DIP Analog-to-Digital Converters 599

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level Nominal Bandwidth No. of Bits Maximum Supply Current Maximum Linearity Error (EL) Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position Maximum Conversion Time JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Input Bit Code

MAX188CCPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0183 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX188CEPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0183 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.03 in (26.16 mm)

MAX188DCPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-2.048 V

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX188DEPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

2.048 V

133 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5/±5 V

-5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-2.048 V

Serial

-40 °C (-40 °F)

Tin Lead

Track

Dual

10 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.03 in (26.16 mm)

AD7870CQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

1

CMOS

12

0.0122 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7870KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

AD7870JN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

3 V

1

CMOS

12

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

AD7870AQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

3 V

1

CMOS

12

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

-3 V

Serial, Parallel, 8 Bits, Parallel, Word

-25 °C (-13 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7875KN

Analog Devices

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

9 µs

R-PDIP-T24

0.21 in (5.33 mm)

0.3 in (7.62 mm)

No

e0

1.25 in (31.75 mm)

AD7875BQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD7875CQ

Analog Devices

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1

CMOS

12

0.0244 %

5 V

Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial, Parallel, 8 Bits, Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

9 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

MAX113CNG

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

3 V

400 kHz

1

CMOS

8

5 mA

3.6 V

Binary

3.3 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX113ENG

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

24

DIP

Rectangular

Plastic/Epoxy

4

No

3 V

400 kHz

1

CMOS

8

6 mA

3.6 V

Binary

3.3 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Parallel, 8 Bits

-40 °C (-40 °F)

Tin Lead

Track

Dual

2 µs

R-PDIP-T24

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.203 in (30.545 mm)

MAX117CPI

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

3 V

400 kHz

1

CMOS

8

5 mA

3.6 V

Binary

3.3 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Parallel, 8 Bits

0 °C (32 °F)

Tin Lead

Track

Dual

2.4 µs

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

MAX118CPI

Maxim Integrated

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

70 °C (158 °F)

-5.25 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Track

Dual

865 ns

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

MAX118EPI

Maxim Integrated

Analog To Digital Converter, Flash Method

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

8

No

5.25 V

1 MHz

1

BICMOS

8

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

-5.25 V

Parallel, Word

-40 °C (-40 °F)

Tin Lead

Track

Dual

865 ns

R-PDIP-T28

1

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

e0

1.45 in (36.83 mm)

TLV0834IN

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

14

DIP

Rectangular

Plastic/Epoxy

4

No

3.6 V

31 kHz

1

CMOS

8

750 μA

0.0977 %

3.3 V

Binary

3.3 V

In-Line

DIP14,.3

Analog to Digital Converters

2.7 V

0.1 in (2.54 mm)

85 °C (185 °F)

-50 mV

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

32 µs

R-PDIP-T14

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0.76 in (19.305 mm)

TLC0832IP

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

2

No

5.5 V

31 kHz

1

CMOS

8

4.7 mA

5 V

Binary

5 V

In-Line

DIP8,.3

Analog to Digital Converters

4.5 V

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

32 µs

R-PDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0.378 in (9.59 mm)

TLC2543CN

Texas Instruments

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

11

No

5.5 V

66 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

4.5 V

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Nickel Palladium Gold

Sample

Dual

10 µs

R-PDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

1 in (25.4 mm)

TLC2543IN

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

11

No

5.5 V

66 kHz

1

CMOS

12

2.5 mA

0.0244 %

5 V

Binary, 2's Complement Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

4.5 V

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Dual

10 µs

R-PDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

1 in (25.4 mm)

TLC546IN

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

19

No

5.5 V

40 kHz

1

CMOS

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Sample

Dual

17 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

1.43 in (36.32 mm)

TLC548IP

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

6 V

45.5 kHz

1

CMOS

8

0.1953 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Dual

17 µs

R-PDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0.386 in (9.81 mm)

TLC549IP

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

8

DIP

Rectangular

Plastic/Epoxy

1

No

6 V

40 kHz

1

CMOS

8

0.1953 %

5 V

Binary

In-Line

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Nickel Palladium Gold

Sample

Dual

17 µs

R-PDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e4

0.386 in (9.81 mm)

TLC545CN

Texas Instruments

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

19

No

5.5 V

76 kHz

1

CMOS

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

0 mV

Serial

0 °C (32 °F)

Sample

Dual

9 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

1.43 in (36.32 mm)

TLC545IN

Texas Instruments

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

19

No

5.5 V

76 kHz

1

CMOS

8

0.1953 %

5 V

Binary

5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

85 °C (185 °F)

0 mV

Serial

-40 °C (-40 °F)

Sample

Dual

9 µs

R-PDIP-T28

0.2 in (5.08 mm)

0.6 in (15.24 mm)

No

1.43 in (36.32 mm)

AD1879JD

Analog Devices

Analog To Digital Converter, Delta-Sigma

Other

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5.985 V

1

BICMOS

18

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5.985 V

Serial

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

MAX121MJE

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

308 kHz

1

BICMOS

14

20 mA

5 V

2's Complement Binary

5,-12/-15 V

-15 V

In-Line

DIP16,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial

-55 °C (-67 °F)

