BOTTOM PIN Diodes 13

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Part RoHS Manufacturer Diode Type Terminal Position Terminal Form No. of Terminals Surface Mount Package Shape Package Body Material Diode Resistive Test Current Config Frequency Band Maximum Forward Voltage (VF) Maximum Diode Capacitance Technology Maximum Reverse Current No. of Elements Reverse Test Voltage Package Style (Meter) Sub-Category Maximum Repetitive Peak Reverse Voltage Maximum Operating Temperature Application Minimum Operating Temperature Terminal Finish JESD-30 Code Maximum Diode Forward Resistance Moisture Sensitivity Level (MSL) Case Connection Qualification Maximum Power Dissipation Nominal Diode Capacitance Additional Features Nominal Minority Carrier Lifetime JEDEC-95 Code Minimum Breakdown Voltage Maximum Non Repetitive Peak Forward Current JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Diode Element Material Diode Resistive Test Frequency Reference Standard

BAR8802LRHE6327XTSA1

Infineon Technologies

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

UNSPECIFIED

SINGLE

L BAND

.4 pF

POSITIVE-INTRINSIC-NEGATIVE

1

CHIP CARRIER

150 Cel

SWITCHING

GOLD

R-XBCC-N2

2.5 ohm

1

.25 W

LOW DISTORTION

.5 us

80 V

e4

SILICON

BAR9002LRHE6327XTSA1

Infineon Technologies

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

UNSPECIFIED

SINGLE

L BAND

.35 pF

POSITIVE-INTRINSIC-NEGATIVE

1

CHIP CARRIER

150 Cel

SWITCHING

R-XBCC-N2

2.3 ohm

.25 W

.75 us

80 V

NOT SPECIFIED

NOT SPECIFIED

SILICON

BAR9002LSE6327XTSA1

Infineon Technologies

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

UNSPECIFIED

SINGLE

L BAND

.35 pF

POSITIVE-INTRINSIC-NEGATIVE

1

CHIP CARRIER

150 Cel

SWITCHING

R-XBCC-N2

2.3 ohm

.15 W

.75 us

80 V

SILICON

BAP63LX,315

NXP Semiconductors

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

PLASTIC/EPOXY

.5 mA

SINGLE

S BAND

.3 pF

POSITIVE-INTRINSIC-NEGATIVE

1

0 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

-65 Cel

TIN

R-PBCC-N2

1.5 ohm

Not Qualified

.135 W

.34 pF

.32 us

50 V

e3

SILICON

100 MHz

BAP55L,315

NXP Semiconductors

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

PLASTIC/EPOXY

SINGLE

S BAND

.28 pF

POSITIVE-INTRINSIC-NEGATIVE

1

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-PBCC-N2

.7 ohm

Not Qualified

.5 W

.28 us

e3

SILICON

BAP51L,315

NXP Semiconductors

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

PLASTIC/EPOXY

SINGLE

S BAND

.4 pF

POSITIVE-INTRINSIC-NEGATIVE

1

CHIP CARRIER

ATTENUATOR; SWITCHING

TIN

R-PBCC-N2

1.5 ohm

Not Qualified

.5 W

.55 us

60 V

e3

SILICON

BAP142LX,315

NXP Semiconductors

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

PLASTIC/EPOXY

.5 mA

SINGLE

S BAND

.26 pF

POSITIVE-INTRINSIC-NEGATIVE

1

0 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

-65 Cel

Tin (Sn)

R-PBCC-N2

1.3 ohm

1

Not Qualified

.13 W

.25 pF

.11 us

50 V

e3

30

260

SILICON

100 MHz

BAP1321LX,315

NXP Semiconductors

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

PLASTIC/EPOXY

.5 mA

SINGLE

S BAND

.38 pF

POSITIVE-INTRINSIC-NEGATIVE

1

0 V

CHIP CARRIER

PIN Diodes

150 Cel

ATTENUATOR; SWITCHING

-65 Cel

R-PBCC-N2

1.3 ohm

Not Qualified

.13 W

.32 pF

.48 us

60 V

SILICON

100 MHz

SMP1345-518

Skyworks Solutions

PIN DIODE

BOTTOM

BUTT

4

YES

RECTANGULAR

PLASTIC/EPOXY

RING, 4 ELEMENTS

C BAND

.2 pF

POSITIVE-INTRINSIC-NEGATIVE

4

GRID ARRAY

ATTENUATOR; SWITCHING

R-PBGA-B4

2 ohm

1

ISOLATED

Not Qualified

.25 W

.1 us

30

260

SILICON

MPN3404G

Onsemi

PIN DIODE

BOTTOM

THROUGH-HOLE

2

NO

ROUND

PLASTIC/EPOXY

10 mA

SINGLE

VERY HIGH FREQUENCY

2 pF

POSITIVE-INTRINSIC-NEGATIVE

1

15 V

CYLINDRICAL

PIN Diodes

125 Cel

SWITCHING

TIN SILVER COPPER

O-PBCY-T2

.85 ohm

Not Qualified

.4 W

1.3 pF

HIGH VOLTAGE

TO-92

20 V

e1

260

SILICON

MPN3700G

Onsemi

PIN DIODE

BOTTOM

THROUGH-HOLE

2

NO

ROUND

PLASTIC/EPOXY

10 mA

SINGLE

VERY HIGH FREQUENCY

1 pF

POSITIVE-INTRINSIC-NEGATIVE

1

20 V

CYLINDRICAL

PIN Diodes

125 Cel

SWITCHING

TIN SILVER COPPER

O-PBCY-T2

1 ohm

Not Qualified

.28 W

1 pF

HIGH VOLTAGE

TO-92

200 V

e1

260

SILICON

MADP-030025-13140P

M/a-com Technology Solutions

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

GLASS

SINGLE

.56 pF

POSITIVE-INTRINSIC-NEGATIVE

1

CHIP CARRIER

175 Cel

SWITCHING

R-LBCC-N2

.65 ohm

ISOLATED

Not Qualified

2.8 us

NOT SPECIFIED

NOT SPECIFIED

SILICON

MPL4700-206/TR

Microchip Technology

PIN DIODE

BOTTOM

NO LEAD

2

YES

RECTANGULAR

UNSPECIFIED

10 mA

SINGLE

X BAND

.15 pF

POSITIVE-INTRINSIC-NEGATIVE

1

CHIP CARRIER

150 Cel

-55 Cel

R-XBCC-N2

2 ohm

25 V

SILICON

PIN Diodes

PIN diodes are electronic components that are used in microwave and radio frequency applications as switches or attenuators. They are named after their structure, which consists of a P-type layer, an intrinsic layer, and an N-type layer.

PIN diodes operate based on the properties of their intrinsic layer, which has a low doping density, making it highly resistive. When a forward-bias voltage is applied to the diode, the intrinsic layer becomes less resistive, allowing current to flow through the diode. When a reverse-bias voltage is applied to the diode, the intrinsic layer becomes highly resistive, acting as an open switch or attenuator for microwave and radio frequency signals.

PIN diodes offer several advantages over other types of switches and attenuators, such as low insertion loss, high isolation, and fast switching speed. They can be used in various applications, such as radio frequency amplifiers, attenuators, switches, and phase shifters.

PIN diodes come in different package sizes and configurations, depending on the application and the required performance. They can be integrated into a circuit board or mounted in a separate enclosure, depending on the application and the space available.