NO LEAD Logic Gates 318

Reset All
Part RoHS Manufacturer Logic IC Type Temperature Grade Terminal Form No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Schmitt Trigger Surface Mount No. of Functions Technology Screening Level No. of Inputs No. of Bits Translation Packing Method Nominal Supply Voltage / Vsup (V) Power Supplies (V) Load Capacitance (CL) Package Style (Meter) Package Equivalence Code Propagation Delay (tpd) Maximum I (ol) Sub-Category Terminal Pitch Maximum Operating Temperature Output Characteristics Minimum Operating Temperature Terminal Finish Terminal Position Control Type Minimum fmax JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Width Qualification Output Polarity Minimum Supply Voltage (Vsup) Maximum Power Supply Current (ICC) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Length Family

SN54HC132TDG1

Texas Instruments

NAND GATE

NO LEAD

14

DIE

RECTANGULAR

UNSPECIFIED

YES

4

CMOS

2

5

UNCASED CHIP

4 Amp

UPPER

R-XUUC-N14

6 V

2 V

NOT SPECIFIED

NOT SPECIFIED

HC

SN54HC132TDG2

Texas Instruments

NAND GATE

NO LEAD

14

DIE

RECTANGULAR

UNSPECIFIED

YES

4

CMOS

2

5

UNCASED CHIP

4 Amp

UPPER

R-XUUC-N14

6 V

2 V

NOT SPECIFIED

NOT SPECIFIED

HC

SN54HC08VTDF1

Texas Instruments

AND GATE

NO LEAD

14

DIE

RECTANGULAR

UNSPECIFIED

YES

4

CMOS

2

TUBE

UNCASED CHIP

UPPER

R-XUUC-N14

HC/UH

SN54HC08VTDF2

Texas Instruments

AND GATE

NO LEAD

14

DIE

RECTANGULAR

UNSPECIFIED

YES

4

CMOS

2

TUBE

UNCASED CHIP

UPPER

R-XUUC-N14

HC/UH

SN54HC273VTDG1

Texas Instruments

AND GATE

NO LEAD

20

DIE

RECTANGULAR

UNSPECIFIED

YES

4

CMOS

2

UNCASED CHIP

UPPER

R-XUUC-N20

6 V

1.4986 mm

2 V

2.1335 mm

HC/UH

74AUP1G04GM,184

NXP Semiconductors

INVERTER

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.1

SMALL OUTLINE, VERY THIN PROFILE

20.9 ns

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N6

3.6 V

.5 mm

1 mm

.8 V

1.45 mm

AUP/ULP/V

74AUP1T34GX,132

Nexperia

BUFFER

AUTOMOTIVE

NO LEAD

5

SON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE

33.5 ns

.48 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

DUAL

S-PDSO-N5

1

3.6 V

.35 mm

.8 mm

1.1 V

e4

30

260

.8 mm

AUP/ULP/V

74AUP2G04GM,125

NXP Semiconductors

INVERTER

AUTOMOTIVE

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.1

SMALL OUTLINE, VERY THIN PROFILE

20.9 ns

.5 mm

125 Cel

-40 Cel

DUAL

R-PDSO-N6

3.6 V

.5 mm

1 mm

.8 V

1.45 mm

AUP/ULP/V

74AXP1G00GM,125

NXP Semiconductors

NAND GATE

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

SMALL OUTLINE, VERY THIN PROFILE

120 ns

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

2.75 V

.5 mm

1 mm

.7 V

1.45 mm

AXP

74AXP1G00GS,125

NXP Semiconductors

NAND GATE

INDUSTRIAL

NO LEAD

6

VSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

SMALL OUTLINE, VERY THIN PROFILE

120 ns

.35 mm

85 Cel

-40 Cel

DUAL

S-PDSO-N6

2.75 V

.35 mm

1 mm

.7 V

1 mm

AXP

74AXP1G00GX,125

NXP Semiconductors

NAND GATE

INDUSTRIAL

NO LEAD

5

SON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

SMALL OUTLINE

120 ns

.48 mm

85 Cel

-40 Cel

DUAL

S-PDSO-N5

2.75 V

.35 mm

.8 mm

.7 V

.8 mm

AXP

74AXP1G02GN,125

NXP Semiconductors

NOR GATE

INDUSTRIAL

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

SMALL OUTLINE

98 ns

.3 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

2.75 V

.35 mm

.9 mm

.7 V

1 mm

AXP

74AXP1G02GX,125

NXP Semiconductors

NOR GATE

INDUSTRIAL

NO LEAD

5

SON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

2

1.2

SMALL OUTLINE

98 ns

.48 mm

85 Cel

-40 Cel

DUAL

S-PDSO-N5

2.75 V

.35 mm

.8 mm

.7 V

.8 mm

AXP

74AXP1G04GX,125

NXP Semiconductors

INVERTER

INDUSTRIAL

NO LEAD

5

SON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE

100 ns

.48 mm

85 Cel

-40 Cel

DUAL

S-PDSO-N5

2.75 V

.35 mm

.8 mm

.7 V

.8 mm

AXP

74AXP1G14GM,125

NXP Semiconductors

INVERTER

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE, VERY THIN PROFILE

