Digital to Analog converter Digital-to-Analog Converters 2,400+

Reset All
Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC8760IPWP

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

24

HTSSOP

Rectangular

Plastic/Epoxy

11 V

Yes

40 kHz

1

16

10 µs

4.6 mA

0.08 %

Serial

10.5 V

3/5,10/36,GND/-18 V

-11.5 V

Small Outline, Heat Sink/Slug, Thin Profile, Shrink Pitch

TSSOP24,.25

Other Converters

10 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

R-PDSO-G24

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

No

e4

260 °C (500 °F)

-11 V

0.307 in (7.8 mm)

Binary, 2's Complement Binary

AD5620BCPZ-1500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5620BCPZ-1RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5620BCPZ-2RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5640BCPZ-1500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

AD5640BCPZ-1RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5640BCPZ-2500RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

AD5640BCPZ-2RL7

Analog Devices

Digital to Analog converter

Industrial

No Lead

8

VSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

14

0.0244 %

Serial

3 V

Small Outline, Very Thin Profile

8 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N8

0.033 in (0.85 mm)

0.118 in (3 mm)

0 V

0.118 in (3 mm)

Binary

DAC3151IRGCR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1 V

Yes

500 MHz

1

10

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e4

30 s

260 °C (500 °F)

-.5 V

0.354 in (9 mm)

Offset Binary

DAC3151IRGCT

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1 V

Yes

500 MHz

1

10

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e4

30 s

260 °C (500 °F)

-.5 V

0.354 in (9 mm)

Offset Binary

DAC3161IRGCR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1 V

Yes

500 MHz

1

12

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e4

30 s

260 °C (500 °F)

-.5 V

0.354 in (9 mm)

Offset Binary

DAC3161IRGCT

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1 V

Yes

500 MHz

1

12

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e4

30 s

260 °C (500 °F)

-.5 V

0.354 in (9 mm)

Offset Binary

DAC3171IRGCR

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

1 V

Yes

500 MHz

1

14

35 mA

Parallel, Word

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

11 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e4

30 s

260 °C (500 °F)

-.5 V

0.354 in (9 mm)

Offset Binary

ADAU1962AWBSTZ-RL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

80

LQFP

Square

Plastic/Epoxy

2.83 V

Yes

1

CMOS

AEC-Q100

24

Serial

3.3 V

2.5,3.3 V

Flatpack, Low Profile

QFP80,.63SQ

Other Converters

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G80

3

0.063 in (1.6 mm)

0.551 in (14 mm)

No

e3

30 s

260 °C (500 °F)

-2.83 V

0.551 in (14 mm)

Binary

ADAU1962AWBSTZ

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

80

LQFP

Square

Plastic/Epoxy

2.83 V

Yes

1

CMOS

AEC-Q100

24

Serial

3.3 V

2.5,3.3 V

Flatpack, Low Profile

QFP80,.63SQ

Other Converters

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-PQFP-G80

3

0.063 in (1.6 mm)

0.551 in (14 mm)

No

e3

30 s

260 °C (500 °F)

-2.83 V

0.551 in (14 mm)

Binary

AD5324SRMZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

10

TSSOP

Square

Plastic/Epoxy

5.5 V

Yes

1

12

0.2441 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

S-PDSO-G10

1

0.043 in (1.1 mm)

0.118 in (3 mm)

e4

260 °C (500 °F)

.25 V

0.118 in (3 mm)

Binary

AD5346BRUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

38

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

0.3906 %

Parallel, 8 Bits

3 V

Small Outline, Thin Profile, Shrink Pitch

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G38

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

.001 V

0.382 in (9.7 mm)

Binary

AD5346BRUZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

38

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

8

0.3906 %

Parallel, 8 Bits

3 V

Small Outline, Thin Profile, Shrink Pitch

6 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G38

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

260 °C (500 °F)

.001 V

0.382 in (9.7 mm)

Binary

AD667KPZ-REEL

Analog Devices

Digital to Analog converter

28

Plastic/Epoxy

1

12

Parallel, Word

Chip Carrier, Heat Sink/Slug, Very Thin Profile

2 µs

Matte Tin

Quad

3

e3

260 °C (500 °F)

