| Part | RoHS | Manufacturer | Converter Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Maximum Analog Output Voltage | No. of Analog In Channels | Surface Mount | Maximum Supply Voltage | Maximum Analog Input Voltage | Sample Rate | No. of Functions | Technology | Screening Level | No. of Bits | Maximum Settling Time | Maximum Supply Current | Maximum Linearity Error (EL) | Input Format | Nominal Supply Voltage | Output Bit Code | Power Supplies (V) | Nominal Negative Supply Voltage | Package Style (Meter) | Package Equivalence Code | Sub-Category | Nominal Settling Time (tstl) | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Minimum Analog Input Voltage | Output Format | Minimum Operating Temperature | Terminal Finish | Sample and Hold/Track and Hold | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Minimum Analog Output Voltage | Length | Input Bit Code |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
Bipolar |
12 |
4 µs |
0.012 % |
±12/±15 V |
In-Line |
DIP24,.6 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Matte Tin |
Dual |
R-PDIP-T24 |
No |
e3 |
Complementary Binary, Complementary Offset Binary |
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|
|
Cirrus Logic |
Digital to Analog converter |
Commercial |
Gull Wing |
8 |
SOP |
Rectangular |
Plastic/Epoxy |
3.75 V |
Yes |
1 |
Bipolar |
24 |
19 mA |
Serial |
5 V |
5 V |
Small Outline |
SOP8,.25 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
-10 °C (14 °F) |
Matte Tin |
Dual |
R-PDSO-G8 |
2 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e3 |
260 °C (500 °F) |
-3.75 V |
0.193 in (4.9 mm) |
2's Complement Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Hybrid |
12 |
15 µs |
28 mA |
0.018 % |
Parallel, Word |
15 V |
±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T28 |
0.225 in (5.72 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-10 V |
Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
25 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15,-15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
1.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
1.2 in (30.48 mm) |
Binary Coded Decimal |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
25 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15,-15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
1.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
1.2 in (30.48 mm) |
Binary Coded Decimal |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
25 mA |
0.0122 % |
Parallel, Word |
5 V |
5/15,-15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
1.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
1.2 in (30.48 mm) |
Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
10 V |
No |
1 |
Bipolar |
12 |
25 mA |
0.0061 % |
Parallel, Word |
5 V |
5/15,-15 V |
-15 V |
In-Line |
DIP24,.6 |
Other Converters |
1.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T24 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
1.2 in (30.48 mm) |
Binary Coded Decimal |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
3 V |
No |
1 |
Bipolar |
12 |
170 mA |
0.0977 % |
Parallel, Word |
5 V |
-5.2 V |
-5.2 V |
In-Line |
DIP28,.6 |
Other Converters |
30 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-1.2 V |
1.472 in (37.4 mm) |
Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 V |
No |
1 |
12 |
5 µs |
12 mA |
0.018 % |
Parallel, Word |
12 V |
12/±15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
1.03 in (26.16 mm) |
Binary, Offset Binary |
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|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
12 |
5 µs |
12 mA |
0.018 % |
Parallel, Word |
12 V |
12/±15 V |
Small Outline |
SOP20,.4 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.504 in (12.8 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
10 V |
No |
1 |
12 |
5 µs |
12 mA |
0.024 % |
Parallel, Word |
12 V |
12/±15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
1.03 in (26.16 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
12 |
5 µs |
12 mA |
0.024 % |
Parallel, Word |
12 V |
12/±15 V |
Small Outline |
SOP20,.4 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
245 °C (473 °F) |
0 V |
0.504 in (12.8 mm) |
Binary, Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
5 V |
No |
1 |
CMOS |
12 |
10 µs |
12 mA |
0.0244 % |
Parallel, Word |
12 V |
12/15,GND/-12/-15 V |
-12 V |
In-Line |
DIP24,.3 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.19 in (4.82 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
1.227 in (31.165 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
5 V |
No |
1 |
CMOS |
12 |
10 µs |
12 mA |
0.0244 % |
Parallel, Word |
12 V |
12/15,GND/-12/-15 V |
-12 V |
In-Line |
DIP20,.3 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
0.3 in (7.62 mm) |
No |
e0 |
-5 V |
Binary |
|||||||||||||||||||
|
|
