Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	Width	Additional Features	Length	Technology	Nominal Supply Voltage	Terminal Pitch	JESD-30 Code	Moisture Sensitivity Level (MSL)	JESD-609 Code
XCVM1402-2MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-2MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVE1752-1MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm		45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVE1752-1MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	100 Cel	0 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-1MSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2LLEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-2MLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2MSEVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.775 V	110 Cel	0 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.8 V	.92 mm	S-PBGA-B1596
XCVE1752-2MSEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm		45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVM1302-1MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	100 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1302-2MLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1LSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-1MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1MSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-2MLENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVE1752-1LLIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-1LSIVSVA1596	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1596	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1596,40X40,36	.676 V	110 Cel	-40 Cel		BOTTOM	4 mm	37.5 mm		37.5 mm	CMOS	.7 V	.92 mm	S-PBGA-B1596
XCVE1752-2MLEVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm		45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVE1752-2MLIVSVA2197	Xilinx	MICROPROCESSOR CIRCUIT	BALL	2197	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA2197,47X47,36	.775 V	110 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	4 mm	45 mm		45 mm	CMOS	.8 V	.92 mm	S-PBGA-B2197		e1
XCVM1302-1LLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-1LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	100 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-1LSINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1302-2MSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
XCVM1402-1LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	100 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-2LSENBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.724 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.676 V	110 Cel	0 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.7 V	.92 mm	S-PBGA-B1024
XCVM1402-2MLINBVB1024	Xilinx	MICROPROCESSOR CIRCUIT	BALL	1024	HBGA	SQUARE	PLASTIC/EPOXY	YES	.825 V	GRID ARRAY, HEAT SINK/SLUG	BGA1024,32X32,36	.775 V	110 Cel	-40 Cel		BOTTOM	2.94 mm	31 mm		31 mm	CMOS	.8 V	.92 mm	S-PBGA-B1024
CY8C6144AZI-S4F92	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZI-S4F93	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm		12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6144AZI-S4F83	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm		12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6144AZQ-S4F93	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm		12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6144LQI-S4F92	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6144LQI-S4F12	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6144AZI-S4F82	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144LQQ-S4F92	Infineon Technologies	PROGRAMMABLE SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6144AZI-S4F62	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZQ-S4F92	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6144AZI-S4F12	Infineon Technologies	PROGRAMMABLE SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D82	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQQ-S4D92	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244LQI-S4D62	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244AZI-S4D83	Infineon Technologies	SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm		12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6244AZQ-S4D93	Infineon Technologies	SoC	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	12 mm		12 mm	CMOS	1.8 V	.5 mm	S-PQFP-G80	3
CY8C6244AZI-S4D12	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244AZI-S4D62	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D82	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CY8C6244AZQ-S4D92	Infineon Technologies	SoC	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	3.6 V	FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	HQFP64,.47SQ,20	1.7 V	85 Cel	-40 Cel		QUAD	1.6 mm	10 mm		10 mm	CMOS	1.8 V	.5 mm	S-PQFP-G64	3
CY8C6244LQI-S4D12	Infineon Technologies	SoC	NO LEAD	68	HVQCCN	SQUARE	UNSPECIFIED	YES	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC68,.32SQ,16	1.7 V	85 Cel	-40 Cel		QUAD	1 mm	8 mm		8 mm	CMOS	1.8 V	.4 mm	S-XQCC-N68	3
CYW54907KWBGT	Infineon Technologies	SYSTEM ON CHIP	BALL	316	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1.26 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA316(UNSPEC)	1.14 V	85 Cel	-30 Cel		BOTTOM	.33 mm	4.907 mm	MINIMUM BUMP PITCH IS CONSIDERED	5.848 mm	CMOS	1.2 V	.2 mm	R-PBGA-B316

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.