| Part | RoHS | Manufacturer | Interface IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | Maximum Supply Voltage | No. of Functions | No. of Channels | Technology | Screening Level | No. of Bits | Maximum Supply Current | Output Latch/Register | Input Characteristics | Nominal Supply Voltage | Maximum Supply Voltage-1 | Power Supplies (V) | Nominal Negative Supply Voltage | Maximum Delay | Package Style (Meter) | Package Equivalence Code | Minimum Supply Voltage-1 | Sub-Category | Minimum Supply Voltage | Terminal Pitch | Maximum Operating Temperature | Nominal Supply Voltage-1 | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Output Polarity | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Onsemi |
TTL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
5,-4.5/-5.2 |
-5 V |
2 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
S-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
30 |
260 |
2 mm |
|||||||||||
|
|
Onsemi |
ECL TO TTL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
5.5 V |
1 |
ECL |
1 |
NONE |
5 V |
+-5 |
-5 V |
4.1 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
4.5 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
S-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
TRUE |
30 |
260 |
2 mm |
|||||||||||
|
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.7 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
S-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
30 |
260 |
2 mm |
||||||||||||
|
|
Onsemi |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.47 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CML, LVCMOS, LVTTL OR LVDS TO LVDS TRANSLATION ALSO POSSIBLE |
260 |
3 mm |
||||||||||||||||
|
|
Onsemi |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
.47 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
CML, LVCMOS, LVTTL OR LVDS TO LVDS TRANSLATION ALSO POSSIBLE |
e4 |
260 |
3 mm |
|||||||||||||||
|
|
Onsemi |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
3 |
1 |
NONE |
3.3 V |
2.5/3.3,-3.3/-5 |
.75 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
4 mm |
||||||||||||
|
|
Onsemi |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
3 |
1 |
NONE |
3.3 V |
2.5/3.3,-3.3/-5 |
.75 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
260 |
4 mm |
|||||||||||||
|
|
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
1.1 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
5 mm |
|||||||||||||||
|
|
Onsemi |
PECL TO CML TRANSLATOR |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
1.1 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
3 V |
.5 mm |
70 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e3 |
30 |
260 |
5 mm |
|||||||||||||||
|
|
Onsemi |
LVTTL/LVCMOS TO LVECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
32 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
10 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.875 ns |
CHIP CARRIER, HEAT SINK/SLUG |
LCC32,.2SQ,20 |
Level Translators |
3 V |
.8 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N32 |
1 |
1.6 mm |
7 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
7 mm |
|||||||||||
|
|
Onsemi |
LVTTL/LVCMOS TO LVECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
32 |
HQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
10 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.875 ns |
CHIP CARRIER, HEAT SINK/SLUG |
LCC32,.2SQ,20 |
Level Translators |
3 V |
.8 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1.6 mm |
7 mm |
Not Qualified |
TRUE |
e3 |
30 |
260 |
7 mm |
|||||||||||
|
|
Onsemi |
LVTTL/LVCMOS TO LVECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
+-3.3 |
-3.3 V |
.8 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
S-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
30 |
260 |
2 mm |
|||||||||||
|
|
Onsemi |
PECL TO LVPECL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
4 |
NONE |
2.5 V |
10 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
|
|
Onsemi |
PECL TO LVPECL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
4 |
NONE |
2.5 V |
10 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V |
e3 |
30 |
260 |
5 mm |
||||||||||||||
|
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
3 mm |
||||||||||||||||||
|
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
30 |
260 |
3 mm |
||||||||||||||||
|
|
Onsemi |
PECL TO CML TRANSLATOR |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
2.625 V |
1 |
1 |
NONE |
2.5 V |
.225 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
QUAD |
S-XQCC-N16 |
1 |
1 mm |
3 mm |
Not Qualified |
COMPLEMENTARY |
3 mm |
||||||||||||||||||
|
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
12 |
HVSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
5.5 V |
1 |
4 |
NONE |
3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
0 V |
.4 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
DUAL |
R-PDSO-N12 |
.5 mm |
1.35 mm |
TRUE |
NOT SPECIFIED |
NOT SPECIFIED |
2.5 mm |
|||||||||||||||||||
|
Maxim Integrated |
ECL TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
32 |
VQCCN |
SQUARE |
CERAMIC, METAL-SEALED COFIRED |
YES |
3.6 V |
4 |
BIPOLAR |
1 |
NONE |
3.3 V |
-2.5/-3.3/2.5/3.3 |
