BALL Other Function Interface ICs 55

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Part RoHS Manufacturer Interface IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Display Mode Surface Mount Maximum Supply Voltage Maximum Output Current No. of Functions No. of Channels Technology Screening Level No. of Bits Built-in Protections Interface Standard Maximum Supply Current No. of Digits/Characters Output Latch/Register Nominal Supply Voltage Maximum Supply Voltage-1 Turn-on Time Power Supplies (V) Nominal Negative Supply Voltage Maximum Delay Package Style (Meter) Package Equivalence Code No. of Segments Minimum Supply Voltage-1 No. of Backplanes Sub-Category Minimum Supply Voltage Terminal Pitch Maximum Operating Temperature Nominal Supply Voltage-1 Output Characteristics Minimum Operating Temperature Driver No. of Bits Terminal Finish Terminal Position JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Seated Height Nominal Output Peak Current Limit Width Turn-off Time Qualification Output Polarity Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Maximum Receive Delay

MAX3374EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

MAX3376EEBL

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

FBGA

SQUARE

PLASTIC/EPOXY

YES

BICMOS

1.8/5

GRID ARRAY, FINE PITCH

BGA8,3X3,20

Other Interface ICs

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B8

1

Not Qualified

e0

IP4853CX24/P,135

NXP Semiconductors

OTHER

BALL

24

FBGA

SQUARE

PLASTIC/EPOXY

YES

1.8 V

1.8

GRID ARRAY, FINE PITCH

BGA24,5X5,16

Other Interface ICs

.4 mm

85 Cel

-30 Cel

BOTTOM

S-PBGA-B24

Not Qualified

NTS0104UK-Q100Z

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.8/3.3,2.5/5

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

NTB0104UK-Q100Z

NXP Semiconductors

INTERFACE CIRCUIT

AUTOMOTIVE

BALL

12

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

AEC-Q100

1.2/3.6,1.8/5

GRID ARRAY, FINE PITCH

BGA12,3X4,16

Other Interface ICs

.4 mm

125 Cel

-40 Cel

BOTTOM

R-PBGA-B12

Not Qualified

NLSX0102FCT1G

Onsemi

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

2

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.5 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B8

1

.5 mm

.9 mm

e1

30

260

1.9 mm

TX517IZCQ

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

144

BGA

SQUARE

PLASTIC/EPOXY

YES

5.25 V

1

2.5 V

5.25 V

+-5,2.5

-5 V

GRID ARRAY

BGA144(UNSPEC)

4.75 V

Other Interface ICs

2.38 V

85 Cel

5 V

0 Cel

BOTTOM

S-PBGA-B144

3

13 mm

Not Qualified

30

260

13 mm

LM8335TLE/NOPB

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

.5 mm

85 Cel

0 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B16

1

.675 mm

1.96 mm

e1

30

260

1.96 mm

DRV2604YZFT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

5.5 V

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.5 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-XBGA-B9

1

.625 mm

1.44 mm

e1

30

260

1.44 mm

HPA02270YZPR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

8

VFBGA

RECTANGULAR

UNSPECIFIED

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.65 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-XBGA-B8

1

.5 mm

.888 mm

ALSO REQUIRED VCCB = 2.3V TO 5.5V SUPPLY

e1

30

260

1.888 mm

DRV2604LYZFR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

5.2 V

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2 V

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B9

1

.625 mm

1.44 mm

e1

30

260

1.44 mm

DRV2604LYZFT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

9

VFBGA

SQUARE

UNSPECIFIED

YES

5.2 V

1

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2 V

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B9

1

.625 mm

1.44 mm

e1

30

260

1.44 mm

LC898119XC-MH

Onsemi

INTERFACE CIRCUIT

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.6 V

2.6 V

.4 mm

TIN SILVER COPPER

BOTTOM

S-PBGA-B25

1

.675 mm

2 mm

e1

30

260

2 mm

IP4855CX25/P,135

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

4 V

3/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA25,5X5,16

Level Translators

2.5 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

Not Qualified

2.04 mm

NVT4556AUKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.55 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B12

