Square Buffer Amplifiers 24
| Part | RoHS | Manufacturer | Amplifier Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Nominal Unity Gain Bandwidth | Maximum Negative Supply Voltage Limit | Low-Bias | Maximum Input Offset Voltage | Maximum Average Bias Current (IIB) | Surface Mount | No. of Functions | Minimum Common Mode Reject Ratio | Technology | Screening Level | Nominal Common Mode Reject Ratio | Maximum Supply Current | Nominal Negative Supply Voltage (Vsup) | Architecture | Programmable Power | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Minimum Slew Rate | Sub-Category | Nominal Slow Rate | Maximum Supply Voltage Limit | Terminal Pitch | Maximum Operating Temperature | Maximum Bias Current (IIB) @25C | Frequency Compensation | Minimum Voltage Gain | Minimum Operating Temperature | Terminal Finish | Terminal Position | Low-Offset | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Minimum Output Current | Nominal Bandwidth (3dB) | Micropower | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Wideband | Power |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
0 V |
20 mV |
20 uA |
Yes |
2 |
16 mA |
0 V |
5 V |
3.3/5/±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
600 V/us |
12 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
60 mA |
140 MHz |
e0 |
0.118 in (3 mm) |
||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
0 V |
15 mV |
12 uA |
Yes |
2 |
Bipolar |
14 mA |
0 V |
5 V |
3.3/5/±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
600 V/us |
12 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
60 mA |
230 MHz |
e0 |
0.118 in (3 mm) |
|||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
-6 V |
3 mV |
5 uA |
Yes |
1 |
CMOS |
12 mA |
-5 V |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
900 V/us |
Buffer Amplifiers |
1600 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
3 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
100 mA |
310 MHz |
e0 |
0.118 in (3 mm) |
|||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
2 |
Bipolar |
8 mA |
-5 V |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
720 MHz |
e0 |
0.118 in (3 mm) |
|||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
0 V |
No |
8 mV |
35 uA |
Yes |
2 |
Bipolar |
56 mA |
0 V |
Voltage Feedback |
No |
3 V |
±1.425/±3.25/2.85/6.5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Operational Amplifiers |
350 V/us |
6.5 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Yes |
1000 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
No |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
106 mA |
250 MHz |
No |
e0 |
0.118 in (3 mm) |
Yes |
No |
||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
0 V |
No |
8 mV |
35 uA |
Yes |
2 |
Bipolar |
56 mA |
0 V |
Voltage Feedback |
No |
3 V |
±1.425/±3.25/2.85/6.5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
350 V/us |
6.5 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
Yes (AVCL >= 5) |
1000 |
-40 °C (-40 °F) |
Tin Lead |
Dual |
No |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
106 mA |
150 MHz |
No |
e0 |
0.118 in (3 mm) |
Yes |
No |
||||||||||||
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
175 mV |
Yes |
1 |
3 V |
Small Outline, Thin Profile, Shrink Pitch |
Buffer Amplifiers |
7 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
50 mA |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
BICMOS |
Tape And Reel |
3.3 V |
Chip Carrier |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
BICMOS |
3.3 V |
Chip Carrier |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
e3 |
40 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
STMicroelectronics |
Buffer |
Industrial |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
12 mV |
140 nA |
Yes |
1 |
-5 V |
5 V |
Flatpack, Low Profile, Fine Pitch |
Buffer Amplifiers |
1 V/us |
18 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQFP-G48 |
1 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
No |
100 mA |
2 MHz |
e3 |
0.276 in (7 mm) |
|||||||||||||||||||||||||
|
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
3.5 uA |
Yes |
1 |
CMOS |
Tape And Reel |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
Buffer Amplifiers |
1050 V/us |
5.5 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
45 mA |
500 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
-6 V |
5 mV |
1 nA |
Yes |
1 |
BICMOS |
7.5 mA |
-5 V |
5 V |
±5 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.16SQ,25 |
Buffer Amplifiers |
12 V/us |
12 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Tin Lead |
Quad |