Binary

AD5313BRUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

9 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

AD5313BRUZ-REEL

Analog Devices

Digital to Analog converter

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

9 µs

450 μA

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

TSSOP16,.25

7 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

AD5313WBRUZ-REEL7

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.499 V

Yes

1

CMOS

10

0.1953 %

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

9 µs

0.026 in (0.65 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

.001 V

0.197 in (5 mm)

Binary

AD5663BCPZ-R2

Analog Devices

Digital to Analog converter

Industrial

No Lead

10

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

CMOS

16

0.0183 %

Serial

3 V

Small Outline, Heat Sink/Slug, Very Thin Profile

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Matte Tin

Dual

S-PDSO-N10

1

0.033 in (0.85 mm)

0.118 in (3 mm)

e3

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

AD5664RBCBZ-3-RL7

Analog Devices

Digital to Analog converter

Industrial

Ball

12

VFBGA

Rectangular

Plastic/Epoxy

Yes

1

CMOS

12

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

4 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

R-PBGA-B12

1

0.026 in (0.65 mm)

0.066 in (1.665 mm)

e1

30 s

260 °C (500 °F)

0.088 in (2.245 mm)

Binary

AD5668BCBZ-1-500R7

Analog Devices

Digital to Analog converter

Industrial

Ball

16

VFBGA

Square

Plastic/Epoxy

3.6 V

Yes

1

CMOS

16

0.0244 %

Serial

3 V

Grid Array, Very Thin Profile, Fine Pitch

2.5 µs

0.02 in (0.5 mm)

105 °C (221 °F)

-40 °C (-40 °F)

Tin Silver Copper

Bottom

S-PBGA-B16

1

0.026 in (0.65 mm)

0.103 in (2.605 mm)

e1

30 s

260 °C (500 °F)

0 V

0.103 in (2.605 mm)

Binary

AD767KPZ-REEL

Analog Devices

Digital to Analog converter

Military

J Bend

28

QCCJ

Square

Plastic/Epoxy

Yes

1

Bipolar

12

4 µs

23 mA

0.12 %

±12/±15 V

Chip Carrier

LDCC28,.5SQ

Other Converters

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Matte Tin

Quad

S-PQCC-J28

3

No

e3

260 °C (500 °F)

Binary, Offset Binary

DAC8512FSZ-REEL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

4.095 V

Yes

1

CBCMOS

12

0.0488 %

Serial

5 V

Small Outline

16 µs

0.05 in (1.27 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

e3

40 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

MX7545KEWP-T

Maxim Integrated

Digital to Analog converter

12

Matte Tin

1

e3

30 s

260 °C (500 °F)

Binary

6PA3100IRHBRQ1

Texas Instruments

Digital to Analog converter

Industrial

No Lead

32

HVQCCN

Square

Plastic/Epoxy

Yes

3.6 V

1

AEC-Q100

24

Serial

3.3 V

1.8,3.3,3.6 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

Other Converters

2.7 V

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N32

3

0.039 in (1 mm)

0.197 in (5 mm)

No

With programmable PLL

e4

30 s

260 °C (500 °F)

0.197 in (5 mm)

2's Complement Binary

AD9139BCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

CMOS

16

26.6 mA

Serial

3.3 V

1.8,3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC72,.39SQ,20

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

No

e3

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

DAC5675AHFG/EM

Texas Instruments

Digital to Analog converter

Other

Flat

52

GQFF

Square

Ceramic, Metal-Sealed Cofired

Yes

400 MHz

1

14

0.0281 %

3.3 V

Flatpack, Guard Ring

0.025 in (0.64 mm)

115 °C (239 °F)

-55 °C (-67 °F)

Quad

S-CQFP-F52

0.09 in (2.29 mm)

0.748 in (19 mm)

0.748 in (19 mm)

