30 A Assembly Products 5

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Part	Manufacturer	Connector Accessory Type	Rated Current	Approvals (V)	Usage	Cross Section Area	Finish Thickness	Minimum Wire Size	Terminal Type	MIL Conformity	Minimum Cable Entry	Maximum Wire Size	Maximum Operating Temperature	DIN Conformity	Cable Types	Maximum Cable Entry	Contact Design	IEC Conformity	Minimum Operating Temperature	Wire Gauge (AWG)	Contact Gender	Assembly Item Name	Manufacturer Series	Design	Mounting Style	Contact Style	Additional Features	Material
929929-3	TE Connectivity	CONNECTOR ACCESSORY	30 A	DIN 72551			39	17 AWG	CRIMP	NO	.086 inch	13 AWG	130 Cel	YES		.134 inch	LOOSE	NO	-40 Cel		FEMALE	CONTACT		POWER			MATING: TIN	PHOSPHOR BRONZE
131C11039X	Conec	CONNECTOR ACCESSORY	30 A	CSA, UL	D-SUB CONNECTOR			12 AWG	CRIMP	NO		10 AWG		NO		.146 inch	MACHINED	NO			MALE	CONTACT		POWER	STRAIGHT	ROUND PIN-SOCKET	CONTACT FINISH: GOLD
1-1719504-1	TE Connectivity	CONNECTOR ACCESSORY	30 A						CRIMP			12 AWG	130 Cel				STAMPED		-40 Cel	12	MALE
927779-6	TE Connectivity	CONNECTOR ACCESSORY	30 A	DIN; IEC			118	20 AWG	CRIMP	NO	.055 inch	17 AWG	140 Cel	YES	WIRE, DISCRETE	.091 inch	FLAT, STEEL CANTILEVER SPRING	YES	-40 Cel		FEMALE	CONTACT	927779	POWER		DUAL PRONG		BRONZE
929940-6	TE Connectivity	CONNECTOR ACCESSORY	30 A			1 mm2		20 AWG	CRIMP			17 AWG	140 Cel						-40 Cel	17	FEMALE

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.