Amphenol Assembly Products 71

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Part RoHS Manufacturer Connector Accessory Type Rated Voltage Rated Current Shielding Approvals (V) Contact Type Usage Cross Section Area Finish Thickness Mating Contacts Shell Sizes Construction Minimum Wire Size Jacket Material Terminal Type MIL Conformity Minimum Cable Entry Maximum Wire Size Insulator Material Maximum Operating Temperature DIN Conformity Application Tool and Machinery Name Cable Types Rated AC Voltage Maximum Cable Entry Contact Design IEC Conformity Minimum Operating Temperature Wire Gauge (AWG) Removal Tools Contact Gender Assembly Item Name Manufacturer Series Contact Resistance Design MIL-Connector Accessory Name Diameter No. of Conductors Mounting Style Contact Style Additional Features Material Mounting Option-2 Terminal Length Mounting Option-1 Associated Military - Specifications Rated DC Voltage

ZP-4016-36L

Amphenol

CONNECTOR ACCESSORY

CRIMP

NO

16 AWG

107 Cel

NO

MACHINED

NO

-55 Cel

MALE

CONTACT

SIGNAL

STRAIGHT

RND PIN-SKT

COPPER ALLOY

AT2P-BT-BK

Amphenol

CONNECTOR ACCESSORY

AT2P-BT-YW

Amphenol

CONNECTOR ACCESSORY

SP16M1F

Amphenol

CONNECTOR ACCESSORY

SS20M1F

Amphenol

CONNECTOR ACCESSORY

VENT-BD002

Amphenol

CONNECTOR ACCESSORY

NO

NO

NO

CAP ITEM

PBT AND PC

KIT38081

Amphenol

CONNECTOR ACCESSORY

NO

NO

NO

BACKSHELL

KIT

L17DTZK25KFMT

Amphenol

CONNECTOR ACCESSORY

UL

NO

.157 inch

120 Cel

NO

.512 inch

NO

-40 Cel

HOOD

DTZK

METAL

SCREW

#4-40

CAP-WMNFSMA1

Amphenol

CONNECTOR ACCESSORY

L17-1590-06

Amphenol

CONNECTOR ACCESSORY

UL

D-SUB

NO

120 Cel

NO

NO

-40 Cel

HOOD

PLASTIC

SCREW

5.50

C14621R0106501

Amphenol

CONNECTOR ACCESSORY

CAP-WACMSPB1

Amphenol

CONNECTOR ACCESSORY

RT0L-14CG-S1

Amphenol

CONNECTOR ACCESSORY

NO

.2362 inch

NO

.4134 inch

NO

BACKSHELL

ZINC ALLOY

RT0L-16CG-S1

Amphenol

CONNECTOR ACCESSORY

NO

.3543 inch

NO

.5709 inch

NO

BACKSHELL

ZINC ALLOY

AT2P-BT

Amphenol

CONNECTOR ACCESSORY

SP14M2G30

Amphenol

RT0L-12CG-S2

Amphenol

CONNECTOR ACCESSORY

UL

NO

.335 inch

NO

.492 inch

NO

BACKSHELL

STANDARD: UL 94V-0

ZINC ALLOY

AT62-203-08141-16

Amphenol

CONNECTOR ACCESSORY

60 A

CRIMP

NO

6 AWG

125 Cel

NO

.217 inch

MACHINED

NO

-55 Cel

FEMALE

CONTACT

STRAIGHT

RND PIN-SKT

COPPER ALLOY

.433 inch

MP10A23S-25

Amphenol

CONNECTOR ACCESSORY

RVPX-HMD-2

Amphenol

CONNECTOR ACCESSORY

NO

NO

NO

GUIDE ITEM

ZINC ALLOY

LOCKING

C146S16002G8

Amphenol

CONNECTOR ACCESSORY

CE; UL

NO

125 Cel

NO

NO

-40 Cel

FRAME ITEM

GLASS FILLED POLYAMIDE

SCREW

M3

C146P16002G8

Amphenol

CONNECTOR ACCESSORY

CE; UL

NO

125 Cel

NO

NO

-40 Cel

FRAME ITEM

GLASS FILLED POLYAMIDE

SCREW

M3

C146S24002G8

Amphenol

CONNECTOR ACCESSORY

UL

NO

125 Cel

NO

NO

-40 Cel

FRAME ITEM

GLASS FILLED POLYAMIDE

SCREW

M3

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.