Texas Instruments |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
10 MHz |
1 |
CMOS |
8 |
0 ns |
2 mA |
0.3906 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Small Outline |
SOP20,.4 |
Other Converters |
100 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Nickel Palladium Gold |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e4 |
30 s |
260 °C (500 °F) |
-10 V |
0.504 in (12.8 mm) |
Binary, Offset Binary |
|||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
12 |
4 µs |
0.0122 % |
Parallel, Word |
15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
3 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.178 in (4.51 mm) |
0.453 in (11.506 mm) |
No |
e0 |
225 °C (437 °F) |
-10 V |
0.453 in (11.506 mm) |
Binary, Offset Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
10 V |
No |
1 |
12 |
4 µs |
0.02441 % |
Parallel, Word |
15 V |
-15 V |
In-Line |
DIP24,.3 |
3 µs |
0.1 in (2.53 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.13 in (3.3 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-10 V |
1.227 in (31.165 mm) |
Binary, Offset Binary |
|||||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCN |
Square |
Plastic/Epoxy |
10 V |
Yes |
1 |
12 |
4 µs |
0.02441 % |
Parallel, Word |
15 V |
-15 V |
Chip Carrier |
LCC28,.45SQ |
3 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.178 in (4.51 mm) |
0.453 in (11.506 mm) |
No |
e0 |
225 °C (437 °F) |
-10 V |
0.453 in (11.506 mm) |
Binary, Offset Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2.56 V |
No |
1 |
Bipolar |
8 |
3 µs |
25 mA |
0.0977 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.8 in (20.32 mm) |
Complementary Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Ceramic, Metal-Sealed Cofired |
2.56 V |
No |
1 |
Bipolar |
8 |
3 µs |
25 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-CDIP-T16 |
0.2 in (5.08 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.8 in (20.32 mm) |
Complementary Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
2.56 V |
No |
1 |
Bipolar |
8 |
3 µs |
25 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP16,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
0.793 in (20.13 mm) |
Complementary Offset Binary |
||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
2.56 V |
Yes |
1 |
Bipolar |
8 |
3 µs |
25 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.57 mm) |
0.353 in (8.966 mm) |
No |
e0 |
30 s |
225 °C (437 °F) |
0 V |
0.353 in (8.966 mm) |
Complementary Offset Binary |
|||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
13 V |
No |
4 |
BICMOS |
12 |
10 µs |
19 mA |
0.0183 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-13 V |
1.472 in (37.4 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
13 V |
No |
4 |
BICMOS |
12 |
10 µs |
19 mA |
0.0244 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
-13 V |
1.472 in (37.4 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
13 V |
No |
4 |
BICMOS |
12 |
10 µs |
19 mA |
0.0183 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
1.472 in (37.4 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
28 |
DIP |
Rectangular |
Plastic/Epoxy |
13 V |
No |
4 |
BICMOS |
12 |
10 µs |
19 mA |
0.0244 % |
Parallel, Word |
15 V |
5,±12/±15 V |
-15 V |
In-Line |
DIP28,.6 |
Other Converters |
10 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T28 |
0.25 in (6.35 mm) |
0.6 in (15.24 mm) |
No |
e0 |
0 V |
1.472 in (37.4 mm) |
Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
2.56 V |
No |
1 |
Bipolar |
8 |
2 µs |
25 mA |
0.3906 % |
Parallel, 8 Bits |
5 V |
5 V |
In-Line |
DIP16,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
0.215 in (5.46 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0 V |
Complementary Offset Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
20 |
QCCJ |
Square |
Plastic/Epoxy |
2.56 V |
Yes |
1 |
Bipolar |
8 |
2 µs |
25 mA |
0.3906 % |
Parallel, 8 Bits |
5 V |
5 V |
Chip Carrier |
LDCC20,.4SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J20 |
1 |
0.18 in (4.565 mm) |
0.353 in (8.966 mm) |
No |
e0 |
225 °C (437 °F) |
0 V |
0.353 in (8.966 mm) |
Complementary Offset Binary |
||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
3 V |
Yes |
1 |
BICMOS |
14 |
4 µs |
14 mA |
0.0061 % |
Serial, Parallel, Word |
5 V |
±5 V |
-5 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
2.5 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
225 °C (437 °F) |
-3 V |
0.453 in (11.5062 mm) |
2's Complement Binary |
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|
Analog Devices |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
3 V |
No |
1 |
BICMOS |
14 |
4 µs |
14 mA |
0.0122 % |
Serial, Parallel, Word |
5 V |
±5 V |
-5 V |
In-Line |
DIP24,.3 |
Other Converters |
2.5 µs |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
0.21 in (5.33 mm) |
0.3 in (7.62 mm) |
No |
e0 |
-3 V |
1.2 in (30.48 mm) |
2's Complement Binary |
