32 Analog-to-Digital Converters 250

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

AD9683BCPZRL7-250

Analog Devices

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

1

Yes

1.75 V

250 MHz

1

CMOS

14

0.0165 %

1.8 V

2's Complement Binary

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1.75 V

Serial

-40 °C (-40 °F)

Quad

25 ns

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD7960BCPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

1

Yes

2.054 V

5 MHz

1

18

0.0008 %

5 V

2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-2.042 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD7961BCPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

1

Yes

4.106 V

5 MHz

1

16

0.00084 %

1.8 V

Binary, 2's Complement Binary

Chip Carrier, Heat Sink/Slug, Very Thin Profile

0.02 in (0.5 mm)

85 °C (185 °F)

-4.086 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

DAS1158

Analog Devices

Analog To Digital Converter Subsystem

Other

Pin/Peg

32

Rectangular

1

No

10 V

1

CMOS

15

0.003 %

15 V

Binary, Offset Binary, 2's Complement Binary

-15 V

Microelectronic Assembly

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Sample

50 µs

R-XXMA-P32

No

e0

AD572BD

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

12

0.012 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e0

AD572SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

15 V

Binary, Offset Binary, 2's Complement Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Gold

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.9 in (22.86 mm)

No

e4

HAS-1202AMB

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

641 kHz

1

Hybrid

MIL-STD-883 Class B (Modified)

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

100 °C (212 °F)

-5.12 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

1.56 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

HAS-1202M

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Pin/Peg

32

DIP

Rectangular

Metal

1

No

5.12 V

349 kHz

1

Hybrid

12

0.0122 %

15 V

Binary, Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-5.12 V

Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

2.86 µs

R-MDIP-P32

0.2 in (5.08 mm)

0.9 in (22.86 mm)

No

e0

1.5 in (38.1 mm)

AD1380JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

50 kHz

1

Hybrid

16

0.006 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

14 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

AD1380KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

50 kHz

1

Hybrid

16

0.003 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

14 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

ADS6122IRHB25

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

65 MHz

1

CMOS

12

0.0488 %

3.3 V

Binary, Offset Binary, 2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e4

30 s

260 °C (500 °F)

0.197 in (5 mm)

ADS6123IRHB25

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

80 MHz

1

CMOS

12

0.0488 %

3.3 V

Binary, Offset Binary, 2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e4

30 s

260 °C (500 °F)

0.197 in (5 mm)

ADS6124IRHB25

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

105 MHz

1

CMOS

12

0.0488 %

3.3 V

Binary, Offset Binary, 2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e4

30 s

260 °C (500 °F)

0.197 in (5 mm)

ADS6125IRHB25

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

1

Yes

2 V

125 MHz

1

CMOS

12

0.0488 %

3.3 V

Binary, Offset Binary, 2's Complement Binary

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-2 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Quad

S-PQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e4

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD1376JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

65 kHz

1

Hybrid

16

0.006 %

15 V

Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

17 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

AD1376KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

65 kHz

1

Hybrid

16

0.003 %

15 V

Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

17 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

AD1377JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

16

0.006 %

15 V

Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

AD1377KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

16

0.003 %

15 V

Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Gold

Sample

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

ADADC71JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.006 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Gold

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

ADADC71KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.003 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Gold

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e4

ADADC72JD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.006 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

ADADC72KD

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Bipolar

16

0.003 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

50 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

ADADC80-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.048 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

21 µs

R-CDIP-T32

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.2 in (30.48 mm)

ADADC80-12

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

12

0.012 %

15 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Parallel, Word

-25 °C (-13 °F)

Gold

Sample

Dual

25 µs

R-CDIP-T32

0.28 in (7.11 mm)

0.6 in (15.24 mm)

No

e4

1.2 in (30.48 mm)

ADADC80Z-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.048 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-10 V

Serial, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Dual

21 µs

R-CDIP-T32

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.2 in (30.48 mm)

ADADC84Z-10

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

10

0.048 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Serial, Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

8.4 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

ADADC85SZ-12/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

MIL-STD-883 Class B

12

0.012 %

12 V

Complementary Binary, Complementary 2's Complement, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.9

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T32

0.225 in (5.72 mm)

0.9 in (22.86 mm)

No

e0

THS1206IDA

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

4 V

6 MHz

1

CMOS

12

40 mA

0.0366 %

3.3 V

Binary, 2's Complement Binary

3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

85 °C (185 °F)

1.4 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Dual

175 ns

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

AD579JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

MIL-STD-883 Class B

10

0.0732 %

15 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

2.4 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

1.612 in (40.945 mm)

AD579ZJN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

32

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

10 V

1

Hybrid

10

0.0488 %

12 V

Binary, Offset Binary, Complementary Binary, 2's Complement Binary, Complementary Offset Binary

5,±12/±15 V

-12 V

In-Line

DIP32,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-10 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Dual

2.4 µs

R-CDIP-T32

0.275 in (6.98 mm)

0.6 in (15.24 mm)

No

e0

THS10064IDA

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

4 V

6 MHz

1

CMOS

10

40 mA

0.0977 %

5 V

Binary, 2's Complement Binary

3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

85 °C (185 °F)

1.4 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Dual

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

THS10064CDAR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

4 V

6 MHz

1

CMOS

10

40 mA

0.0977 %

5 V

Binary, 2's Complement Binary

3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

70 °C (158 °F)

1.4 V

Parallel, Word

0 °C (32 °F)

Nickel Palladium Gold

Sample

Dual

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

THS1206CDAR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

4 V

6 MHz

1

CMOS

12

40 mA

0.0366 %

3.3 V

Binary, 2's Complement Binary

3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

70 °C (158 °F)

