| Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | Nominal Bandwidth | No. of Bits | Maximum Supply Current | Maximum Linearity Error (EL) | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | Maximum Conversion Time | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Input Bit Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
64 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
2 V |
125 MHz |
1 |
CMOS |
16 |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Quad |
S-PQCC-N64 |
3 |
0.039 in (1 mm) |
0.354 in (9 mm) |
Peak-to-peak input voltage range: 2 V |
e3 |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Gull Wing |
48 |
LFQFP |
Square |
Plastic/Epoxy |
2 |
Yes |
105 MHz |
1 |
CMOS |
10 |
0.2637 % |
3 V |
Offset Binary, 2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
0.02 in (0.5 mm) |
105 °C (221 °F) |
Serial |
-55 °C (-67 °F) |
Nickel Palladium Gold |
Track |
Quad |
S-PQFP-G48 |
3 |
0.063 in (1.6 mm) |
0.276 in (7 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
No Lead |
48 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
2 V |
125 MHz |
1 |
14 |
1.8 V |
Offset Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
105 °C (221 °F) |
-2 V |
Serial, Parallel, Word |
-50 °C (-58 °F) |
Nickel Palladium Gold Silver |
Quad |
S-PQCC-N48 |
3 |
0.039 in (1 mm) |
0.276 in (7 mm) |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.276 in (7 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
2 |
Yes |
3.4 V |
4 MHz |
1 |
16 |
0.0031 % |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.49 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Track |
Quad |
190 ns |
S-XQCC-N16 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e3 |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
1.04 V |
5200 MHz |
1 |
12 |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Track |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.825 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
64 |
LFQFP |
Square |
Plastic/Epoxy |
8 |
Yes |
10 V |
800 kHz |
1 |
16 |
47.5 mA |
0.0038 % |
5 V |
2's Complement Binary |
Flatpack, Low Profile, Fine Pitch |
QFP64,.47SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-10 V |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Quad |
324 µs |
R-PQFP-G64 |
3 |
0.063 in (1.6 mm) |
0.394 in (10 mm) |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
140 kHz |
1 |
12 |
0.0488 % |
3.3 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
1.65 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
950 ns |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Industrial |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
1 MHz |
1 |
12 |
3.3 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
1.65 V |
0.02 in (0.5 mm) |
85 °C (185 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
600 ns |
S-PQCC-N16 |
1 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Flash Method |
Industrial |
No Lead |
32 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
8000 MHz |
1 |
AEC-Q100 |
20 |
0.02 % |
7 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
115 °C (239 °F) |
Serial |
-40 °C (-40 °F) |
Quad |
S-PQCC-N32 |
0.039 in (1 mm) |
0.236 in (6 mm) |
0.236 in (6 mm) |
|||||||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
3.3 V |
4 MHz |
1 |
CMOS |
16 |
26 mA |
0.0053 % |
3.3 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Track |
Quad |
190 ns |
S-PQCC-N16 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Other |
Ball |
192 |
HBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.4 V |
10250 MHz |
1 |
12 |
0.1807 % |
1 V |
Offset Binary, 2's Complement Binary, Gray Code |
Grid Array, Heat Sink/Slug |
0.031 in (0.8 mm) |
115 °C (239 °F) |
-1.4 V |
Parallel, Word |
-20 °C (-4 °F) |
Bottom |
0.4 ns |
S-PBGA-B192 |
0.067 in (1.71 mm) |
0.472 in (12 mm) |
0.472 in (12 mm) |
|||||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
2700 MHz |
1 |
12 |
950 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-800 mV |
Serial, Parallel, Word |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
1 |
Yes |
1.04 V |
6400 MHz |
1 |
12 |
1.1 V |
2's Complement Binary |
Grid Array, Fine Pitch |
0.031 in (0.8 mm) |
85 °C (185 °F) |
-1.04 V |
Serial |
-40 °C (-40 °F) |
Tin/Lead |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
235 °C (455 °F) |
0.394 in (10 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
24 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
1.9 V |
768 kHz |
1 |
32 |
1.8 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N24 |