.412 mm

1.205 mm

NOT SPECIFIED

NOT SPECIFIED

1.605 mm

ADG3308BCBZ-1-REEL

Analog Devices

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

1.8 V

5.5 V

1.2/5,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

1.65 V

Other Interface ICs

1.15 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.65 mm

2 mm

Not Qualified

e1

30

260

2.5 mm

MAX13005EEBE-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

16

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

6

BICMOS

1.65 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA16,4X4,20

Other Interface ICs

1.5 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

S-PBGA-B16

1

.67 mm

2.02 mm

Not Qualified

e0

245

2.02 mm

TXS0104EZXUR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

4

.01 mA

1.8 V

5.5 V

1.8/3.3,2.5/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

2.3 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

3.3 V

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.61 mm

2 mm

Not Qualified

e1

30

260

2.5 mm

ST6G3237TBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

ST6G3238ETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

UNSPECIFIED

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

S-XBGA-B25

3

1.16 mm

3 mm

Not Qualified

e1

30

260

3 mm

MAX3005EBP

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

UNSPECIFIED

YES

5.5 V

8

BICMOS

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

-40 Cel

TIN LEAD

BOTTOM

R-XBGA-B20

1

.67 mm

Not Qualified

e0

ST6G3238BETBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

NICKEL GOLD

BOTTOM

S-PBGA-B25

3

1.16 mm

3 mm

Not Qualified

e4

30

260

3 mm

TXS0108EZXYR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

8

.008 mA

2.5 V

1.2/3.6,1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA20,4X5,20

Other Interface ICs

1.2 V

.5 mm

85 Cel

3-STATE

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B20

1

.61 mm

2.5 mm

Not Qualified

ALSO OPERATES WITH 1.65 TO 5.5 VOLT

e1

30

260

3 mm

ST6G3237BTBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1.16 mm

3 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3 mm

ST1G3234BBJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

5

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

1.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA5,3X3,17/10

Other Interface ICs

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B5

.714 mm

1.02 mm

Not Qualified

1.36 mm

ST6G3240TBR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

36

TFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

GRID ARRAY, THIN PROFILE, FINE PITCH

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B36

1.16 mm

3.6 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

3.6 mm

MAX3378EEBC-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

4

BICMOS

3.3 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.65 V

Other Interface ICs

1.2 V

.5 mm

85 Cel

3.3 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B12

1

.67 mm

1.54 mm

Not Qualified

USED FOR SPI, MICROWIRE AND I2C LEVEL TRANSLATION

e0

2.02 mm

MAX13013EBT-T

Maxim Integrated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

6

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

BICMOS

2.5 V

3.2 V

1.8/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA6,2X3,20

1.2 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

1.8 V

-40 Cel

TIN LEAD

BOTTOM

R-PBGA-B6

1

.67 mm

1.75 mm

Not Qualified

e0

245

1.98 mm

ADG3304BCBZ-REEL

Analog Devices

INTERFACE CIRCUIT

OTHER

BALL

12

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

5.5 V

1

CMOS

1.8 V

5.5 V

1.8/5

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA12,3X4,20

1.15 V

Other Interface ICs

1.65 V

.5 mm

85 Cel

-25 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B12

1

.65 mm

1.61 mm

Not Qualified

e1

260

2.01 mm

ST1G3234BJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

5

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.8 V

1.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA5,3X3,20/10

Other Interface ICs

1.4 V

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B5

.715 mm

1.02 mm

Not Qualified

e1

1.36 mm

ST4G3234BJR

STMicroelectronics

INTERFACE CIRCUIT

INDUSTRIAL

BALL

11

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

1.65 V

1.5/3.3

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA11,3X7,17/10

Other Interface ICs

1.4 V

.5 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B11

.715 mm

1.41 mm

Not Qualified

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

DS150DF1610FBE/NOPB

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

1

16

2.5 V

GRID ARRAY

2.375 V

1 mm

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B196

4

2.94 mm

15.05 mm

e1

30

245

15.05 mm

DS250DF210ABMT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

LC898123XC-VH

Onsemi

INTERFACE CIRCUIT

OTHER

BALL

35

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

CMOS

3 V

3.6 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.6 V

2.6 V

.4 mm

85 Cel

2.8 V

-30 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B35

1

.45 mm

2.3 mm

IT ALSO OPERATES AT 3V

e1

30

260

3.39 mm

TPS65982ABZQZR

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

96

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.45 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.85 V

