Molex Assembly Products 53

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Part	Manufacturer	Connector Accessory Type	Usage	Finish Thickness	Minimum Wire Size	Terminal Type	MIL Conformity	Minimum Cable Entry	Maximum Wire Size	Maximum Operating Temperature	DIN Conformity	Maximum Cable Entry	Contact Design	IEC Conformity	Minimum Operating Temperature	Contact Gender	Assembly Item Name	Mounting Style	Contact Style	Additional Features	Material	Mounting Option-2	Terminal Length	Mounting Option-1
1731120211	Molex	CONNECTOR ACCESSORY		7.87	22 AWG	CRIMP	NO		18 AWG		NO		MACHINED	NO		FEMALE	CONTACT	STRAIGHT	RND PIN-SKT		COPPER ALLOY		.165 inch
1731120399	Molex	CONNECTOR ACCESSORY					NO				NO			NO			SCREW ITEM			FINISH: NICKEL	BRASS
1731110082	Molex	CONNECTOR ACCESSORY	D-SUB CONNECTOR				NO	.118 inch		100 Cel	NO	.335 inch		NO	-35 Cel		BACKSHELL				ZINC ALLOY	SCREW		4-40 UNC
1727040111	Molex	CONNECTOR ACCESSORY	FCT D-SUB				NO			95 Cel	NO	.276 inch		NO	-35 Cel		BACKSHELL				ACRYLONITRILE BUTADIENE STYRENE	SCREW		4-40 UNC
747548220	Molex	CONNECTOR ACCESSORY					NO				NO			NO			CAGE ASSEMBLY				COPPER ALLOY

Assembly Products

Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.

Some common assembly products in semiconductor connector accessories include:

Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.

Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.

Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.

Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.

Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.