S-XQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
No |
e0 |
0.157 in (4 mm) |
||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
Tape And Reel |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
2 |
Tape And Reel |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
2 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
Tape And Reel |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Yes |
1 |
3.3 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
Buffer Amplifiers |
6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-XQCC-N16 |
3 |
0.035 in (0.9 mm) |
0.118 in (3 mm) |
No |
35 mA |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||||||||||||||
|
|
STMicroelectronics |
Buffer |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
12 mV |
140 nA |
Yes |
1 |
-5 V |
5 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
Buffer Amplifiers |
1.1 V/us |
18 V |
0.02 in (0.5 mm) |
95 °C (203 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G48 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
150 mA |
3.5 MHz |
0.276 in (7 mm) |
||||||||||||||||||||||||||||
|
|
STMicroelectronics |
Buffer |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
12 mV |
140 nA |
Yes |
1 |
-5 V |
5 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
Buffer Amplifiers |
1.1 V/us |
18 V |
0.02 in (0.5 mm) |
95 °C (203 °F) |
-40 °C (-40 °F) |
Quad |
S-PQFP-G48 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
150 mA |
3.5 MHz |
0.276 in (7 mm) |
||||||||||||||||||||||||||||
|
|
Texas Instruments |
Buffer |
Industrial |
Gull Wing |
48 |
HTFQFP |
Square |
Plastic/Epoxy |
3.5 uA |
Yes |
1 |
CMOS |
Tray |
3.3 V |
Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch |
Buffer Amplifiers |
1050 V/us |
5.5 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-40 °C (-40 °F) |
Nickel PalladiumGold |
Quad |
S-PQFP-G48 |
3 |
0.047 in (1.2 mm) |
0.276 in (7 mm) |
No |
45 mA |
550 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||||||||||
|
|
Texas Instruments |
Buffer |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
-6.6 V |
7 mV |
10 pA |
Yes |
4 |
CMOS |
6.8 mA |
-5 V |
Tape And Reel |
5 V |
3.5/12 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
Buffer Amplifiers |
10 V/us |
6.6 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
10 pA |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Dual |
S-PDSO-G10 |
2 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
8 MHz |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
Maxim Integrated |
Buffer |
Industrial |
Gull Wing |
8 |
TSSOP |
Square |
Plastic/Epoxy |
-6 V |
15 mV |
10 uA |
Yes |
2 |
Bipolar |
4 mA |
-5 V |
5 V |
±5 V |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP8,.19 |
Buffer Amplifiers |
4200 V/us |
6 V |
0.026 in (0.65 mm) |
85 °C (185 °F) |
10 uA |
-40 °C (-40 °F) |
Tin Lead |
Dual |
S-PDSO-G8 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
No |
720 MHz |
e0 |
0.118 in (3 mm) |
|||||||||||||||||||||
|
|
Analog Devices |
Buffer |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
15 mV |
1.5 μA |
Yes |
12 |
15 mA |
16 V |
16 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC48,.27SQ,20 |
Buffer Amplifiers |
6 V/us |
18 V |
0.02 in (0.5 mm) |
100 °C (212 °F) |
-40 °C (-40 °F) |
Quad |
S-XQCC-N48 |
0.039 in (1 mm) |
0.276 in (7 mm) |
No |
250 mA |
4.5 MHz |
0.276 in (7 mm) |
Buffer amplifiers are electronic circuits that are designed to provide a high input impedance and a low output impedance. They are used to isolate one part of a circuit from another, preventing changes in one part of the circuit from affecting the other.
The primary function of a buffer amplifier is to prevent loading effects, which occur when a device with a low input impedance is connected to a device with a high output impedance. In this scenario, the high output impedance of the first device may cause a decrease in signal strength or distortion in the second device.
By using a buffer amplifier, the high output impedance of the first device is isolated from the second device, ensuring that the signal is transferred with minimal distortion. The buffer amplifier acts as a bridge between the two devices, allowing them to operate independently.
Buffer amplifiers are commonly used in audio applications, such as preamplifiers, where they can be used to isolate a sensitive input signal from a power amplifier that requires a low impedance input. They are also used in other applications, such as instrumentation, signal conditioning, and data acquisition, where signal integrity is critical.