SQUARE Logic Gates 214

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	Screening Level	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74AUP2G58DPJ	Nexperia	MAJORITY LOGIC GATE	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		3	TR, 13 INCH	1.1		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		24.1 ns		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	.8 V		e4	30	260	3 mm	AUP/ULP/V
74LVC2G16GFH	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		2		1.8		SMALL OUTLINE, VERY THIN PROFILE		10.8 ns		.35 mm	125 Cel	-40 Cel		DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
74AUP2G98DPJ	Nexperia	MAJORITY LOGIC GATE	AUTOMOTIVE	GULL WING	10	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2	CMOS		3	TR, 13 INCH	1.1		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		22.4 ns		.5 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-G10	1	3.6 V	1.1 mm	3 mm	.8 V		e4	30	260	3 mm	AUP/ULP/V
74AUP3G14GM,125	Nexperia	INVERTER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		1.1		CHIP CARRIER, VERY THIN PROFILE		20 ns			125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	3.6 V	.5 mm	1.6 mm	.8 V		e4	30	260	1.6 mm	AUP/ULP/V
74HC3G16DPH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1	TR, 7 INCH	5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	6 V	1.1 mm	3 mm	2 V		e4	30	260	3 mm	HC/UH
74LVC1G16GFH	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.8		SMALL OUTLINE, VERY THIN PROFILE		11 ns		.35 mm	125 Cel	-40 Cel		DUAL	S-PDSO-N6		5.5 V	.5 mm	1 mm	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
74LVC3G16DPH	Nexperia	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1	TR, 7 INCH	1.8		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		10.8 ns		.65 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD SILVER	DUAL	S-PDSO-G8	1	5.5 V	1.1 mm	3 mm	1.65 V		e4	30	260	3 mm	LVC/LCX/Z
74LVC3G16GMH	Nexperia	BUFFER	AUTOMOTIVE	BUTT	8	VBCC	SQUARE	PLASTIC/EPOXY		YES	3	CMOS		1		1.8		CHIP CARRIER, VERY THIN PROFILE		10.8 ns			125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	S-PBCC-B8	1	5.5 V	.5 mm	1.6 mm	1.65 V		e4	30	260	1.6 mm	LVC/LCX/Z
74AUP1T34GX,132	Nexperia	BUFFER	AUTOMOTIVE	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2		SMALL OUTLINE		33.5 ns		.48 mm	125 Cel	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm	1.1 V		e4	30	260	.8 mm	AUP/ULP/V
74AXP1G00GS,125	NXP Semiconductors	NAND GATE	INDUSTRIAL	NO LEAD	6	VSON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		2		1.2		SMALL OUTLINE, VERY THIN PROFILE		120 ns		.35 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		2.75 V	.35 mm	1 mm	.7 V					1 mm	AXP
74AXP1G00GX,125	NXP Semiconductors	NAND GATE	INDUSTRIAL	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		2		1.2		SMALL OUTLINE		120 ns		.48 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N5		2.75 V	.35 mm	.8 mm	.7 V					.8 mm	AXP
74AXP1G02GX,125	NXP Semiconductors	NOR GATE	INDUSTRIAL	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		2		1.2		SMALL OUTLINE		98 ns		.48 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N5		2.75 V	.35 mm	.8 mm	.7 V					.8 mm	AXP
74AXP1G04GX,125	NXP Semiconductors	INVERTER	INDUSTRIAL	NO LEAD	5	SON	SQUARE	PLASTIC/EPOXY		YES	1	CMOS		1		1.2		SMALL OUTLINE		100 ns		.48 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N5		2.75 V	.35 mm	.8 mm	.7 V					.8 mm	AXP
74HC2G02DP-Q100,125	NXP Semiconductors	NOR GATE	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	2		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		110 ns		.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	2 V					3 mm	HC/UH
74HC2G86DP-Q100,125	NXP Semiconductors	XOR GATE	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	2	CMOS	AEC-Q100	2		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		180 ns		.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	2 V					3 mm	HC/UH
74HC3G04DP-Q100,125	NXP Semiconductors	INVERTER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		110 ns		.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	2 V					3 mm	HC/UH
74HC3G14DP-Q100,125	NXP Semiconductors	INVERTER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		190 ns		.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	2 V					3 mm	HC/UH
74HC3G34DP-Q100,125	NXP Semiconductors	BUFFER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		125 ns		.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	2 V					3 mm	HC/UH
74HC3GU04DP-Q100,125	NXP Semiconductors	INVERTER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		90 ns		.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G8		6 V	1.1 mm	3 mm	2 V					3 mm	HC/UH
74HCT3G04DP-Q100,125	NXP Semiconductors	INVERTER	AUTOMOTIVE	GULL WING	8	TSSOP	SQUARE	PLASTIC/EPOXY		YES	3	CMOS	AEC-Q100	1		5		SMALL OUTLINE, THIN PROFILE, SHRINK PITCH		29 ns		.65 mm	125 Cel	-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm	4.5 V					3 mm	HCT
NC7WZ17FHX-L22175	Onsemi	BUFFER		NO LEAD	6	VSOF	SQUARE	PLASTIC/EPOXY	YES	YES	2	CMOS		1	TR	1.8	50 pF	SMALL OUTLINE, VERY THIN PROFILE	SOLCC6,.04,14	15.8 ns	32 Amp	.35 mm	85 Cel	-40 Cel		DUAL	S-PDSO-N6		5.5 V	.55 mm	1 mm	1.65 V	100 mA		NOT SPECIFIED	NOT SPECIFIED	1 mm	LVC/LCX/Z
74AUP1T08GXH	Nexperia	AND GATE		NO LEAD	5	HVSON	SQUARE	PLASTIC/EPOXY	YES	YES	1	CMOS		2	TR, 7 INCH	2.5	30 pF	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC5,.03,20	11.9 ns		.5 mm	125 Cel	-40 Cel	TIN	DUAL	S-PDSO-N5	1	3.6 V	.35 mm	.8 mm	2.3 V	.0035 mA	e3	30	260	.8 mm	AUP/ULPA

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.