Other Function uPs,uCs & Peripheral ICs

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Part RoHS Manufacturer Peripheral IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Package Body Material Integrated Cache Surface Mount Information Access Method Maximum Supply Voltage On Chip Data RAM Width Screening Level Address Bus Width No. of Bits DAC Channels Bit Size Power Supplies (V) Package Style (Meter) Package Equivalence Code Interrupt Capability Minimum Supply Voltage Maximum Operating Temperature CPU Family No. of External Interrupts Minimum Operating Temperature Terminal Finish ADC Channels Ultraviolet Erasable Terminal Position DMA Channels No. of Ports Maximum Seated Height ROM Words RAM Words Width Data EEPROM Size Additional Features Boundary Scan Peripherals External Data Bus Width Maximum Clock Frequency Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Total Dose (V) ROM Bits Size No. of Timers RAM Bytes Technology Analog To Digital Convertors Maximum Supply Current Minimum Time Nominal Supply Voltage No. of DMA Channels PWM Channels No. of Serial I/Os Sub-Category Connectivity ROM Programmability Bus Compatibility Terminal Pitch Format JESD-30 Code Moisture Sensitivity Level (MSL) Qualification Speed Low Power Mode Volatile JESD-609 Code Maximum Standby Current On Chip Program ROM Width No. of I/O Lines Maximum Access Time

AGIB027R31B3E3E

Intel

SoC FPGA

BALL

3184

RECTANGULAR

PLASTIC/EPOXY

YES

100 Cel

0 Cel

BOTTOM

R-PBGA-B3184

AGFA027R24C2E3E

Intel

SoC FPGA

BALL

2340

RECTANGULAR

PLASTIC/EPOXY

YES

100 Cel

0 Cel

BOTTOM

R-PBGA-B2340

MIMXRT105SCVL5B

NXP Semiconductors

SYSTEM ON CHIP

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.15 V

105 Cel

-40 Cel

BOTTOM

1.52 mm

10 mm

10 mm

CMOS

.65 mm

S-PBGA-B196

ESP32-WROOM-32E(M113EH3200PH3Q0)

Espressif Systems (Shanghai)

MICROPROCESSOR CIRCUIT

INDUSTRIAL

NO LEAD

38

XMA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

MICROELECTRONIC ASSEMBLY

3 V

85 Cel

-40 Cel

UNSPECIFIED

3.25 mm

18 mm

25.5 mm

CMOS

3.3 V

1.27 mm

R-XXMA-N38

PN7150B0HN/C11006E

NXP Semiconductors

NFC CONTROLLER

NO LEAD

40

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

1.95 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

1.65 V

85 Cel

-30 Cel

QUAD

1 mm

6 mm

260

6 mm

CMOS

1.8 V

.5 mm

S-XQCC-N40

3

SLS32AIA020X4USON10XTMA4

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

OTHER

NO LEAD

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.12,20

1.62 V

85 Cel

-25 Cel

DUAL

.6 mm

3 mm

3 mm

CMOS

5 V

.5 mm

S-PDSO-N10

SLS32AIA010MLUSON10XTMA2

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

INDUSTRIAL

NO LEAD

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

5.5 V

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.12,20

1.62 V

105 Cel

-40 Cel

DUAL

.6 mm

3 mm

3 mm

CMOS

3.3 V

.5 mm

S-PDSO-N10

NRF52832-QFAB-T

Nordic Semiconductor Asa

SoC

NO LEAD

48

HVQCCN

SQUARE

UNSPECIFIED

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC48,.24SQ,16

1.7 V

85 Cel

-40 Cel

QUAD

.9 mm

6 mm

6 mm

CMOS

3 V

.4 mm

S-XQCC-N48

ATMXT640UD-CCU001

Microchip Technology

CAPACITIVE TOUCH SCREEN CONTROLLERS

BALL

88

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.47 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA88,10X10,20

3.14 V

85 Cel

-40 Cel

BOTTOM

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-PBGA-B88

MIMXRT1051CVJ5BR

NXP Semiconductors

SYSTEM ON CHIP

INDUSTRIAL

BALL

196

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA196,14X14,32

1.15 V

105 Cel

-40 Cel

BOTTOM

1.52 mm

12 mm

12 mm

CMOS

.8 mm

S-PBGA-B196

ESP32-C3FN4

Espressif Systems (Shanghai)

MICROPROCESSOR CIRCUIT

NO LEAD

32

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

3.6 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

3 V

85 Cel

-40 Cel

QUAD

.9 mm

5 mm

ALSO HAVE PACKING METHOD TR, 7 INCH WITH 1000 QUANTITY

5 mm

CMOS

3.3 V

.5 mm

S-PQCC-N32

LC898128DP1XHTBG

Onsemi

MICROPROCESSOR CIRCUIT

TIN SILVER

30

260

1

e2

CYPM1111-40LQXIT

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC40,.24SQ,20

2.75 V

85 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

3

CYPM1211-40LQXIT

Infineon Technologies

CRYPTOGRAPHIC AUTHENTICATOR

NO LEAD

40

HVQCCN

SQUARE

UNSPECIFIED

YES

5.5 V

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

2.7 V

105 Cel

-40 Cel

QUAD

.6 mm

6 mm

6 mm

CMOS

3.3 V

.5 mm

S-XQCC-N40

3

S6J32HELTNSC2D000

Infineon Technologies

SoC

GULL WING

216

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP216,1.02SQ,16

1.1 V

105 Cel

-40 Cel

QUAD

1.7 mm

24 mm

24 mm

CMOS

1.2 V

.4 mm

S-PQFP-G216

S6J32JELSNSC20000

Infineon Technologies

SoC

GULL WING

216

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP216,1.02SQ,16

1.1 V

125 Cel

-40 Cel

QUAD

1.7 mm

24 mm

24 mm

CMOS

1.2 V

.4 mm

S-PQFP-G216

S6J32JEKSNSE20000

Infineon Technologies

SoC

GULL WING

208

HLFQFP

SQUARE

PLASTIC/EPOXY

YES

1.3 V

AEC-Q100; TS 16949

FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

QFP208,1.2SQ,20

1.1 V

125 Cel

-40 Cel

QUAD

1.7 mm

28 mm

28 mm

CMOS

1.2 V

.5 mm

S-PQFP-G208

MCIMX6S5DVM10ADR

NXP Semiconductors

SoC

BALL

624

LFBGA

SQUARE

PLASTIC/EPOXY

YES

1.5 V

GRID ARRAY, LOW PROFILE, FINE PITCH

BGA624,25X25,32

1.35 V

95 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

1.6 mm

21 mm

40

260

21 mm

CMOS

.8 mm

S-PBGA-B624

3

e1

XCZU1CG-1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-1SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-2SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-2SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L2SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-L2SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L2SBVA484E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-1SFVC784E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1EG-1SFVC784I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-1SFVA625E

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-2SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L1SBVA484I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

XCZU1CG-L1SFVA625I

Xilinx

MICROPROCESSOR CIRCUIT

Tin/Silver/Copper (Sn/Ag/Cu)

30

250

4

e1

Other Function uPs,uCs & Peripheral ICs

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.