Military Digital-to-Analog Converters 146

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Part RoHS Manufacturer Converter Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Maximum Analog Output Voltage No. of Analog In Channels Surface Mount Maximum Supply Voltage Maximum Analog Input Voltage Sample Rate No. of Functions Technology Screening Level No. of Bits Maximum Settling Time Maximum Supply Current Maximum Linearity Error (EL) Input Format Nominal Supply Voltage Output Bit Code Power Supplies (V) Nominal Negative Supply Voltage Package Style (Meter) Package Equivalence Code Sub-Category Nominal Settling Time (tstl) Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Minimum Analog Input Voltage Output Format Minimum Operating Temperature Terminal Finish Sample and Hold/Track and Hold Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Width Qualification Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Minimum Analog Output Voltage Length Input Bit Code

DAC8412BT/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

MIL-STD-883

12

12 mA

0.0366 %

Parallel, Word

5 V

5/±15 V

-5 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

DAC8412BTC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

MIL-STD-883

12

12 mA

0.0366 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

DAC8413AT/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

MIL-STD-883

12

12 mA

0.0183 %

Parallel, Word

5 V

5/±15 V

-5 V

In-Line

LDCC28,.5SQ

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

DAC8413BT/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

BICMOS

MIL-STD-883

12

12 mA

0.0366 %

Parallel, Word

5 V

5/±15 V

-5 V

In-Line

LDCC28,.5SQ

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T28

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

Binary

DAC8413BTC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BICMOS

MIL-STD-883

12

12 mA

0.0366 %

Parallel, Word

5 V

5/±15 V

-5 V

Chip Carrier

LCC28,.45SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

0.45 in (11.43 mm)

Binary

DAC8426AR/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

4

CMOS

38535Q/M;38534H;883B

8

14 mA

0.1953 %

Parallel, 8 Bits

15 V

15 V

In-Line

DIP20,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

DAC8800BR/883C

Analog Devices

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

2.5 V

No

8

CMOS

MIL-STD-883 Class C

8

2 mA

0.1953 %

Serial

12 V

12,GND/-5 V

-5 V

In-Line

DIP20,.3

Other Converters

800 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

-2.5 V

Binary

AD569SE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

5 V

Yes

1

BIMOS

MIL-STD-883 Class B

16

6 µs

26 mA

0.04 %

Parallel, Word

12 V

±12 V

-12 V

Chip Carrier

LCC28,.45SQ

Other Converters

4 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

-5 V

0.45 in (11.43 mm)

Binary

DAC8408BTC/883C

Analog Devices

Digital to Analog converter

Military

No Lead

28

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

CMOS

MIL-STD-883

8

0.1953 %

Parallel, 8 Bits

5 V

Chip Carrier

190 ns

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N28

0.1 in (2.54 mm)

0.45 in (11.43 mm)

No

e0

0.45 in (11.43 mm)

Binary, Offset Binary

JM38510/12103BJA

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Bipolar

12

Parallel, Word

15 V

-15 V

In-Line

250 ns

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

AD664SD-BIP/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

BIMOS

MIL-STD-883 Class B

12

10 µs

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

-10 V

1.41 in (35.815 mm)

Binary

AD664SD-UNI/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

BIMOS

MIL-STD-883 Class B

12

10 µs

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

0 V

1.41 in (35.815 mm)

Binary

AD664TD-UNI/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

28

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

4

BIMOS

MIL-STD-883 Class B

12

10 µs

0.0183 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

In-Line

DIP28,.6

Other Converters

10 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T28

0.165 in (4.191 mm)

0.6 in (15.24 mm)

No

e0

0 V

1.41 in (35.815 mm)

Binary

AD664TE/883B

Analog Devices

Digital to Analog converter

Military

No Lead

44

QCCN

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BIMOS

MIL-STD-883 Class B

12

10 µs

0.0183 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

Chip Carrier

LCC44,.65SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-N44

0.1 in (2.54 mm)

0.651 in (16.545 mm)

No

e0

0.651 in (16.545 mm)

Binary

AD664TJ/883B

Analog Devices

Digital to Analog converter

Military

J Bend

44

QCCJ

Square

Ceramic, Metal-Sealed Cofired

Yes

4

BIMOS

MIL-STD-883 Class B

12

10 µs

19 mA

0.0244 %

Parallel, Word

15 V

5,±12/±15 V

-15 V

Chip Carrier

LDCC44,.7SQ

Other Converters

10 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Quad

S-CQCC-J44

0.135 in (3.43 mm)

0.645 in (16.385 mm)

No

e0

0.645 in (16.385 mm)

Binary

DAC5662MPFBEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

200 MHz

1

12

90 mA

0.0488 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Binary, 2's Complement Binary

DAC5652MPFBEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

275 MHz

1

CMOS

10

90 mA

0.0977 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary

DAC5672MPFBEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

200 MHz

1

CMOS

14

90 mA

0.0305 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

DAC5675MPHPEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

3.9 V

Yes

400 MHz

1

CMOS

14

0.0281 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

12 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

260 °C (500 °F)

2.15 V

0.276 in (7 mm)

