Other Function uPs,uCs & Peripheral ICs

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Part	Manufacturer	Peripheral IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Maximum Supply Voltage	Screening Level	Bit Size	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Minimum Supply Voltage	Maximum Operating Temperature	CPU Family	Minimum Operating Temperature	Terminal Finish	Terminal Position	Maximum Seated Height	ROM Words	RAM Words	Width	Additional Features	Peripherals	External Data Bus Width	Maximum Clock Frequency	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	RAM Bytes	Technology	Maximum Supply Current	Nominal Supply Voltage	Sub-Category	ROM Programmability	Bus Compatibility	Terminal Pitch	Format	JESD-30 Code	Moisture Sensitivity Level (MSL)	Qualification	Speed	JESD-609 Code	No. of I/O Lines
CC2540F128RHAT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC40,.24SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	1 mm		8	6 mm		COMPARATORS, TIMER(4)			30	260	6 mm	8192	CMOS		3 V	Other uPs/uCs/Peripheral ICs		SPI; USART; USB	.5 mm		S-PQCC-N40	3	Not Qualified		e4	21
AR1100T-I/MQ	Microchip Technology	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	20	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.465 V	TS 16949			CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC20,.20SQ,25	3.135 V	85 Cel		-40 Cel	MATTE TIN	QUAD	1 mm			5 mm	ALSO OPERATES AT 5V SUPPLY						5 mm		CMOS		3.3 V				.65 mm		S-PQCC-N20				e3
OMAPL132BZWT2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V				TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP				30	260	16 mm		CMOS		1 V	Other Microprocessor ICs			.8 mm		S-PBGA-B361	3	Not Qualified		e1
OMAPL132BZWTA2	Texas Instruments	MICROPROCESSOR CIRCUIT		BALL	361	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V			1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	.95 V				TIN SILVER COPPER	BOTTOM	1.4 mm			16 mm	ALSO OPERATES AT 1.2 V TYP				30	260	16 mm		CMOS		1 V	Other Microprocessor ICs			.8 mm		S-PBGA-B361	3	Not Qualified		e1
TMS320DM6441BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.1 V		32	1.05/1.2,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		20480	16 mm	ALSO OPERATES AT 1.2 V AND 1.1 V TYP		48		30	260	16 mm		CMOS		1.05 V	Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified		e1
TMS320DM6443BZWT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	316	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8/3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA361,19X19,32	1.14 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.4 mm		20480	16 mm			48		30	260	16 mm		CMOS		1.2 V	Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B316	3	Not Qualified		e1
CC2543RHMR	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm			5 mm					30	260	5 mm		CMOS		3 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32	3	Not Qualified		e4
CC2543RHMT	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	32	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	3.6 V			2.5/3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC32,.2SQ,20	2 V	85 Cel		-40 Cel	NICKEL PALLADIUM GOLD	QUAD	.9 mm			5 mm					30	260	5 mm		CMOS		3 V	Other Microprocessor ICs			.5 mm		S-PQCC-N32	3	Not Qualified		e4
STM32W108HBU61TR	STMicroelectronics	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	40	QCCN	SQUARE	PLASTIC/EPOXY	YES			32	1.25,1.8,2.5/3.3	CHIP CARRIER	LCC40,.24SQ,20		85 Cel	CORTEX-M3	-40 Cel	MATTE TIN	QUAD		131072							30	260		8192	CMOS	150 mA		Microcontrollers	FLASH		.5 mm		S-PQCC-N40	3	Not Qualified	24 rpm	e3
XC7Z010-1CLG400C	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z010-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z010-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z010-2CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z010-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z020-1CLG400I	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		-40 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z020-1CLG484C	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	85 Cel		0 Cel		BOTTOM	1.6 mm			19 mm							19 mm		CMOS		1 V				.8 mm		S-PBGA-B484