|||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
BICMOS |
14 |
2 µs |
4 mA |
0.012 % |
Parallel, Word |
12/15,-0.3 V |
Small Outline |
SOP24,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
BICMOS |
14 |
2 µs |
4 mA |
0.006 % |
Parallel, Word |
12/15,-0.3 V |
Small Outline |
SOP24,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
240 °C (464 °F) |
0.606 in (15.4 mm) |
Binary |
|||||||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
Gull Wing |
28 |
SOP |
Rectangular |
Plastic/Epoxy |
10 V |
Yes |
1 |
Bipolar |
12 |
350 ns |
18 mA |
0.0122 % |
Parallel, Word |
15 V |
-15 V |
-15 V |
Small Outline |
SOP28,.4 |
Other Converters |
250 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin/Lead (Sn85Pb15) |
Dual |
R-PDSO-G28 |
3 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
30 s |
240 °C (464 °F) |
-1.5 V |
0.705 in (17.9 mm) |
Binary, Offset Binary |
||||||||||||||
|
Analog Devices |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
5 V |
Yes |
4 |
BICMOS |
12 |
4 µs |
30 mA |
0.0183 % |
Parallel, 8 Bits |
12 V |
±12 V |
-12 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
2 µs |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.5062 mm) |
No |
e0 |
225 °C (437 °F) |
-5 V |
0.453 in (11.5062 mm) |
Binary |
|||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
20 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
12 |
1 µs |
3 mA |
0.0122 % |
Parallel, 8 Bits |
5 V |
5/15 V |
In-Line |
DIP20,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T20 |
1 |
0.155 in (3.93 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.05 in (26.67 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
20 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
12 |
1 µs |
3 mA |
0.0244 % |
Parallel, 8 Bits |
5 V |
5/15 V |
Small Outline |
SOP20,.4 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G20 |
1 |
0.104 in (2.642 mm) |
0.302 in (7.67 mm) |
No |
e0 |
0.512 in (13.005 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
In-Line |
DIP24,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
20 s |
240 °C (464 °F) |
1.203 in (30.545 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
245 °C (473 °F) |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15 V |
Small Outline |
SOP24,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
In-Line |
DIP24,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.203 in (30.545 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
In-Line |
DIP24,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
1.203 in (30.545 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Small Outline |
SOP24,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
24 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Small Outline |
SOP24,.4 |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G24 |
1 |
0.104 in (2.65 mm) |
0.295 in (7.5 mm) |
No |
e0 |
0.606 in (15.4 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0122 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
24 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15 V |
In-Line |
DIP24,.3 |
Other Converters |
800 ns |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T24 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
245 °C (473 °F) |
1.203 in (30.545 mm) |
Binary, Offset Binary, 2's Complement Binary |
||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
J Bend |
28 |
QCCJ |
Square |
Plastic/Epoxy |
Yes |
2 |
CMOS |
12 |
1.5 µs |
2 mA |
0.0244 % |
Parallel, Word |
15 V |
12/15 V |
Chip Carrier |
LDCC28,.5SQ |
Other Converters |
800 ns |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Quad |
S-PQCC-J28 |
1 |
0.18 in (4.57 mm) |
0.453 in (11.505 mm) |
No |
e0 |
0.453 in (11.505 mm) |
Binary, Offset Binary, 2's Complement Binary |
|||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Through-Hole |
16 |
DIP |
Rectangular |
Plastic/Epoxy |
No |
1 |
CMOS |
8 |
350 ns |
2.5 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
12/15 V |
In-Line |
DIP16,.3 |
Other Converters |
0.1 in (2.54 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDIP-T16 |
1 |
0.18 in (4.572 mm) |
0.3 in (7.62 mm) |
No |
e0 |
0.755 in (19.175 mm) |
Binary, Offset Binary |
||||||||||||||||||||
|
Maxim Integrated |
Digital to Analog converter |
Commercial |
Gull Wing |
16 |
SOP |
Rectangular |
Plastic/Epoxy |
Yes |
1 |
CMOS |
8 |
350 ns |
2.5 mA |
0.1953 % |
Parallel, 8 Bits |
5 V |
12/15 V |
Small Outline |
SOP16,.25 |
Other Converters |
0.05 in (1.27 mm) |
70 °C (158 °F) |
0 °C (32 °F) |
Tin Lead |
Dual |
R-PDSO-G16 |
1 |
0.069 in (1.75 mm) |
0.154 in (3.9 mm) |
No |
e0 |
0.39 in (9.9 mm) |
Binary, Offset Binary |
Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.
DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.
DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.
DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.