BALL Logic Gates 29

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Part	Manufacturer	Logic IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Schmitt Trigger	Surface Mount	No. of Functions	Technology	No. of Inputs	Packing Method	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Load Capacitance (CL)	Package Style (Meter)	Package Equivalence Code	Propagation Delay (tpd)	Maximum I (ol)	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width	Qualification	Minimum Supply Voltage (Vsup)	Maximum Power Supply Current (ICC)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length	Family
74AUP1G06FX4-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	21.3 ns	1.7 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
74AUP1G08FX4-7	Diodes Incorporated	AND GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	24 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
74AUP1G09FX4-7	Diodes Incorporated	AND GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	24 ns	1.7 Amp	Gates	.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
74AUP1G14FX4-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	22.5 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
74AUP1G17FX4-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	YES	1	CMOS	1	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	20.1 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
74AUP1G86FX4-7	Diodes Incorporated	XOR GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	3	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	26.6 ns	1.7 Amp	Gates	.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	3.6 V	.4 mm	.9 mm	Not Qualified	.8 V		e4	30	260	1.4 mm	AUP/ULP/V
74LVC2G06FX4-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	2	CMOS	1		3.3			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8.2 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G32FX4-7	Diodes Incorporated	OR GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		10.5 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G06FX4-7	Diodes Incorporated	INVERTER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		8.5 ns			.5 mm	125 Cel	OPEN-DRAIN	-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G86FX4-7	Diodes Incorporated	XOR GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		13 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G02FX4-7	Diodes Incorporated	NOR GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		10.5 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G08FX4-7	Diodes Incorporated	AND GATE	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	2		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		10.5 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
74LVC1G17FX4-7	Diodes Incorporated	BUFFER	AUTOMOTIVE	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY		YES	1	CMOS	1		1.8			GRID ARRAY, VERY THIN PROFILE, FINE PITCH		14 ns			.5 mm	125 Cel		-40 Cel	NICKEL PALLADIUM GOLD	BOTTOM	R-PBGA-B6	1	5.5 V	.4 mm	.9 mm		1.65 V		e4	30	260	1.4 mm	LVC/LCX/Z
SN74LVC1G07YEAR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	1	TR	1.8	3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,2X3,20	8.3 ns	24 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel		BOTTOM	R-XBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC3G04YEAR	Texas Instruments	INVERTER	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	3	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA8,2X4,20	7.9 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B8	1	5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V		e0			1.9 mm	LVC/LCX/Z
SN74LVC3G07YEAR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	3	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA8,2X4,20	7.8 ns	24 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	TIN LEAD	BOTTOM	R-XBGA-B8	1	5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V		e0			1.9 mm	LVC/LCX/Z
SN74AUC1G00YEAR	Texas Instruments	NAND GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	2	TR	1.2	1.2/2.5		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,2X3,20	3.2 ns	5 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B5		2.7 V	.5 mm	.9 mm	Not Qualified	.8 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	AUC
SN74LVC2G34YEAR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	2	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	8.6 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1GU04YEPR	Texas Instruments	INVERTER	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	5 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B5		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC2GU04YEPR	Texas Instruments	INVERTER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	2	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	5.5 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel		BOTTOM	R-PBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC2G34YEPR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	2	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	8.6 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G10YEPR	Texas Instruments	NAND GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	3	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	18 ns	24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1404YZPR	Texas Instruments	INVERTER/BUFFER	INDUSTRIAL	BALL	8	VFBGA	RECTANGULAR	UNSPECIFIED	YES	YES	2	CMOS	1	TR	1.8		50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		25.7 ns	32 Amp		.5 mm	85 Cel		-40 Cel	Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	R-XBGA-B8	1	5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V	.01 mA	e1	NOT SPECIFIED	260	1.9 mm	LVC/LCX/Z
SN74LVC1G3208YEPR	Texas Instruments	OR-AND GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	3	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	17.5 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74AUP1G32YEPR	Texas Instruments	OR GATE	INDUSTRIAL	BALL	5	VFBGA	RECTANGULAR	PLASTIC/EPOXY	NO	YES	1	CMOS	2	TR	1.2	1.2/3.3	30 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,2X3,20	26.7 ns	1.7 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel		BOTTOM	R-PBGA-B5		3.6 V	.5 mm	.9 mm	Not Qualified	.8 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	AUP/ULP/V
SN74LVC1G0832YEPR	Texas Instruments	AND-OR GATE	INDUSTRIAL	BALL	6	VFBGA	RECTANGULAR	UNSPECIFIED	NO	YES	1	CMOS	3	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA6,2X3,20	17.5 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel		BOTTOM	R-XBGA-B6		5.5 V	.5 mm	.9 mm	Not Qualified	1.65 V			NOT SPECIFIED	NOT SPECIFIED	1.4 mm	LVC/LCX/Z
SN74LVC1G34YZTR	Texas Instruments	BUFFER	INDUSTRIAL	BALL	4	VFBGA	SQUARE	UNSPECIFIED	NO	YES	1	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,20	9.9 ns	24 Amp	Gates	.5 mm	85 Cel	3-STATE	-40 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1	5.5 V	.625 mm	.9 mm	Not Qualified	1.65 V		e1	30	260	.9 mm	LVC/LCX/Z
SN74LVC1G06YZTR	Texas Instruments	INVERTER	INDUSTRIAL	BALL	4	VFBGA	SQUARE	UNSPECIFIED	NO	YES	1	CMOS	1	TR	1.8	3.3		GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA5,2X3,20	6.5 ns	24 Amp	Gates	.5 mm	85 Cel	OPEN-DRAIN	-40 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1	5.5 V	.625 mm	.9 mm	Not Qualified	1.65 V		e1	30	260	.9 mm	LVC/LCX/Z
SN74LVC1G14YZTR	Texas Instruments	INVERTER	INDUSTRIAL	BALL	4	VFBGA	SQUARE	UNSPECIFIED	YES	YES	1	CMOS	1	TR	1.8	3.3	50 pF	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA4,2X2,20	11 ns	24 Amp	Gates	.5 mm	85 Cel		-40 Cel	TIN SILVER COPPER	BOTTOM	S-XBGA-B4	1	5.5 V	.625 mm	.9 mm	Not Qualified	1.65 V		e1	30	260	.9 mm	LVC/LCX/Z

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.