Binary

V62/06638-02XE

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

275 MHz

1

CMOS

10

90 mA

0.0977 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary

TLV5618AMDREPG4

Texas Instruments

Digital to Analog converter

Military

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.1 V

Yes

93 kHz

1

CMOS

12

10 µs

2.3 mA

0.0977 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Dual

R-PDSO-G8

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

ADDAC87CBI-I/883B

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic

10 V

No

1

Bipolar

MIL-STD-883

12

0.0122 %

Parallel, Word

15 V

±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-XDIP-T24

No

e0

-10 V

Binary

ADDAC87-CBII883

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

Hybrid

MIL-STD-883

12

30 mA

0.0183 %

Parallel, Word

15 V

5,±15 V

-15 V

In-Line

DIP24,.6

Other Converters

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

e0

-10 V

Binary

TLV5618AMFKB

Texas Instruments

Digital to Analog converter

Military

No Lead

20

QCCN

Square

Ceramic, Metal-Sealed Cofired

2.9 V

Yes

93 kHz

1

CMOS

38535Q/M;38534H;883B

12

10 µs

2.3 mA

0.0977 %

Serial

3 V

3/5 V

Chip Carrier

LCC20,.35SQ

Other Converters

3 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Quad

S-CQCC-N20

0.08 in (2.03 mm)

0.35 in (8.89 mm)

No

0 V

0.35 in (8.89 mm)

Binary

TLV5618AMJGB

Texas Instruments

Digital to Analog converter

Military

Through-Hole

8

DIP

Rectangular

Ceramic, Glass-Sealed

2.9 V

No

93 kHz

1

CMOS

38535Q/M;38534H;883B

12

10 µs

2.3 mA

0.0977 %

Serial

3 V

3/5 V

In-Line

DIP8,.3

Other Converters

3 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin/Lead

Dual

R-GDIP-T8

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

0 V

0.377 in (9.58 mm)

Binary

HDS-1250ATM

Analog Devices

Digital to Analog converter

Military

Pin/Peg

24

Rectangular

Metal

.512 V

No

1

12

0.0125 %

Parallel, Word

Microelectronic Assembly

125 °C (257 °F)

-55 °C (-67 °F)

Gold

Dual

R-MDMA-P24

No

e4

-.512 V

Binary, Offset Binary

MX7543SQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

16

DIP

Rectangular

Ceramic, Glass-Sealed

No

1

CMOS

MIL-STD-883 Class B

12

0.0244 %

Serial

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T16

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary, Offset Binary

MX7528SQ/883B

Maxim Integrated

Digital to Analog converter

Military

Through-Hole

20

DIP

Rectangular

Ceramic, Glass-Sealed

No

2

CMOS

MIL-STD-883 Class B

8

0.3906 %

Parallel, 8 Bits

5 V

In-Line

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Tin Lead

Dual

R-GDIP-T20

1

0.2 in (5.08 mm)

0.3 in (7.62 mm)

No

e0

Binary

ADDAC87D-CBI-V/883

Analog Devices

Digital to Analog converter

Military

Through-Hole

24

DIP

Rectangular

Ceramic, Metal-Sealed Cofired

10 V

No

1

MIL-STD-883

12

0.0122 %

Parallel, Word

15 V

-15 V

In-Line

5 µs

0.1 in (2.54 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDIP-T24

0.225 in (5.72 mm)

0.6 in (15.24 mm)

No

-10 V

Binary

DAC5675MPHPREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

HTFQFP

Square

Plastic/Epoxy

3.9 V

Yes

400 MHz

1

CMOS

14

0.0281 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

12 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQFP-G48

3

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

260 °C (500 °F)

2.15 V

0.276 in (7 mm)

Binary

DAC5652MPFBREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

275 MHz

1

CMOS

10

90 mA

0.0977 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary

DAC5662MPFBREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

200 MHz

1

CMOS

12

90 mA

0.0488 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Binary, 2's Complement Binary

DAC5672MPFBREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

48

TFQFP

Square

Plastic/Epoxy

1.25 V

Yes

200 MHz

1

CMOS

14

90 mA

0.0305 %

Parallel, Word

3.3 V

3.3 V

Flatpack, Thin Profile, Fine Pitch

TQFP48,.35SQ

Other Converters

20 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Quad

S-PQFP-G48

2

0.047 in (1.2 mm)

0.276 in (7 mm)

No

e4

30 s

260 °C (500 °F)

-.8 V

0.276 in (7 mm)

Offset Binary, 2's Complement Binary

DAC5687MPZPEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

100

HTFQFP

Square

Plastic/Epoxy

4.1 V

Yes

500 MHz

1

CMOS

16

0.0061 %

Parallel, Word

3.3 V

1.8,3.3 V

Flatpack, Heat Sink/Slug, Thin Profile, Fine Pitch

TQFP100,.63SQ

Other Converters

10.4 ns

0.02 in (0.5 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel/Palladium/Gold (Ni/Pd/Au)

Quad

S-PQFP-G100

3

0.047 in (1.2 mm)

0.551 in (14 mm)

No

e4

260 °C (500 °F)

2.5 V

0.551 in (14 mm)