.5 mm

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B96

3

1 mm

6 mm

e1

30

260

6 mm

TPS65986ABZQZR

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

96

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.45 V

1

3.3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.85 V

.5 mm

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B96

3

1 mm

6 mm

e1

30

260

6 mm

NVT4857UKZ

NXP Semiconductors

INTERFACE CIRCUIT

INDUSTRIAL

BALL

20

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

3.6 V

1

3 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

2.9 V

.4 mm

85 Cel

-40 Cel

BOTTOM

R-PBGA-B20

.53 mm

1.7 mm

2.1 mm

DS250DF810ABVR

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

135

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

8

GRID ARRAY

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B135

3

e1

30

260

IP4856CX25/CZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.7 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

1

.55 mm

2.05 mm

VSUPPLY VOLTAGE IS FROM 2.8 TO 3.6

30

260

2.05 mm

IP4855CX25/CAZ

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

IP4855CX25Z

Nexperia

INTERFACE CIRCUIT

INDUSTRIAL

BALL

25

VFBGA

SQUARE

PLASTIC/EPOXY

YES

3.6 V

1

1.8 V

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

1.1 V

.4 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B25

.5 mm

2.04 mm

VSUPPLY VOLTAGE IS FROM 2.5 TO 5.5

NOT SPECIFIED

NOT SPECIFIED

2.04 mm

DS250DF410ABMR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

DS250DF410ABMT

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

4

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

PI2EQX6814NJEX

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

PI2EQX6814NJE

Diodes Incorporated

INTERFACE CIRCUIT

INDUSTRIAL

BALL

100

LBGA

SQUARE

PLASTIC/EPOXY

YES

1.26 V

1

1.2 V

GRID ARRAY, LOW PROFILE

BGA100,10X10,40

1.14 V

1 mm

85 Cel

-40 Cel

BOTTOM

S-PBGA-B100

1.7 mm

11 mm

11 mm

TDA8026ET/C3K

NXP Semiconductors

INTERFACE CIRCUIT

BALL

64

TFBGA

SQUARE

PLASTIC/EPOXY

YES

5.5 V

1

3.3 V

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA64,8X8,32

2.7 V

.8 mm

85 Cel

-25 Cel

BOTTOM

S-PBGA-B64

2

1.2 mm

7 mm

260

7 mm

DS150DF1610FB/NOPB

Texas Instruments

INTERFACE CIRCUIT

OTHER

BALL

196

BGA

SQUARE

PLASTIC/EPOXY

YES

2.625 V

1

16

2.5 V

GRID ARRAY

2.375 V

1 mm

85 Cel

-10 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B196

4

2.94 mm

15.05 mm

e1

30

245

15.05 mm

DS250DF210ABMR

Texas Instruments

INTERFACE CIRCUIT

INDUSTRIAL

BALL

101

TFBGA

SQUARE

PLASTIC/EPOXY

YES

1

2

GRID ARRAY, THIN PROFILE, FINE PITCH

.5 mm

85 Cel

-40 Cel

TIN SILVER COPPER

BOTTOM

S-PBGA-B101

3

1.03 mm

6 mm

e1

30

260

6 mm

Other Function Interface ICs

Other function interface ICs are electronic components that provide specific functions for interfacing different devices in electronic systems. They are designed to facilitate the exchange of data and signals between various components of the system.

Other function interface ICs can be classified into several types based on their specific functions and applications. Some of the most common types of interface ICs include:

1. Voltage level translators - These ICs are used to convert voltage levels between different devices in electronic systems, ensuring that signals are compatible and can be correctly interpreted.

2. Real-time clock (RTC) ICs - These ICs are used to keep track of time and date in electronic systems, and they typically include a battery backup to ensure that the clock remains accurate even if the main power supply is lost.

3. Touchscreen controllers - These ICs are used to interface with touchscreens and enable touch-based input in electronic systems.

Other function interface ICs can also include USB controllers, Ethernet controllers, and Bluetooth controllers, among other components. They are typically characterized by their data rate, power consumption, and specific functions.