| Part | RoHS | Manufacturer | Connector Accessory Type | Rated Voltage | Rated Current | Shielding | Approvals (V) | Contact Type | Usage | Cross Section Area | Finish Thickness | Mating Contacts | Shell Sizes | Construction | Minimum Wire Size | Jacket Material | Terminal Type | MIL Conformity | Minimum Cable Entry | Maximum Wire Size | Insulator Material | Maximum Operating Temperature | DIN Conformity | Application | Tool and Machinery Name | Cable Types | Rated AC Voltage | Maximum Cable Entry | Contact Design | IEC Conformity | Minimum Operating Temperature | Wire Gauge (AWG) | Removal Tools | Contact Gender | Assembly Item Name | Manufacturer Series | Contact Resistance | Design | MIL-Connector Accessory Name | Diameter | No. of Conductors | Mounting Style | Contact Style | Additional Features | Material | Mounting Option-2 | Terminal Length | Mounting Option-1 | Associated Military - Specifications | Rated DC Voltage |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Phoenix Contact |
TERMINAL BLOCK ACCESSORY |
NO |
.031 inch |
22 AWG |
105 Cel |
NO |
.079 inch |
NO |
-40 Cel |
FERRULE |
PHOSPHORUS-DEOXIDIZED COPPER |
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|
|
Mh Connectors |
CONNECTOR ACCESSORY |
UL |
D-SUB CONNECTOR |
NO |
ACRYLONITRILE BUTADIENE STYRENE |
120 Cel |
NO |
.465 inch |
NO |
-40 Cel |
BACKSHELL |
ZINC ALLOY |
SCREW |
#4-40, M3 |
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|
|
Phoenix Contact |
CONNECTOR ACCESSORY |
UL |
M12 CONNECTOR |
NO |
90 Cel |
NO |
NO |
-40 Cel |
CLIP ITEM |
THERMOPLASTIC ELASTOMER |
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|
Encitech Ab |
CONNECTOR ACCESSORY |
D-SUB CONNECTOR |
NO |
120 Cel |
NO |
.453 inch |
NO |
-40 Cel |
HOOD |
ZINC |
SCREW |
#4-40 UNC |
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|
|
Amphenol |
CONNECTOR ACCESSORY |
60 A |
CRIMP |
NO |
6 AWG |
125 Cel |
NO |
.217 inch |
MACHINED |
NO |
-55 Cel |
FEMALE |
CONTACT |
STRAIGHT |
RND PIN-SKT |
COPPER ALLOY |
.433 inch |
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|
|
Norcomp Interconnect Devices |
CONNECTOR ACCESSORY |
D SUB SERIES |
NO |
NO |
.435 inch |
NO |
BACKSHELL |
ACRYLONITRILE BUTADIENE STYRENE |
SCREW |
4-40 |
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|
Erni Electronics |
CONNECTOR ACCESSORY |
UL |
NO |
125 Cel |
NO |
NO |
-65 Cel |
HOUSING ITEM |
LOCKING |
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|
|
Amphenol |
CONNECTOR ACCESSORY |
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|
Altech |
CONNECTOR ACCESSORY |
NO |
120 Cel |
NO |
NO |
-30 Cel |
CABLE GLAND |
IP68 |
GLASS FILLED POLYAMIDE6 |
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|
|
Molex |
CONNECTOR ACCESSORY |
D-SUB CONNECTOR |
NO |
.118 inch |
100 Cel |
NO |
.335 inch |
NO |
-35 Cel |
BACKSHELL |
ZINC ALLOY |
SCREW |
4-40 UNC |
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|
|
Hirose Electric |
CONNECTOR ACCESSORY |
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|
|
Phoenix Contact |
TERMINAL BLOCK ACCESSORY |
100 A |
EAC |
NO |
NO |
NO |
JUMPER ITEM |
PLASTIC |
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|
|
Molex |
CONNECTOR ACCESSORY |
FCT D-SUB |
NO |
95 Cel |
NO |
.276 inch |
NO |
-35 Cel |
BACKSHELL |
ACRYLONITRILE BUTADIENE STYRENE |
SCREW |
4-40 UNC |
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|
Gustav Klauke |
TERMINAL BLOCK ACCESSORY |
CSA; CUL; DIN |
NO |
20 AWG |
105 Cel |
YES |
NO |
FERRULE |
STANDARD: DIN 46228 |
POLYPROPYLENE |
LOCKING |
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|
Amphenol |
CONNECTOR ACCESSORY |
NO |
NO |
NO |
GUIDE ITEM |
ZINC ALLOY |
LOCKING |
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|
Phoenix Contact |
CONNECTOR ACCESSORY |
NO |
100 Cel |
NO |
NO |
-40 Cel |
NUT ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
PG9 |