XC7Z020-1CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm			19 mm							19 mm		CMOS		1 V				.8 mm		S-PBGA-B484
XC7Z020-2CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z020-2CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	1.6 mm			19 mm							19 mm		CMOS		1 V				.8 mm		S-PBGA-B484
XC7Z020-2CLG484I	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		-40 Cel		BOTTOM	1.6 mm			19 mm							19 mm		CMOS		1 V				.8 mm		S-PBGA-B484
XC7Z020-3CLG400E	Xilinx	SYSTEM ON CHIP		BALL	400	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA400,20X20,32	.95 V	100 Cel		0 Cel	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	BOTTOM	1.6 mm			17 mm							17 mm		CMOS		1 V				.8 mm		S-PBGA-B400	3			e1
XC7Z020-3CLG484E	Xilinx	SYSTEM ON CHIP		BALL	484	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY, LOW PROFILE, FINE PITCH	BGA484,22X22,32	.95 V	100 Cel		0 Cel		BOTTOM	1.6 mm			19 mm							19 mm		CMOS		1 V				.8 mm		S-PBGA-B484
TMS320DM368ZCE48	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V				GRID ARRAY, LOW PROFILE, FINE PITCH		1.28 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm			13 mm					30	260	13 mm		CMOS		1.35 V				.65 mm		S-PBGA-B338	3			e1
R3910-CFAB-E1B	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-XXMA-N25
R3910-CFAB-E1T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM				30	260	5.59 mm		CMOS		1.25 V						R-XXMA-N25	3
SA3291A-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	32		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.777 mm			3.68 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	6.35 mm		CMOS		1.25 V						R-XXMA-N32
SB3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-XXMA-N25
SB3229-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-XXMA-N25
SB3231-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-XXMA-N25
SB3231-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	NO LEAD	25		RECTANGULAR	UNSPECIFIED	YES					MICROELECTRONIC ASSEMBLY			40 Cel		0 Cel		UNSPECIFIED	1.525 mm			3.81 mm	SEATED HGT-NOM				NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-XXMA-N25
TMS320DM368ZCED48F	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	338	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1.42 V		32	1.35,1.8,3.3	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA338,19X19,25	1.28 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	1.3 mm		8192	13 mm			32		30	260	13 mm		CMOS		1.35 V	Digital Signal Processors		I2C; SPI; UART; USB	.65 mm	FIXED POINT	S-PBGA-B338	3	Not Qualified		e1
TMS320DM6467CCUT4	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		16		NOT SPECIFIED	245	19 mm		CMOS		1.2 V	Digital Signal Processors		I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CCUTAV	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		16		NOT SPECIFIED	245	19 mm		CMOS		1.2 V	Digital Signal Processors		I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CCUTD7	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		16		NOT SPECIFIED	245	19 mm		CMOS		1.2 V	Digital Signal Processors		I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CCUTV	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		16		NOT SPECIFIED	245	19 mm		CMOS		1.2 V	Digital Signal Processors		I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CCUT	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		0 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		16		NOT SPECIFIED	245	19 mm		CMOS		1.2 V	Digital Signal Processors		I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467CGUTA6	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	85 Cel		0 Cel	TIN LEAD	BOTTOM	3.3 mm		8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY				20	220	19 mm		CMOS		1.2 V	Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e0
