92 mm	S-PBGA-B1369
XCVE1752-2MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-1LLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-1LSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-1MSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-1MSINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-2MLINSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.8 V	.92 mm	S-PBGA-B1369
XCVE1752-1LSENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
XCVE1752-2LLENSVG1369	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1369	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1369,37X37,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	35 mm				35 mm	CMOS	.7 V	.92 mm	S-PBGA-B1369
AM6422BSDGHAALV	Texas Instruments	SYSTEM ON CHIP	BALL	441	FBGA	SQUARE	PLASTIC/EPOXY	YES	.79 V		GRID ARRAY, FINE PITCH	BGA441,21X21,32	.715 V	105 Cel	-40 Cel		BOTTOM	2.652 mm	17.2 mm	ALSO OPERATES AT 0.85V NOMINAL SUPPLY	30	250	17.2 mm	CMOS	.75 V	.8 mm	S-PBGA-B441	3	1000 rpm
P1025NXE5DFB	NXP Semiconductors	SoC	BALL	561	FBGA	SQUARE	PLASTIC/EPOXY	YES			GRID ARRAY, FINE PITCH	BGA561,27X27,32		125 Cel	-40 Cel		BOTTOM	2.3 mm	23 mm				23 mm	CMOS		.8 mm	S-PBGA-B561	3
ESP32-WROOM-32E(M113EH2800PH3Q0)	Espressif Systems (Shanghai)	SoC	NO LEAD	38	XMA	RECTANGULAR	UNSPECIFIED	YES			MICROELECTRONIC ASSEMBLY						UNSPECIFIED	3.35 mm	18 mm				25.5 mm	CMOS		1.27 mm	R-XXMA-N38
TDA4VE88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3	2000 rpm
TDA4AL88TGAALZRQ1	Texas Instruments	SYSTEM ON CHIP	BALL	770	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100; ISO 26262	GRID ARRAY, FINE PITCH	BGA770,28X28,32	.76 V	125 Cel	-40 Cel		BOTTOM	2.57 mm	23 mm				23 mm	CMOS	.8 V	.8 mm	S-PBGA-B770	3	2000 rpm

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.