Tin Lead

Track

Dual

3.2 µs

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

AD676TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

16

0.003 %

Binary

5,±12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

JM38510/14001BXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

12

30 mA

0.0122 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

JM38510/14002BXA

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1

12

30 mA

0.0122 %

15 V

Binary

-15 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

35 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD872ASD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

10 MHz

1

BICMOS

MIL-STD-883 Class B

12

5 V

2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

MAX1245ACPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

1.675 V

100 kHz

1

CMOS

12

0.0122 %

2.5 V

Binary, 2's Complement Binary

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

-1.675 V

Serial

0 °C (32 °F)

Tin/Lead

Track

Dual

65 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX1245AEPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Industrial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

1.675 V

100 kHz

1

CMOS

12

0.0122 %

2.5 V

Binary, 2's Complement Binary

In-Line

DIP20,.3

0.1 in (2.54 mm)

85 °C (185 °F)

-1.675 V

Serial

-40 °C (-40 °F)

Tin/Lead

Track

Dual

65 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

1.03 in (26.16 mm)

MAX1245BCPP

Maxim Integrated

Analog To Digital Converter, Successive Approximation

Commercial

Through-Hole

20

DIP

Rectangular

Plastic/Epoxy

8

No

1.675 V

100 kHz

1

CMOS

12

0.02441 %

2.5 V

Binary, 2's Complement Binary

In-Line

DIP20,.3

0.1 in (2.54 mm)

70 °C (158 °F)

-1.675 V

Serial

0 °C (32 °F)

Tin Lead

Track

Dual

65 µs

R-PDIP-T20

1

0.18 in (4.572 mm)

0.3 in (7.62 mm)

No

e0

245 °C (473 °F)

1.03 in (26.16 mm)

AD671SD-500/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.0977 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD671SD-750/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

BICMOS

38535Q/M;38534H;883B

12

56 mA

0.061 %

5 V

Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD678SD/883B

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

BICMOS

38535Q/M;38534H;883B

12

34 mA

0.0488 %

12 V

Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

4.4 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD871SD/883B

Analog Devices

Analog To Digital Converter, Proprietary Method

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

1 V

5 MHz

1

BICMOS

38535Q/M;38534H;883B

12

150 mA

5 V

Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-1 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Track

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD5212TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

10 V

1

Hybrid

38535Q/M;38534H;883B

12

68 mA

0.0122 %

15 V

Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-10 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-CDIP-T24

0.245 in (6.22 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

AD7579SQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Glass-Sealed

2

No

2.5 V

50 kHz

1

CMOS

38535Q/M;38534H;883B

10

10 mA

0.0977 %

5 V

Binary

5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-2.5 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Sample

Dual

18.5 µs

R-GDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD5214TD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

1

Hybrid

38535Q/M;38534H;883B

12

68 mA

0.0122 %

15 V

Complementary Offset Binary

5,±15 V

-15 V

In-Line

DIP24,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Serial, Parallel, Word

-55 °C (-67 °F)

Tin Lead

Dual

13 µs

R-CDIP-T24

0.245 in (6.22 mm)

0.6 in (15.24 mm)

No

e0

1.25 in (31.75 mm)

AD7582TQ/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

4

No

5 V

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

5 V

Binary

±5,15 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

0 mV

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

100 µs

R-GDIP-T28

0.22 in (5.59 mm)

0.6 in (15.24 mm)

No

e0

AD670SD/883B

Analog Devices

Analog To Digital Converter, Successive Approximation

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

2

No

5 V

1

Bipolar

38535Q/M;38534H;883B

8

45 mA

0.4 %

5 V

Binary

5 V

In-Line

DIP20,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

3.4 V

Parallel, 8 Bits

-55 °C (-67 °F)

Tin Lead

Dual

10 µs

R-CDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

AD671SD-500

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.0977 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

500 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

AD671SD-750

Analog Devices

Analog To Digital Converter, Flash Method

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

2 MHz

1

BICMOS

12

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP24,.3

Analog to Digital Converters

0.1 in (2.54 mm)

125 °C (257 °F)

-5 V

Parallel, Word

-55 °C (-67 °F)

Tin Lead

Sample

Dual

750 ns

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

1.2 in (30.48 mm)

AD1671KQ

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

1

No

5 V

1.25 MHz

1

BICMOS

12

68 mA

0.061 %

5 V

Binary, Offset Binary, 2's Complement Binary

±5 V

-5 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

800 ns

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD779KD

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

0.0122 %

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

AD779JN

Analog Devices

Analog To Digital Converter, Flash Method

Commercial

Through-Hole

28

DIP

Rectangular

Plastic/Epoxy

1

No

5 V

128 kHz

1

BICMOS

14

34 mA

12 V

Binary, 2's Complement Binary

5,±12 V

-12 V

In-Line

DIP28,.6

Analog to Digital Converters

0.1 in (2.54 mm)

70 °C (158 °F)

-5 V

Parallel, Word

0 °C (32 °F)

Tin Lead

Sample

Dual

6.3 µs

R-PDIP-T28

0.25 in (6.35 mm)

0.6 in (15.24 mm)

No

e0

1.472 in (37.4 mm)

Analog-to-Digital Converters

Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.

ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.

ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.

ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.

Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.