1 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
80 |
LQFP |
Square |
Plastic/Epoxy |
16 |
Yes |
10 V |
1 MHz |
1 |
16 |
0.0031 % |
5 V |
2's Complement Binary |
Flatpack, Low Profile |
1.71 V |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-10 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Track |
Quad |
520 ns |
S-PQFP-G80 |
3 |
0.063 in (1.6 mm) |
0.551 in (14 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.551 in (14 mm) |
||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
20 |
0.00031 % |
1.8 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
SOLCC10,.12,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Track |
Dual |
350 ns |
S-PDSO-N10 |
3 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
20 |
0.00031 % |
1.8 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Track |
Dual |
350 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
20 |
0.00031 % |
1.8 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Track |
Dual |
350 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
500 kHz |
1 |
20 |
0.00031 % |
1.8 V |
2's Complement Binary |
Small Outline, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Track |
Dual |
350 ns |
S-PDSO-N10 |
3 |
0.033 in (0.85 mm) |
0.118 in (3 mm) |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
TSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
500 kHz |
1 |
20 |
0.00031 % |
1.8 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Track |
Dual |
350 ns |
S-PDSO-G10 |
1 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Microchip Technology |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Gull Wing |
8 |
SOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.048 V |
24 kHz |
1 |
TS 16949 |
16 |
180 μA |
5 V |
2's Complement Binary |
Small Outline |
SOP8,.19 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||
|
|
Microchip Technology |
Analog To Digital Converter, Delta-Sigma |
Automotive |
Gull Wing |
8 |
SOP |
Square |
Plastic/Epoxy |
2 |
Yes |
2.048 V |
328 Hz |
1 |
TS 16949 |
16 |
5 V |
2's Complement Binary |
Small Outline |
SOP8,.19 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
2.048 V |
Serial |
-40 °C (-40 °F) |
Matte Tin |
Dual |
S-PDSO-G8 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
e3 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
|||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
No Lead |
56 |
HVQCCN |
Square |
4 |
Yes |
2 V |
25 MHz |
1 |
AEC-Q100 |
12 |
71 mA |
800 mV |
Offset 2's Complement |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Quad |
S-XQCC-N56 |
3 |
0.035 in (0.9 mm) |
0.315 in (8 mm) |
Peak-to-peak input voltage range: 2 V |
e4 |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
|||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
1 MHz |
1 |
16 |
13 mA |
0.004577637 % |
5 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
1.65 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.4 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Sample |
Quad |
650 ns |
S-PQCC-N16 |
2 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||
|
Analog Devices |
Analog To Digital Converter, Proprietary Method |
Military |
Flat |
52 |
GQFF |
Square |
50k Rad(Si) |
Plastic/Epoxy |
1 |
Yes |
400 mV |
80 MHz |
1 |
MIL-PRF-38535 Class V |
14 |
5 V |
Binary |
Flatpack, Guard Ring |
0.04 in (1.016 mm) |
125 °C (257 °F) |
-400 mV |
-55 °C (-67 °F) |
Quad |
S-PQFP-F52 |
0.131 in (3.327 mm) |
0.58 in (14.732 mm) |
0.58 in (14.732 mm) |
|||||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
32 |
TFQFP |
Square |
Plastic/Epoxy |
6 |
Yes |
3.6 V |
32 kHz |
1 |
24 |
5.9 mA |
3 V |
2's Complement Binary |
Flatpack, Thin Profile, Fine Pitch |
TQFP32,.20SQ |
1.65 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1.3 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQFP-G32 |
2 |
0.047 in (1.2 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
|||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
No Lead |
40 |
HVQCCN |
Square |
8 |
Yes |
24.576 V |
125 kHz |
1 |
CMOS |
16 |
21 mA |
0.0076 % |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
0.02 in (0.5 mm) |
110 °C (230 °F) |
-24.576 V |
Serial |
-55 °C (-67 °F) |
Quad |
1 µs |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Other |
No Lead |
40 |
HVQCCN |
Square |
8 |
Yes |
24.576 V |
125 kHz |
1 |
CMOS |
16 |
21 mA |
0.0076 % |
5 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.24SQ,20 |
0.02 in (0.5 mm) |
110 °C (230 °F) |
-24.576 V |
Serial |
-55 °C (-67 °F) |
Quad |
1 µs |
S-XQCC-N40 |
3 |
0.039 in (1 mm) |
