40 A Assembly Products 12

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Part	Manufacturer	Connector Accessory Type	Rated Voltage	Rated Current	Approvals (V)	Usage	Cross Section Area	Finish Thickness	Minimum Wire Size	Terminal Type	MIL Conformity	Minimum Cable Entry	Maximum Wire Size	Insulator Material	Maximum Operating Temperature	DIN Conformity	Cable Types	Rated AC Voltage	Maximum Cable Entry	Contact Design	IEC Conformity	Minimum Operating Temperature	Wire Gauge (AWG)	Contact Gender	Assembly Item Name	Design	Mounting Style	Contact Style	Additional Features	Material	Terminal Length	Rated DC Voltage
DM53745-72	ITT Cannon	CONNECTOR ACCESSORY		40 A				50		SOLDER	NO		8 AWG	TEFLON	150 Cel	NO					NO	-65 Cel		MALE	CONTACT	POWER	STRAIGHT	ROUND PIN-SOCKET	CONTACT FINISH: GOLD OVER COPPER	COPPER ALLOY
132C11049X	Conec	CONNECTOR ACCESSORY		40 A	CSA, UL	D-SUB CONNECTOR			10 AWG	CRIMP	NO		8 AWG			NO			.181 inch	MACHINED	NO			FEMALE	CONTACT	POWER	STRAIGHT	ROUND PIN-SOCKET	CONTACT FINISH: GOLD
DM130341-1	ITT Cannon	CONNECTOR ACCESSORY		40 A						CRIMP	NO		8 AWG			NO			.181 inch	LOOSE	NO			FEMALE	CONTACT	POWER	STRAIGHT	ROUND PIN-SOCKET
213737-1	TE Connectivity	CONNECTOR ACCESSORY	600 V	40 A		METRIMATE DRAWER		30		CRIMP	NO		10 AWG		130 Cel	NO					NO	-55 Cel	10	FEMALE	CONTACT	POWER	STRAIGHT			COPPER ALLOY		600 V
MS4008D	Positronic Industries	CONNECTOR ACCESSORY		40 A						SOLDER	NO		8 AWG	PTFE TEFLON		NO					NO			MALE	CONTACT		STRAIGHT	ROUND PIN-SOCKET			.354 inch
8638PPC4006LF	Amphenol Communications Solutions	CONNECTOR ACCESSORY		40 A				8	10 AWG	CRIMP	NO		8 AWG		125 Cel	NO		500 V	.185 inch		NO	-55 Cel		MALE	CONTACT		STRAIGHT	ROUND PIN-SOCKET	MATING: GOLD OVER NICKEL (79), TERMINATION: MATTE TIN (118) OVER COPPER (79)	BRASS	.343 inch	500 V
927838-2	TE Connectivity	CONNECTOR ACCESSORY		40 A	IEC; VDE		2.5 mm2		17 AWG	CRIMP	NO	.011 inch	13 AWG		130 Cel	NO	DISCRETE WIRE		.086 inch	STAMPED	NO	-40 Cel	13	FEMALE	CONTACT	POWER				PHOSPHOR BRONZE
929967-8	TE Connectivity	CONNECTOR ACCESSORY		40 A			1 mm2		20 AWG	CRIMP	NO	.047 inch	17 AWG		130 Cel	NO			.082 inch	STAMPED	NO	-40 Cel	17	MALE	CONTACT	POWER	STRAIGHT		TERMINATION: TIN
T2040001025-000	TE Connectivity	CONNECTOR ACCESSORY		40 A						CRIMP			14 AWG										14	MALE		POWER AND SIGNAL				COPPER ALLOY
T2040001060-000	TE Connectivity	CONNECTOR ACCESSORY		40 A			10 mm2		18 AWG	CRIMP			8 AWG										8	MALE		POWER AND SIGNAL				COPPER ALLOY
2390328-1	TE Connectivity	CONNECTOR ACCESSORY	120 V	40 A			8.36 mm2		10 AWG				8 AWG		60 Cel		DISCRETE WIRE					-20 Cel	8	FEMALE		POWER				BRASS		120 V
8638PSS4005LF	Amphenol Communications Solutions	CONNECTOR ACCESSORY		40 A						SOLDER	NO		8 AWG		125 Cel	NO					NO	-55 Cel		FEMALE	CONTACT		STRAIGHT	ROUND PIN-SOCKET	UNDER PLATING THICKNESS: NICKEL (39)	BRASS	.343 inch

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.