2 A Assembly Products 12

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Part RoHS Manufacturer Connector Accessory Type Rated Voltage Rated Current Shielding Approvals (V) Contact Type Usage Cross Section Area Finish Thickness Mating Contacts Shell Sizes Construction Minimum Wire Size Jacket Material Terminal Type MIL Conformity Minimum Cable Entry Maximum Wire Size Insulator Material Maximum Operating Temperature DIN Conformity Application Tool and Machinery Name Cable Types Rated AC Voltage Maximum Cable Entry Contact Design IEC Conformity Minimum Operating Temperature Wire Gauge (AWG) Removal Tools Contact Gender Assembly Item Name Manufacturer Series Contact Resistance Design MIL-Connector Accessory Name Diameter No. of Conductors Mounting Style Contact Style Additional Features Material Mounting Option-2 Terminal Length Mounting Option-1 Associated Military - Specifications Rated DC Voltage

487117-8

TE Connectivity

CONNECTOR ACCESSORY

2 A

100

IDC

NO

0 AWG

105 Cel

NO

FFC

NO

-65 Cel

0

FEMALE

CONTACT

SIGNAL

STRAIGHT

PHOSPHOR BRONZE

5-66506-3

TE Connectivity

CONNECTOR ACCESSORY

2 A

.6 mm2

30

24 AWG

CRIMP

NO

.05 inch

20 AWG

105 Cel

.06 inch

-55 Cel

20

MALE

SIGNAL

BRASS

1-88997-4

TE Connectivity

CONNECTOR ACCESSORY

2 A

30

SOLDER

0 AWG

105 Cel

FFC

-65 Cel

0

MALE

SIGNAL

PHOSPHOR BRONZE

50013-8100

Molex

CONNECTOR ACCESSORY

2 A

51005

35

24 AWG

CRIMP

NO

.035 inch

28 AWG

NO

125 V

.045 inch

NO

FEMALE

CONTACT

SIGNAL

COMPRESSION

PHOSPHOR BRONZE

76624-001LF

Fci

CONNECTOR ACCESSORY

2 A

40

26 AWG

CRIMP

NO

22 AWG

NO

STRIP

NO

FEMALE

CONTACT

20 mohm

STRAIGHT

CONTACT FINISH: TIN

PHOSPHOR BRONZE

1-66506-0

TE Connectivity

CONNECTOR ACCESSORY

2 A

CPC CONNECTORS, AMPLIMITE HDP-20

.6 mm2

24 AWG

CRIMP

NO

.05 inch

20 AWG

105 Cel

NO

.06 inch

NO

-55 Cel

20

MALE

CONTACT

SIGNAL

STRAIGHT

ROUND PIN-SOCKET

CONTACT FINISH: GOLD FLASH OVER NICKEL

BRASS

1-86557-4

TE Connectivity

CONNECTOR ACCESSORY

2 A

.4 mm2

100

26 AWG

IDC

NO

.04 inch

22 AWG

105 Cel

NO

DISCRETE WIRE

.056 inch

NO

-65 Cel

22

MALE

CONTACT

SIGNAL

STRAIGHT

PHOSPHOR BRONZE

86557-4

TE Connectivity

CONNECTOR ACCESSORY

2 A

.4 mm2

30

26 AWG

IDC

NO

.04 inch

22 AWG

105 Cel

NO

DISCRETE WIRE

.056 inch

NO

-65 Cel

22

MALE

CONTACT

SIGNAL

PHOSPHOR BRONZE

2896306

Phoenix Contact

CONNECTOR ACCESSORY

2 A

CUL; UL

NO

NO

60 V

NO

DIN RAIL

60 V

5025791000

Molex

CONNECTOR ACCESSORY

2 A

502578, 503149

7.992

28 AWG

CRIMP

NO

.031 inch

24 AWG

NO

.05 inch

NO

MALE

CONTACT

SIGNAL

STRAIGHT

SQ PIN-SKT

COPPER ALLOY

100 V

1731120049

Molex

CONNECTOR ACCESSORY

2 A

31

SOLDER

NO

135 Cel

NO

NO

-55 Cel

FEMALE

CONTACT

SIGNAL

STRAIGHT

TERMINATION: GOLD (51) OVER NICKEL

COPPER ALLOY

1727040135

Molex

CONNECTOR ACCESSORY

2 A

FCT D-SUB

30

SOLDER

NO

20 AWG

PTFE

125 Cel

NO

NO

-55 Cel

FEMALE

CONTACT

STRAIGHT

CONTACT FINISH: GOLD

COPPER ALLOY

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.