Square Digital-to-Analog Converters 1,409

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

MCP47CMB01-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB01-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB02-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB02-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB02-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB11-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB11-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB11-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

12

620 μA

0.0244 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CMB12-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

720 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB01-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB01-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

8

620 μA

0.0391 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB02-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

720 μA

0.0391 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB11-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB11-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

10

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB11-E/UN

Microchip Technology

Digital to Analog converter

Automotive

Gull Wing

8

TSSOP

Square

Plastic/Epoxy

Yes

1

12

620 μA

0.0244 %

Serial

Small Outline, Thin Profile, Shrink Pitch

TSSOP8,.25

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-G8

0.043 in (1.1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB12-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

10

720 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB21-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

620 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB22-E/MF

Microchip Technology

Digital to Analog converter

Automotive

No Lead

10

HVSON

Square

Plastic/Epoxy

Yes

1

12

720 μA

0.0244 %

Serial

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC10,.12,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Dual

S-PDSO-N10

0.039 in (1 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

MCP47CVB22-E/MG

Microchip Technology

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

720 μA

0.0244 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

16 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N16

0.031 in (0.8 mm)

0.118 in (3 mm)

0.118 in (3 mm)

Binary

AD5675RBCPZ-RL

Analog Devices

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

5 V

Yes

1

16

0.0015258 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.16SQ,20

5 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Matte Tin

Quad

S-XQCC-N20

3

0.031 in (0.8 mm)

0.157 in (4 mm)

e3

30 s

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

ADV7123KSTZ140-RL

Analog Devices

Digital to Analog converter

Industrial

Gull Wing

48

LFQFP

Square

Plastic/Epoxy

1.4 V

Yes

1

CMOS

10

72 mA

0.0977 %

Parallel, Word

3.3 V

Flatpack, Low Profile, Fine Pitch

QFP48,.35SQ,20

0.02 in (0.5 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Quad

S-PQFP-G48

0.063 in (1.6 mm)

0.276 in (7 mm)

0 V

0.276 in (7 mm)

Binary

AD9166BBPZ

Analog Devices

Digital to Analog converter

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1

16

1.033 A

Parallel, Word

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.062 in (1.57 mm)

0.591 in (15 mm)

0.591 in (15 mm)

2's Complement

AD9166BBPZRL

Analog Devices

Digital to Analog converter

Industrial

Ball

324

LFBGA

Square

Plastic/Epoxy

Yes

1

16

1.033 A

Parallel, Word

1.2 V

Grid Array, Low Profile, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

85 °C (185 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

0.062 in (1.57 mm)

0.591 in (15 mm)

0.591 in (15 mm)

2's Complement

AD5673RBCPZ-1

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.02441 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5673RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.02441 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5677RBCPZ-1

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5677RBCPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5677RBCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5673RBCPZ-2-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.02441 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5677RBCPZ-2

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

16

8 µs

4.2 mA

0.006103 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

AD5673RBCPZ-1-RL7

Analog Devices

Digital to Analog converter

Automotive

No Lead

28

HVQCCN

Square

5 V

Yes

1

12

8 µs

4.2 mA

0.02441 %

Serial

3 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC28,.16SQ,16

6 µs

0.016 in (0.4 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-XQCC-N28

0.039 in (1 mm)

0.157 in (4 mm)

260 °C (500 °F)

0 V

0.157 in (4 mm)

Binary

DAC81001PFBR

Texas Instruments

Digital to Analog converter

Automotive

Gull Wing

48

TQFP

Square

Plastic/Epoxy

Yes

400 kHz

1

16

7 mA

0.0015258 %

Serial

5 V

Flatpack, Thin Profile

TQFP48,.35SQ

1 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

e4

30 s

260 °C (500 °F)

0.276 in (7 mm)

Binary

MCP47FVB28-E/MQ

Microchip Technology

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

Plastic/Epoxy

Yes

1

12

3 mA

0.146484375 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

7.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N20

0.039 in (1 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

MCP47FEB04-E/MQ

Microchip Technology

Digital to Analog converter

Automotive

No Lead

20

HVQCCN

Square

Plastic/Epoxy

Yes

1

8

2.5 mA

0.1953125 %

Serial

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC20,.20SQ,25

7.8 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Quad

S-PQCC-N20

0.039 in (1 mm)

0.197 in (5 mm)

0.197 in (5 mm)

Binary

BD34301EKV-E2

ROHM

Digital to Analog Converter 32 bit

Gull Wing

64

HVFQFP

Square

Plastic/Epoxy

Yes

1

32

45 mA

Serial

5 V

Flatpack, Heat Sink/Slug, Very Thin Profile, Fine Pitch

TQFP64,.47SQ

0.02 in (0.5 mm)