1.4 V

Parallel, Word

0 °C (32 °F)

Nickel Palladium Gold

Sample

Dual

175 ns

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

THS1206IDAR

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

4 V

6 MHz

1

CMOS

12

40 mA

0.0366 %

3.3 V

Binary, 2's Complement Binary

3.3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

85 °C (185 °F)

1.4 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Dual

175 ns

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

TLV1578CDAR

Texas Instruments

Analog To Digital Converter, Successive Approximation

Commercial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

8

Yes

5.5 V

1.25 MHz

1

CMOS

10

8.5 mA

0.0977 %

3 V

Binary, 2's Complement Binary

3/5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

2.7 V

0.026 in (0.65 mm)

70 °C (158 °F)

0 mV

Parallel, Word

0 °C (32 °F)

Nickel Palladium Gold

Dual

R-PDSO-G32

2

0.047 in (1.2 mm)

0.244 in (6.2 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

THS1007CDA

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

4

Yes

4 V

6 MHz

1

CMOS

10

40 mA

0.0977 %

5 V

Binary, 2's Complement Binary

3.5/5.5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

70 °C (158 °F)

1.4 V

Parallel, Word

0 °C (32 °F)

Nickel Palladium Gold

Sample

Dual

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

THS12082CDA

Texas Instruments

Analog To Digital Converter, Proprietary Method

Commercial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

2

Yes

4 V

8 MHz

1

CMOS

12

40 mA

0.0366 %

5 V

Binary, 2's Complement Binary

3.3,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

70 °C (158 °F)

1.4 V

Parallel, Word

0 °C (32 °F)

Nickel Palladium Gold

Sample

Dual

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

THS1209IDA

Texas Instruments

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TSSOP

Rectangular

Plastic/Epoxy

2

Yes

4 V

8 MHz

1

CMOS

12

40 mA

0.0366 %

5 V

Binary, 2's Complement Binary

3.3/5,5 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP32,.3

Analog to Digital Converters

3 V

0.026 in (0.65 mm)

85 °C (185 °F)

1.4 V

Parallel, Word

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Dual

R-PDSO-G32

2

0.047 in (1.2 mm)

0.24 in (6.1 mm)

No

e4

30 s

260 °C (500 °F)

0.433 in (11 mm)

MAX1448EHJ

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

80 MHz

1

CMOS

10

0.2148 %

3 V

Offset Binary

3 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0.197 in (5 mm)

MAX1449EHJ

Maxim Integrated

Analog To Digital Converter, Proprietary Method

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

1 V

105 MHz

1

CMOS

10

0.2344 %

3.3 V

Offset Binary

3.3 V

Flatpack, Thin Profile, Fine Pitch

QFP32,.28SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-1 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Quad

S-PQFP-G32

1

0.047 in (1.2 mm)

0.197 in (5 mm)

No

e0

245 °C (473 °F)

0.197 in (5 mm)

AD7625BCPZ-RL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

1

Yes

4.096 V

6 MHz

1

CMOS

16

0.0015 %

5 V

Binary, 2's Complement Binary

2.5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-4.096 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin - annealed

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

AD7625BCPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

1

Yes

4.096 V

6 MHz

1

CMOS

16

0.0015 %

5 V

Binary, 2's Complement Binary

2.5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-4.096 V

Serial, Parallel, Word

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

AD7938BCPZ-6REEL7

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

8

Yes

5 V

625 kHz

1

12

1.5 mA

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

0.197 in (5 mm)

AD7938BCPZ-6

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

8

Yes

5 V

625 kHz

1

12

1.5 mA

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-XQCC-N32

3

0.031 in (0.8 mm)

0.197 in (5 mm)

No

e3

30 s

260 °C (500 °F)

0.197 in (5 mm)

AD7938BSUZ-6

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

32

TQFP

Square

Plastic/Epoxy

8

Yes

5 V

625 kHz

1

12

1.5 mA

0.0244 %

3 V

Binary, 2's Complement Binary

3/5 V

Flatpack, Thin Profile

TQFP32,.35SQ,32

Analog to Digital Converters

0.031 in (0.8 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Matte Tin

Track

Quad

S-PQFP-G32

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e3

260 °C (500 °F)

0.276 in (7 mm)

CS53L21-CNZR

Cirrus Logic

Analog To Digital Converter, Delta-Sigma

Commercial

No Lead

32

VQCCN

Square

2

Yes

2.15 V

960 Hz

1

24

1.8 V

Binary, 2's Complement Binary

Chip Carrier, Very Thin Profile

0.02 in (0.5 mm)

70 °C (158 °F)

350 mV

Serial

-10 °C (14 °F)

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

260 °C (500 °F)

0.197 in (5 mm)

AD7626BCPZ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

No Lead

32

HVQCCN

Square

1

Yes

4.096 V

10 MHz

1

CMOS

16

0.0023 %

5 V

2's Complement Binary

2.5,5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

-4.096 V

Serial

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

e3

260 °C (500 °F)

0.197 in (5 mm)

ADS8322YB/2KG4

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Gull Wing

32

TFQFP

Square

Plastic/Epoxy

1

Yes

5.1 V

500 kHz

1

CMOS

16

0.0092 %

5 V

Binary

5 V

Flatpack, Thin Profile, Fine Pitch

TQFP32,.28SQ

Analog to Digital Converters

0.02 in (0.5 mm)

85 °C (185 °F)

0 mV

Parallel, Word

-40 °C (-40 °F)

Sample

Quad

1.6 µs

S-PQFP-G32

0.047 in (1.2 mm)

0.197 in (5 mm)

No

0.197 in (5 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.