-3.3 V |
.45 ns |
CHIP CARRIER, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Level Translators |
2.375 V |
.5 mm |
85 Cel |
OPEN-EMITTER |
-40 Cel |
TIN LEAD |
QUAD |
S-CQCC-N32 |
1 |
1 mm |
5 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
5 mm |
||||||||||||
|
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e0 |
235 |
4 mm |
|||||||||||||||
|
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N24 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e0 |
30 |
235 |
4 mm |
||||||||||||||
|
Micrel |
PECL-TTL/TTL-PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
1 |
NONE |
3.3 V |
3.3 |
2.5 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
Tin/Lead (Sn85Pb15) |
QUAD |
S-XQCC-N8 |
2 |
.9754 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e0 |
30 |
240 |
2 mm |
|||||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
2 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
1.8 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 mm |
2 mm |
Not Qualified |
TRUE |
e0 |
235 |
2 mm |
||||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
2.2 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-PDSO-N8 |
1 mm |
2 mm |
Not Qualified |
TRUE |
e0 |
235 |
2 mm |
||||||||||||||
|
|
Onsemi |
TTL/CMOS TO PECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
.45 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL GOLD PALLADIUM |
DUAL |
S-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
30 |
260 |
2 mm |
||||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||
|
|
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e3 |
30 |
260 |
4 mm |
||||||||||||
|
|
Onsemi |
PECL TO ECL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
3.8 V |
1 |
ECL |
1 |
NONE |
2.5 V |
-2.5 V |
.65 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
TIN |
QUAD |
S-XQCC-N24 |
1 |
1 mm |
4 mm |
Not Qualified |
COMPLEMENTARY |
LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE |
e3 |
260 |
4 mm |
|||||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
NOT SPECIFIED |
260 |
2 mm |
||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
1 |
45 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Line Driver or Receivers |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
30 |
260 |
2 mm |
||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
IT ALSO OPERATES AT 3.3 V SUPPLY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
|||||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
NONE |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
DUAL |
S-PDSO-N8 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
NOT SPECIFIED |
NOT SPECIFIED |
2 mm |
||||||||||||||
|
Onsemi |
PECL TO TTL TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
UNSPECIFIED |
YES |
3.6 V |
1 |
ECL |
1 |
NONE |
3.3 V |
3.3 |
2.25 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC8,.08,20 |
Level Translators |
3 V |
.5 mm |
85 Cel |
-40 Cel |
TIN LEAD |
DUAL |
S-XDSO-N8 |
1 mm |
2 mm |
Not Qualified |
TRUE |
e0 |
235 |
2 mm |
||||||||||||||
|
|
Texas Instruments |
PECL TO LVDS TRANSLATOR |
INDUSTRIAL |
NO LEAD |
8 |
HVSSON |
SQUARE |
PLASTIC/EPOXY |
YES |
3.6 V |
1 |
BICMOS |
1 |
48 mA |
NONE |
DIFFERENTIAL |
2.5 V |
2.5/3.3 |
.63 ns |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH |
SOLCC8,.08,20 |
Other Interface ICs |
2.375 V |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
Not Qualified |
COMPLEMENTARY |
e4 |
NOT SPECIFIED |
260 |
2 mm |
|||||||||
|
|
NXP Semiconductors |
GTL TO TTL TRANSCEIVER |
INDUSTRIAL |
NO LEAD |
24 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5.4 V |
1 |
10 |
NONE |
STANDARD |
5.5 V |
.375 ns |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC24,.16SQ,20 |
0 V |
0 V |
.5 mm |
85 Cel |
OPEN-DRAIN |
-40 Cel |
QUAD |
S-PQCC-N24 |
1 |
1 mm |
4 mm |
TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE |
30 |
260 |
4 mm |
Voltage level translators are electronic components used to convert voltage levels between different devices in electronic systems. They are used to ensure that signals are compatible and can be correctly interpreted. Voltage level translators are essential components in electronic systems that require the exchange of data and signals between different components.
Voltage level translators can be classified into several types based on their specific characteristics and applications. The most common types of voltage level translators include unidirectional and bidirectional translators.
Unidirectional voltage level translators convert signals in one direction, typically from a low voltage to a higher voltage. They are commonly used in applications where data is transmitted from a low-power device to a higher-power device. Bidirectional voltage level translators can convert signals in both directions and are commonly used in applications where data is transmitted bidirectionally between two devices.
Voltage level translators are typically characterized by their voltage range, speed, power consumption, and compatibility with different voltage levels. They are commonly used in various electronic systems, such as communications, industrial automation, and automotive electronics.