0.236 in (6 mm) |
30 s |
260 °C (500 °F) |
0.236 in (6 mm) |
||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
1.65 V |
1 |
24 |
0.0015 % |
1.65 V |
2's Complement Binary |
-1.65 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1 V |
Serial |
-40 °C (-40 °F) |
Quad |
3.4 µs |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
64 |
HVQCCN |
Square |
8 |
Yes |
1.65 V |
1 |
24 |
0.0015 % |
1.65 V |
2's Complement Binary |
-1.65 V |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1 V |
Serial |
-40 °C (-40 °F) |
Quad |
3.4 µs |
S-XQCC-N64 |
3 |
0.031 in (0.8 mm) |
0.354 in (9 mm) |
30 s |
260 °C (500 °F) |
0.354 in (9 mm) |
|||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
20 |
HVQCCN |
Square |
8 |
Yes |
2.5 V |
22.22 kHz |
1 |
12 |
3.5 mA |
0.024 % |
3 V |
Binary, 2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC20,.16SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-55 °C (-67 °F) |
Track |
Quad |
3.2 µs |
S-XQCC-N20 |
3 |
0.031 in (0.8 mm) |
0.157 in (4 mm) |
30 s |
260 °C (500 °F) |
0.157 in (4 mm) |
||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
1 MHz |
1 |
AEC-Q100 |
12 |
900 μA |
1.8 V |
Binary |
Small Outline, Very Thin Profile |
SOLCC10,.12,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-100 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
750 ns |
S-PDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
|||||||||||||||||||
|
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
Gull Wing |
10 |
LSSOP |
Square |
Plastic/Epoxy |
1 |
Yes |
5.2 V |
500 kHz |
1 |
CMOS |
AEC-Q100 |
12 |
600 μA |
1.8 V |
2's Complement Binary |
Small Outline, Thin Profile, Shrink Pitch |
TSSOP10,.19,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-5 V |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
1.4 µs |
S-PDSO-G10 |
0.043 in (1.1 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
|||||||||||||||||
|
Microchip Technology |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
10 |
HVSON |
Square |
Plastic/Epoxy |
1 |
Yes |
5.1 V |
500 kHz |
1 |
AEC-Q100 |
14 |
900 μA |
0.0091 % |
1.8 V |
Binary |
Small Outline, Very Thin Profile |
SOLCC10,.12,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-100 mV |
Serial |
-40 °C (-40 °F) |
Sample |
Dual |
750 ns |
S-PDSO-N10 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
0.118 in (3 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Other |
No Lead |
56 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
4.096 V |
1.496 MHz |
1 |
24 |
1.8 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-4.096 V |
Two's Complement |
0 °C (32 °F) |
Sample |
Quad |
S-PQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter, Delta-Sigma |
Other |
No Lead |
56 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
4.096 V |
1.496 MHz |
1 |
24 |
1.8 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC56,.31SQ,20 |
0.02 in (0.5 mm) |
85 °C (185 °F) |
-4.096 V |
Two's Complement |
0 °C (32 °F) |
Sample |
Quad |
S-PQCC-N56 |
3 |
0.031 in (0.8 mm) |
0.315 in (8 mm) |
30 s |
260 °C (500 °F) |
0.315 in (8 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
Ball |
16 |
BGA |
Square |
Plastic/Epoxy |
8 |
Yes |
5.5 V |
250 kHz |
1 |
16 |
1.6 mA |
0.0061 % |
3.3 V |
Binary |
Grid Array |
1.65 V |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B16 |
1 |
e1 |
30 s |
260 °C (500 °F) |
|||||||||||||||||||
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Industrial |
Ball |
256 |
BGA |
Square |
Plastic/Epoxy |
2 |
Yes |
800 mV |
3200 MHz |
1 |
12 |
1.3 A |
1.1 V |
2's Complement Binary |
Grid Array |
BGA256,16X16,39 |
0.039 in (1 mm) |
85 °C (185 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Lead |
Bottom |
S-PBGA-B256 |
3 |
0.13 in (3.31 mm) |
0.669 in (17 mm) |
Peak-to-peak input voltage range: 0.8 V |
e0 |
20 s |
220 °C (428 °F) |
0.669 in (17 mm) |
||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
196 |
CGA |
Square |
300k Rad(Si) |
Ceramic |
2 |
No |
800 mV |
3200 MHz |
1 |
12 |
1 A |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array |
0.039 in (1 mm) |
-800 mV |
Serial |
Track |
Bottom |
S-CCGA-X196 |
0.244 in (6.194 mm) |
0.591 in (15 mm) |
Peak-to-peak input voltage range: 0.8 V |
0.591 in (15 mm) |
|||||||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
24 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
2.048 MHz |
1 |
16 |
20 mA |
2.942857 % |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.20SQ,20 |
1.65 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.9428 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Sample |