Binary

AD9142ABCPZRL

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

30 s

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

AD9142ABCPZ

Analog Devices

Digital to Analog converter

Industrial

No Lead

72

HVQCCN

Square

1 V

Yes

1

16

Serial

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

20 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N72

3

0.039 in (1 mm)

0.394 in (10 mm)

30 s

260 °C (500 °F)

-1 V

0.394 in (10 mm)

Binary, 2's Complement Binary

AD5671RBRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

12

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD5675RBRUZ-REEL7

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

16

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD5675RBRUZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

16

Serial

3 V

Small Outline, Thin Profile, Shrink Pitch

5 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.256 in (6.5 mm)

Binary

AD5676RBRUZ

Analog Devices

Digital to Analog converter

Automotive

Gull Wing

20

VSSOP

Rectangular

Plastic/Epoxy

5 V

Yes

1

16

0.0046 %

Serial

3 V

Small Outline, Very Thin Profile, Shrink Pitch

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Dual

R-PDSO-G20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

DAC5682ZIRGC

Texas Instruments

Digital to Analog converter

Industrial

No Lead

64

HVQCCN

Square

Plastic/Epoxy

4.1 V

Yes

1000 MHz

1

CMOS

16

Parallel, Word

3.3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

10.4 ns

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N64

3

0.039 in (1 mm)

0.354 in (9 mm)

e4

30 s

260 °C (500 °F)

2.5 V

0.354 in (9 mm)

Offset Binary

MAX5363EUT

Maxim Integrated

Digital to Analog converter

Gull Wing

6

LSSOP

Rectangular

Plastic/Epoxy

Yes

1

6

230 μA

1.5625 %

Serial

3 V

Small Outline, Low Profile, Shrink Pitch

TSOP6,.11,37

20 µs

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G6

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

e0

0.114 in (2.9 mm)

Binary

DAC5681IRGC25

Texas Instruments

Digital to Analog converter

16

Nickel Palladium Gold

3

e4

30 s

260 °C (500 °F)

MAX5362LEUK

Maxim Integrated

Digital to Analog converter

Industrial

Gull Wing

5

LSSOP

Rectangular

Plastic/Epoxy

5.14 V

Yes

1

BICMOS

6

1.5625 %

Serial

5 V

Small Outline, Low Profile, Shrink Pitch

20 µs

0.037 in (0.95 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Tin Lead

Dual

R-PDSO-G5

1

0.057 in (1.45 mm)

0.064 in (1.625 mm)

e0

2.25 V

0.114 in (2.9 mm)

Binary

AD394JD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

12

15 µs

28 mA

0.018 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Offset Binary

AD562AD/BIN

Analog Devices

Digital to Analog converter

Other

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

25 mA

0.0122 %

Parallel, Word

5 V

5/15,-15 V

-15 V

In-Line

DIP24,.6

Other Converters

1.5 µs

0.1 in (2.54 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary

AD562KD/BCD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

25 mA

0.0122 %

Parallel, Word

5 V

5/15,-15 V

-15 V

In-Line

DIP24,.6

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary Coded Decimal

AD562SD/BCD

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

MIL-STD-883

12

25 mA

0.0024 %

Parallel, Word

5 V

5/15,-15 V

-15 V

In-Line

DIP24,.6

Other Converters

1.5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary Coded Decimal

AD563JD/BCD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

25 mA

0.0122 %

Parallel, Word

5 V

5/15,-15 V

-15 V

In-Line

DIP24,.6

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary Coded Decimal

AD563JD/BIN

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

25 mA

0.0122 %

Parallel, Word

5 V

5/15,-15 V

-15 V

In-Line

DIP24,.6

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary

AD563KD/BCD

Analog Devices

Digital to Analog converter

Commercial

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

25 mA

0.0061 %

Parallel, Word

5 V

5/15,-15 V

-15 V

In-Line

DIP24,.6

Other Converters

1.5 µs

0.1 in (2.54 mm)

70 °C (158 °F)

0 °C (32 °F)

Tin Lead

Dual

R-CDIP-T24

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-10 V

1.2 in (30.48 mm)

Binary Coded Decimal

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.