Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	Speed	JESD-609 Code
XCZU1CG-L2SFVC784E	Xilinx	MICROPROCESSOR CIRCUIT														Tin/Silver/Copper (Sn/Ag/Cu)				30	250						4		e1
XCZU1EG-1SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT														Tin/Silver/Copper (Sn/Ag/Cu)				30	250						4		e1
XCZU1EG-1SBVA484I	Xilinx	MICROPROCESSOR CIRCUIT														Tin/Silver/Copper (Sn/Ag/Cu)				30	250						4		e1
XCZU1EG-1SFVA625E	Xilinx	MICROPROCESSOR CIRCUIT														Tin/Silver/Copper (Sn/Ag/Cu)				30	250						4		e1
XCZU1EG-L1SFVC784I	Xilinx	MICROPROCESSOR CIRCUIT														Tin/Silver/Copper (Sn/Ag/Cu)				30	250						4		e1
XCZU1EG-L2SBVA484E	Xilinx	MICROPROCESSOR CIRCUIT														Tin/Silver/Copper (Sn/Ag/Cu)				30	250						4		e1
XVF3000-TQ128-CA	Xmos	MICROPROCESSOR CIRCUIT	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.95 V	70 Cel	0 Cel		QUAD	1.2 mm	14 mm			14 mm	CMOS	1 V	.4 mm	S-PQFP-G128
XUF216-512-TQ128-I20A	Xmos	MICROPROCESSOR CIRCUIT	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1.05 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16	.95 V	85 Cel	-40 Cel		QUAD	1.2 mm	14 mm			14 mm	CMOS	1 V	.4 mm	S-PQFP-G128
MCIMX6U5DVM10ADR	NXP Semiconductors	SoC	BALL	624	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.5 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA624,25X25,32	1.35 V	95 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	1.6 mm	21 mm	40	260	21 mm	CMOS	1.4 V	.8 mm	S-PBGA-B624	3		e1
CYAT81658-64AA48T	Infineon Technologies	PSoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel		QUAD						CMOS			S-PQFP-G64	3
CYAT81650-64AA48T	Infineon Technologies	PSoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel		QUAD						CMOS			S-PQFP-G64	3
CYAT81650-100AA48T	Infineon Technologies	PSoC	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel		QUAD						CMOS			S-PQFP-G100
CYAT81658-100AA48T	Infineon Technologies	PSoC	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	85 Cel	-40 Cel		QUAD						CMOS			S-PQFP-G100
CYAT81650-100AS48T	Infineon Technologies	PSoC	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	105 Cel	-40 Cel		QUAD						CMOS			S-PQFP-G100
CYAT81650-64AS48T	Infineon Technologies	PSoC	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1.95 V		FLATPACK, LOW PROFILE, FINE PITCH		1.7 V	105 Cel	-40 Cel		QUAD						CMOS			S-PQFP-G64	3
DRA829VMTGBALFRQ1	Texas Instruments	SoC	BALL	827	FBGA	SQUARE	PLASTIC/EPOXY	YES	.84 V	AEC-Q100	GRID ARRAY, FINE PITCH	BGA827,29X29,32	.76 V	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	2.8 mm	24 mm		250	24 mm	CMOS	.8 V	.8 mm	S-PBGA-B827	3	2000 rpm	e1
EFR32MG24A410F1536IM40-B	Silicon Labs	SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32MG24A010F1024IM48-BR	Silicon Labs	SoC	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24A420F1536IM48-B	Silicon Labs	SoC	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24B010F1024IM48-B	Silicon Labs	SoC	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24B010F1536IM48-B	Silicon Labs	SoC	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24B020F1024IM48-B	Silicon Labs	SoC	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
EFR32MG24A021F1024IM40-BR	Silicon Labs	SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32MG24B020F1536IM40-B	Silicon Labs	SoC	NO LEAD	40	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.2SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	5 mm			5 mm	CMOS	3 V	.4 mm	S-XQCC-N40
EFR32MG24A010F1024IM48-B	Silicon Labs	SoC	NO LEAD	48	HVQCCN	SQUARE	UNSPECIFIED	YES	3.8 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC48,.24SQ,16	1.71 V	125 Cel	-40 Cel		QUAD	.9 mm	6 mm			6 mm	CMOS	3 V	.4 mm	S-XQCC-N48
LS1023AXE7QQB	NXP Semiconductors	SoC	BALL	621	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.03 V		GRID ARRAY, FINE PITCH	BGA621,25X25,32	.97 V	105 Cel	-40 Cel		BOTTOM	2.07 mm	21 mm	30	250	21 mm	CMOS	1 V	.8 mm	S-PBGA-B621	3
XCVE1752-1LLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197			e1
XCVE1752-1LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	100 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-1LSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197			e1
XCVE1752-1MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197			e1
XCVE1752-2LLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197			e1
XCVE1752-1LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197			e1
XCVE1752-1MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-1MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	100 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197			e1
XCVE1752-2LSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-2LSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.676 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.7 V	.92 mm	S-PBGA-B2197			e1
XCVE1752-2MLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm			37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2MSIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm			45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197			e1
XCVM1302-2LLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-2LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-1MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-1MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-2MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-2LLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-2MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1LLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-1MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V		GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	100 Cel	0 Cel		BOTTOM	2.94 mm	31 mm			31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.