TMS320DM6467TCUT1	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY		48	35 MHz	30	245	19 mm		CMOS		1.3 V	Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467TCUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY		48	35 MHz	30	245	19 mm		CMOS		1.3 V	Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467TCUTD1	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY		48	35 MHz	30	245	19 mm		CMOS		1.3 V	Digital Signal Processors		ETHERNET; I2C; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS320DM6467TZUT9	Texas Instruments	MICROPROCESSOR CIRCUIT	OTHER	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.365 V		32	1.3,1.8/3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.235 V	85 Cel		0 Cel	TIN SILVER COPPER	BOTTOM	3.3 mm		8192	19 mm	ALSO REQUIRES 3.3V I/O SUPPLY				30	245	19 mm		CMOS		1.3 V	Digital Signal Processors			.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
TMS32DM6467CCUTAV6	Texas Instruments	MICROPROCESSOR CIRCUIT	INDUSTRIAL	BALL	529	FBGA	SQUARE	PLASTIC/EPOXY	YES	1.26 V		32	1.2,1.8,3.3	GRID ARRAY, FINE PITCH	BGA529,23X23,32	1.14 V	105 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	3.3 mm		8192	19 mm	DSP, C64X-594 MHZ, 32-BIT, 4752 MIPS; ARM926EJ-S, 297 MHZ, 32-BIT; ALSO REQUIRES 3.3V I/O SUPPLY		16		NOT SPECIFIED	245	19 mm		CMOS		1.2 V	Digital Signal Processors		I2C; PCI; SPI; UART; USB	.8 mm	FIXED POINT	S-PBGA-B529	4	Not Qualified		e1
CY8C20347-24LQXI	Cypress Semiconductor	MICROPROCESSOR CIRCUIT	INDUSTRIAL	NO LEAD	24	HVQCCN	SQUARE	UNSPECIFIED	YES	5.5 V		8	1.8/5	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC24,.16SQ,20	1.71 V	85 Cel	M8C	-40 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	QUAD	.6 mm	16384		4 mm					30	260	4 mm	2048	CMOS	4 mA	3.3 V	Microcontrollers	FLASH		.5 mm		S-XQCC-N24	3	Not Qualified	25.2 rpm	e4
L99MM70XPTR	STMicroelectronics	MICROPROCESSOR CIRCUIT	AUTOMOTIVE	GULL WING	36	HSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	18 V				SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH		6 V	125 Cel		-40 Cel	Tin (Sn)	DUAL	2.45 mm			7.5 mm					30	260	10.3 mm		CMOS		13.5 V				.5 mm		R-PDSO-G36	3			e3
MTFC8GACAANA-4MIT	Micron Technology	MICROPROCESSOR CIRCUIT																		TIN SILVER COPPER										30	260			CMOS												e1
SA3229-E1-T	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	YES					CHIP CARRIER			40 Cel		0 Cel		BOTTOM	1.781 mm			3.18 mm					NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-PBCC-B25
SA3229-E1	Onsemi	MICROPROCESSOR CIRCUIT	COMMERCIAL	BUTT	25	BCC	RECTANGULAR	PLASTIC/EPOXY	YES					CHIP CARRIER			40 Cel		0 Cel		BOTTOM	1.781 mm			3.18 mm					NOT SPECIFIED	NOT SPECIFIED	5.59 mm		CMOS		1.25 V						R-PBCC-B25
XC7Z030-1FFG676I	Xilinx	SYSTEM ON CHIP		BALL	676	BGA	SQUARE	PLASTIC/EPOXY	YES	1.05 V				GRID ARRAY	BGA676,26X26,40	.95 V	100 Cel		-40 Cel		BOTTOM	3.24 mm			27 mm							27 mm		CMOS		1 V				1 mm		S-PBGA-B676

Other function uPs, uCs, and peripheral ICs refer to a wide range of integrated circuits that perform a variety of functions beyond the traditional microprocessor and microcontroller roles. These ICs can be found in a variety of electronic devices, including computers, smartphones, automotive systems, and industrial control systems.

Examples of other function ICs include data acquisition and conversion ICs, which are used to convert analog signals into digital data that can be processed by a microcontroller or microprocessor. These ICs are commonly used in industrial control systems and medical equipment, among other applications.

Another example is interface and communication ICs, which facilitate communication between different electronic devices. These ICs can include Ethernet controllers, USB controllers, and serial communication interfaces, among others.

Power management ICs are another important category of other function ICs. These ICs are used to regulate and manage the power supply to electronic devices, ensuring that they operate efficiently and safely. Power management ICs can include voltage regulators, power controllers, and battery management ICs.