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|
Phoenix Contact |
CONNECTOR ACCESSORY |
NO |
100 Cel |
NO |
NO |
-40 Cel |
NUT ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M40 |
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|
Phoenix Contact |
CONNECTOR ACCESSORY |
NO |
100 Cel |
NO |
NO |
-40 Cel |
NUT ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M16 |
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|
Phoenix Contact |
CONNECTOR ACCESSORY |
EN |
NO |
NO |
NO |
DIN RAIL |
STEEL |
|||||||||||||||||||||||||||||||||||||||||||
|
Phoenix Contact |
CONNECTOR ACCESSORY |
NO |
100 Cel |
NO |
NO |
-40 Cel |
NUT ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M10 |
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|
Phoenix Contact |
CONNECTOR ACCESSORY |
NO |
100 Cel |
NO |
NO |
-40 Cel |
NUT ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M20 |
||||||||||||||||||||||||||||||||||||||||
|
|
Phoenix Contact |
CONNECTOR ACCESSORY |
NO |
NO |
NO |
CAP ITEM |
METAL |
|||||||||||||||||||||||||||||||||||||||||||
|
Phoenix Contact |
CONNECTOR ACCESSORY |
NO |
100 Cel |
NO |
NO |
-40 Cel |
NUT ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M12 |
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|
Phoenix Contact |
CONNECTOR ACCESSORY |
EN; IEC |
NO |
NO |
NO |
DIN RAIL |
STEEL |
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|
Amphenol |
CONNECTOR ACCESSORY |
CE; UL |
NO |
125 Cel |
NO |
NO |
-40 Cel |
FRAME ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M3 |
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|
Conec |
CONNECTOR ACCESSORY |
UL |
NO |
NO |
.433 inch |
NO |
HOOD |
ACRYLONITRILE BUTADIENE STYRENE |
LOCKING |
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|
Molex |
CONNECTOR ACCESSORY |
NO |
NO |
NO |
CAGE ASSEMBLY |
COPPER ALLOY |
||||||||||||||||||||||||||||||||||||||||||||
|
Amphenol |
CONNECTOR ACCESSORY |
CE; UL |
NO |
125 Cel |
NO |
NO |
-40 Cel |
FRAME ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M3 |
|||||||||||||||||||||||||||||||||||||||
|
Amphenol |
CONNECTOR ACCESSORY |
UL |
NO |
125 Cel |
NO |
NO |
-40 Cel |
FRAME ITEM |
GLASS FILLED POLYAMIDE |
SCREW |
M3 |
Assembly products refer to the components that are used to assemble and connect semiconductor devices, such as integrated circuits (ICs) and transistors. These components are critical in the manufacturing and assembly of electronic systems and are designed to provide a reliable and secure connection between the semiconductor device and other electronic components.
Some common assembly products in semiconductor connector accessories include:
Socket connectors: These connectors are used to provide a temporary or permanent connection between the semiconductor device and a circuit board. They are typically designed with a precision contact system that ensures a secure and reliable connection.
Adapters: Adapters are used to enable compatibility between different types of connectors, so that a semiconductor device can be connected to a different type of connector than the one it was originally designed for.
Interface connectors: These connectors are designed to provide a high-speed data transfer between semiconductor devices and other electronic components. They are typically used in high-performance applications, such as data centers, supercomputers, and high-speed communication systems.
Wire bonding products: Wire bonding products are used to connect the semiconductor device to the lead frame or substrate. These products include wire bonders, bond wires, and bonding materials.
Thermal management products: These products are designed to manage the heat generated by the semiconductor device, and ensure that it operates within safe temperature limits. Thermal management products include heat sinks, thermal interface materials, and thermal pads.