85 °C (185 °F)

-25 °C (-13 °F)

Quad

S-PQFP-G64

0.039 in (1 mm)

0.394 in (10 mm)

0.394 in (10 mm)

Binary

DAC43701DSGTQ1

Texas Instruments

Digital to Analog converter

Automotive

No Lead

8

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

AEC-Q100

8

800 μA

0.390625 %

Serial

1.8 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.08,20

8 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N8

2

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

DAC81404RHBT

Texas Instruments

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

20 V

Yes

1

16

8 mA

0.003051758 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

6 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Quad

S-PQCC-N32

2

0.039 in (1 mm)

0.197 in (5 mm)

e4

30 s

260 °C (500 °F)

-20 V

0.197 in (5 mm)

Binary

DAC81404RHBR

Texas Instruments

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

20 V

Yes

1

16

8 mA

0.003051758 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

6 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Quad

S-PQCC-N32

2

0.039 in (1 mm)

0.197 in (5 mm)

e4

30 s

260 °C (500 °F)

-20 V

0.197 in (5 mm)

Binary

DAC61402RHBR

Texas Instruments

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

20 V

Yes

1

12

8 mA

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

1.2 ms

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Quad

S-PQCC-N32

2

0.039 in (1 mm)

0.197 in (5 mm)

e4

30 s

260 °C (500 °F)

-20 V

0.197 in (5 mm)

Binary

DAC61402RHBT

Texas Instruments

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

20 V

Yes

1

12

8 mA

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC32,.2SQ,20

1.2 ms

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Quad

S-PQCC-N32

2

0.039 in (1 mm)

0.197 in (5 mm)

e4

30 s

260 °C (500 °F)

-20 V

0.197 in (5 mm)

Binary

DAC43701DSGT

Texas Instruments

Digital to Analog converter

Automotive

No Lead

8

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

8

550 μA

0.390625 %

Serial

1.8 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.08,20

12 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

DAC53701DSGT

Texas Instruments

Digital to Analog converter

Automotive

No Lead

8

HVSON

Square

Plastic/Epoxy

5.5 V

Yes

1

10

550 μA

0.097656 %

Serial

1.8 V

Small Outline, Heat Sink/Slug, Very Thin Profile

SOLCC8,.08,20

12 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Dual

S-PDSO-N8

1

0.031 in (0.8 mm)

0.079 in (2 mm)

e4

30 s

260 °C (500 °F)

0 V

0.079 in (2 mm)

Binary

AD9177BBPZRL

Analog Devices

Digital to Analog converter

Ball

324

HFBGA

Square

Plastic/Epoxy

Yes

4

16

301 mA

0.012207 %

Serial

2 V

Grid Array, Heat Sink/Slug, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

3

0.068 in (1.72 mm)

0.591 in (15 mm)

260 °C (500 °F)

0.591 in (15 mm)

Binary

AD9177BBPZ

Analog Devices

Digital to Analog converter

Ball

324

HFBGA

Square

Plastic/Epoxy

Yes

4

16

301 mA

0.012207 %

Serial

2 V

Grid Array, Heat Sink/Slug, Fine Pitch

BGA324,18X18,32

0.031 in (0.8 mm)

120 °C (248 °F)

-40 °C (-40 °F)

Bottom

S-PBGA-B324

3

0.068 in (1.72 mm)

0.591 in (15 mm)

30 s

260 °C (500 °F)

0.591 in (15 mm)

Binary

DAC53204RTET

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

250 kHz

1

10

200 μA

0.09765625 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC43204RTET

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

250 kHz

1

8

200 μA

0.390625 %

Serial

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

30 s

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC53004RTET

Texas Instruments

Digital to Analog converter

Automotive

No Lead

16

HVQCCN

Square

Plastic/Epoxy

5.5 V

Yes

250 kHz

1

10

0.09765625 %

Serial

1.8 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

LCC16,.12SQ,20

20 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold

Quad

S-PQCC-N16

1

0.031 in (0.8 mm)

0.118 in (3 mm)

e4

260 °C (500 °F)

0 V

0.118 in (3 mm)

Binary

DAC61404RHBT

Texas Instruments

Digital to Analog converter

Automotive

No Lead

32

HVQCCN

Square

Plastic/Epoxy

20 V

Yes

1

12

600 µs

8 mA

0.0244 %

Serial

5 V

Chip Carrier, Heat Sink/Slug, Very Thin Profile

6 µs

0.02 in (0.5 mm)

125 °C (257 °F)

-40 °C (-40 °F)

Nickel Palladium Gold Silver

Quad

S-PQCC-N32

2

0.039 in (1 mm)

0.197 in (5 mm)

e4

30 s

260 °C (500 °F)

-20 V

0.197 in (5 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.