Quad |
422 ns |
S-PQCC-N24 |
2 |
0.039 in (1 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Successive Approximation |
Automotive |
No Lead |
24 |
HVQCCN |
Square |
Plastic/Epoxy |
2 |
Yes |
5.5 V |
2.048 MHz |
1 |
16 |
20 mA |
2.942857 % |
5 V |
Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC24,.20SQ,20 |
1.65 V |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-2.9428 V |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold Silver |
Sample |
Quad |
422 ns |
S-PQCC-N24 |
2 |
0.039 in (1 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
6 |
Yes |
14.2 V |
768 kHz |
1 |
AEC-Q100 |
32 |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
2 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Delta-Sigma |
Automotive |
No Lead |
40 |
HVQCCN |
Square |
Plastic/Epoxy |
4 |
Yes |
14.2 V |
768 kHz |
1 |
AEC-Q100 |
32 |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC40,.20SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
0 mV |
Serial |
-40 °C (-40 °F) |
Nickel Palladium Gold |
Quad |
S-PQCC-N40 |
2 |
0.031 in (0.8 mm) |
0.197 in (5 mm) |
e4 |
30 s |
260 °C (500 °F) |
0.197 in (5 mm) |
||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
2 |
Yes |
1.7 V |
4 MHz |
1 |
14 |
26 mA |
0.0061 % |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1.245 V |
Serial |
-40 °C (-40 °F) |
Track |
Quad |
190 ns |
S-XQCC-N16 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
|
Analog Devices |
Analog To Digital Converter |
Automotive |
No Lead |
16 |
HVQCCN |
Square |
2 |
Yes |
1.7 V |
4 MHz |
1 |
16 |
26 mA |
0.0038 % |
3.3 V |
2's Complement Binary |
Chip Carrier, Heat Sink/Slug, Very Thin Profile |
LCC16,.12SQ,20 |
0.02 in (0.5 mm) |
125 °C (257 °F) |
-1.245 V |
Serial |
-40 °C (-40 °F) |
Track |
Quad |
190 ns |
S-XQCC-N16 |
0.031 in (0.8 mm) |
0.118 in (3 mm) |
260 °C (500 °F) |
0.118 in (3 mm) |
||||||||||||||||||
|
|
Microchip Technology |
Analog To Digital Converter, Pipelined |
Automotive |
Ball |
121 |
TFBGA |
Square |
Plastic/Epoxy |
8 |
Yes |
4.46 V |
80 MHz |
1 |
AEC-Q100 |
14 |
173 mA |
1.2 V |
Offset Binary, 2's Complement Binary |
Grid Array, Thin Profile, Fine Pitch |
BGA121,11X11,25 |
0.026 in (0.65 mm) |
125 °C (257 °F) |
-4.46 V |
Parallel, Word |
-40 °C (-40 °F) |
Sample |
Bottom |
12.5 ns |
S-PBGA-B121 |
0.043 in (1.08 mm) |
0.315 in (8 mm) |
0.315 in (8 mm) |
||||||||||||||||||
|
|
Texas Instruments |
Analog To Digital Converter, Proprietary Method |
Automotive |
Ball |
144 |
FBGA |
Square |
Plastic/Epoxy |
4 |
Yes |
800 mV |
1600 MHz |
1 |
AEC-Q100 |
12 |
100 mA |
1.1 V |
Offset Binary, 2's Complement Binary |
Grid Array, Fine Pitch |
BGA144,12X12,32 |
0.031 in (0.8 mm) |
125 °C (257 °F) |
-800 mV |
Serial |
-40 °C (-40 °F) |
Tin Silver Copper |
Bottom |
S-PBGA-B144 |
3 |
0.076 in (1.94 mm) |
0.394 in (10 mm) |
Peak-to-peak input voltage range: 0.8 V |
e1 |
30 s |
260 °C (500 °F) |
0.394 in (10 mm) |
Analog-to-digital converters (ADCs) are electronic devices that convert continuous analog signals into digital signals, which can be processed by digital circuits, microcontrollers, or computers. ADCs are essential components in many electronic systems, as they allow the measurement and processing of physical signals, such as temperature, pressure, light, and sound.
ADCs work by sampling the analog signal at regular intervals and quantizing the sampled signal into a series of digital values. The sampling rate and the resolution of the ADC determine the accuracy and the bandwidth of the digital signal. ADCs may also include features such as amplification, filtering, or signal conditioning, to improve the accuracy and stability of the digital signal.
ADCs can be classified based on their architecture and their application. The most common types of ADCs are successive approximation ADCs, delta-sigma ADCs, and pipeline ADCs. Each type has its advantages and limitations, depending on the application and the required performance.
ADCs are used in a wide range of applications, from consumer electronics, such as smartphones and digital cameras, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of physical signals into digital signals, allowing the processing, storage, and transmission of data in electronic systems.
Overall, ADCs are essential components in many electronic systems, providing the necessary signal conversion for a wide range of applications. Their accuracy, speed, and resolution determine the performance and the functionality of many electronic devices and systems.