Offset Binary, 2's Complement Binary

DAC8830MCDEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1 MHz

1

16

1 µs

20 μA

0.0023 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

DAC8830MCDREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

8

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1 MHz

1

16

1 µs

20 μA

0.0023 %

Serial

3 V

3/5 V

Small Outline

SOP8,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G8

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

0 V

0.193 in (4.9 mm)

Binary

DAC8831MCDEP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2 MHz

1

16

1 µs

20 μA

0.0023 %

Serial

3 V

3/5 V

Small Outline

SOP14,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G14

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

-5.5 V

0.341 in (8.65 mm)

Binary

DAC8831MCDREP

Texas Instruments

Digital to Analog converter

Military

Gull Wing

14

SOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

2 MHz

1

16

1 µs

20 μA

0.0023 %

Serial

3 V

3/5 V

Small Outline

SOP14,.25

Other Converters

1 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G14

3

0.069 in (1.75 mm)

0.154 in (3.9 mm)

No

e4

30 s

260 °C (500 °F)

-5.5 V

0.341 in (8.65 mm)

Binary

AD5668SRU-EP-1

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

0.032 %

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

0 V

0.197 in (5 mm)

Binary

DAC121S101MDR

Texas Instruments

Digital to Analog converter

Military

No Lead

DIE

100k Rad(Si)

5.5 V

Yes

1.8 MHz

1

CMOS

12

0.1953 %

Serial

3 V

Uncased Chip

12.5 µs

125 °C (257 °F)

-55 °C (-67 °F)

Upper

X-XUUC-N

1

0 V

Binary

RH-DAC1612K1

STMicroelectronics

Digital to Analog converter

Military

Flat

24

DFP

Rectangular

100k Rad(Si)

Ceramic, Metal-Sealed Cofired

Yes

1

16

0.0069 %

Serial

3.3 V

Flatpack

800 µs

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-CDFP-F24

0.109 in (2.77 mm)

0.38 in (9.65 mm)

0.61 in (15.49 mm)

Binary, 2's Complement Binary

AD5761RTRUZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0122 %

Serial

11 V

-11 V

Small Outline, Thin Profile, Shrink Pitch

9 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

-10 V

0.197 in (5 mm)

Binary, 2's Complement Binary

AD5761RTRUZ-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

10 V

Yes

1

16

0.0122 %

Serial

11 V

-11 V

Small Outline, Thin Profile, Shrink Pitch

9 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

0.047 in (1.2 mm)

0.173 in (4.4 mm)

-10 V

0.197 in (5 mm)

Binary, 2's Complement Binary

AD5668SRUZ-EP-1RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5668SRUZ-EP-1

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

TSSOP

Rectangular

Plastic/Epoxy

5.5 V

Yes

1

16

Serial

5 V

Small Outline, Thin Profile, Shrink Pitch

6 µs

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G16

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

0 V

0.197 in (5 mm)

Binary

AD5781SRUZ-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

18

0.0004 %

Serial

15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G20

0.047 in (1.2 mm)

0.173 in (4.4 mm)

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

Binary, 2's Complement Binary

AD5791SRUZ-EP

Analog Devices

Digital to Analog converter

Military

Gull Wing

20

TSSOP

Rectangular

Plastic/Epoxy

Yes

1

20

0.0003 %

Serial

15 V

-15 V

Small Outline, Thin Profile, Shrink Pitch

0.026 in (0.65 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Nickel Palladium Gold

Dual

R-PDSO-G20

1

0.047 in (1.2 mm)

0.173 in (4.4 mm)

e4

30 s

260 °C (500 °F)

0.256 in (6.5 mm)

Binary, 2's Complement Binary

AD7524SRZ-EP-RL7

Analog Devices

Digital to Analog converter

Military

Gull Wing

16

SOP

Rectangular

Plastic/Epoxy

Yes

1

CMOS

8

0.1953 %

Parallel, Word

5 V

Small Outline

0.05 in (1.27 mm)

125 °C (257 °F)

-55 °C (-67 °F)

Dual

R-PDSO-G16

1

0.069 in (1.75 mm)

0.154 in (3.9 mm)

30 s

260 °C (500 °F)

0.39 in (9.9 mm)

Binary

Digital-to-Analog Converters

Digital-to-analog converters (DACs) are electronic devices that convert digital signals into analog signals with a specific voltage or current output. They play a critical role in many electronic systems, converting digital data into analog signals that can be used to control actuators, motors, and other devices.

DACs work by sampling the digital signal at regular intervals and converting each sample into an analog signal with a specific voltage or current output. The accuracy and resolution of the DAC determine the quality of the analog signal, with higher resolution and accuracy leading to a more precise output signal.

DACs can be classified based on their architecture and their application. The most common types of DACs are binary-weighted DACs, R-2R ladder DACs, and sigma-delta DACs. Each type has its advantages and limitations, depending on the application and the required performance.

DACs are used in a wide range of applications, from audio equipment and video systems, to industrial automation, medical devices, and scientific instruments. They play a crucial role in the conversion of digital data into analog signals, allowing the control and manipulation of physical systems based on digital signals.