114 ns

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

2.75 V

.5 mm

1 mm

.7 V

1.45 mm

AXP

74AXP1G14GN,125

NXP Semiconductors

INVERTER

INDUSTRIAL

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

1

1.2

SMALL OUTLINE

114 ns

.3 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

2.75 V

.35 mm

.9 mm

.7 V

1 mm

AXP

74AXP1G97GM,125

NXP Semiconductors

MAJORITY LOGIC GATE

INDUSTRIAL

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

SMALL OUTLINE, VERY THIN PROFILE

95 ns

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

2.75 V

.5 mm

1 mm

.7 V

1.45 mm

AXP

74AXP1G97GN,125

NXP Semiconductors

MAJORITY LOGIC GATE

INDUSTRIAL

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

3

1.2

SMALL OUTLINE

95 ns

.3 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

2.75 V

.35 mm

.9 mm

.7 V

1 mm

AXP

74AXP2G07GN,125

NXP Semiconductors

BUFFER

INDUSTRIAL

NO LEAD

6

SON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.2

SMALL OUTLINE

82 ns

.3 mm

85 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-N6

2.75 V

.35 mm

.9 mm

.7 V

1 mm

AXP

74AXP2T3407GS,115

NXP Semiconductors

BUFFER

INDUSTRIAL

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

2

CMOS

1

1.2

SMALL OUTLINE, VERY THIN PROFILE

225 ns

.35 mm

85 Cel

OPEN-DRAIN

-40 Cel

DUAL

R-PDSO-N8

2.75 V

.35 mm

1 mm

.7 V

1.35 mm

AXP

NL27WZ02MU2TCG

Onsemi

NOR GATE

MILITARY

NO LEAD

8

VSON

RECTANGULAR

PLASTIC/EPOXY

NO

YES

2

CMOS

2

TR

2.3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC8,.04,16

9.7 ns

32 Amp

.4 mm

125 Cel

-55 Cel

DUAL

R-PDSO-N8

1

5.5 V

.55 mm

1 mm

1.65 V

100 mA

NOT SPECIFIED

NOT SPECIFIED

1.6 mm

LVC/LCX/Z

NL37WZ16MU1TCG

Onsemi

BUFFER

MILITARY

NO LEAD

8

USSON

RECTANGULAR

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

2.3

50 pF

SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH

SOLCC8,.04,20

8.8 ns

24 Amp

.5 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N8

1

5.5 V

.55 mm

1 mm

1.65 V

.01 mA

e4

10

260

1.95 mm

LVC/LCX/Z

NL37WZ16MU3TCG

Onsemi

BUFFER

MILITARY

NO LEAD

8

USSON

RECTANGULAR

PLASTIC/EPOXY

NO

YES

3

CMOS

1

TR

2.3

50 pF

SMALL OUTLINE, ULTRA THIN PROFILE, SHRINK PITCH

SOLCC8,.04,14

8.8 ns

24 Amp

.35 mm

125 Cel

-55 Cel

DUAL

R-PDSO-N8

1

5.5 V

.55 mm

1 mm

1.65 V

.01 mA

10

260

1.45 mm

LVC/LCX/Z

MC74VHC1GT50MU2TCG

Onsemi

BUFFER

MILITARY

NO LEAD

6

RECTANGULAR

PLASTIC/EPOXY

NO

YES

1

CMOS

1

TR

3

50 pF

14.5 ns

8 Amp

125 Cel

3-STATE

-55 Cel

DUAL

R-PDSO-N6

5.5 V

2 V

.04 mA

NOT SPECIFIED

NOT SPECIFIED

AHC/VHC/H/U/V

MC74VHC2G17MU1TCG

Onsemi

BUFFER

MILITARY

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

YES

YES

2

CMOS

1

TR

5

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

20.5 ns

8 Amp

.5 mm

125 Cel

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-N6

5.5 V

.55 mm

1 mm

2 V

.04 mA

e4

1.45 mm

AHC/VHC

SN74HCS14QBQARQ1

Texas Instruments

INVERTER

AUTOMOTIVE

NO LEAD

14

HVQCCN

RECTANGULAR

PLASTIC/EPOXY

YES

YES

6

CMOS

AEC-Q100

1

TR

5

50 pF

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC14,.1X.12,20

40 ns

7.8 Amp

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD

QUAD

R-PQCC-N14

1

6 V

.8 mm

2.5 mm

2 V

.002 mA

e4

30

260

3 mm

HC

NC7WZ17FHX-L22175

Onsemi

BUFFER

NO LEAD

6

VSOF

SQUARE

PLASTIC/EPOXY

YES

YES

2

CMOS

1

TR

1.8

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,14

15.8 ns

32 Amp

.35 mm

85 Cel

-40 Cel

DUAL

S-PDSO-N6

5.5 V

.55 mm

1 mm

1.65 V

100 mA

NOT SPECIFIED

NOT SPECIFIED

1 mm

LVC/LCX/Z

NC7WZ04L6X-L22175

Onsemi

INVERTER

NO LEAD

6

VSON

RECTANGULAR

PLASTIC/EPOXY

NO

YES

2

CMOS

1

TR

1.8

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

11 ns

32 Amp

.5 mm

85 Cel

-40 Cel

DUAL

R-PDSO-N6

5.5 V

.55 mm

1 mm

1.65 V

100 mA

1.45 mm

LVC/LCX/Z

NC7S04L6X-L22175

Onsemi

INVERTER

NO LEAD

6

VSON

RECTANGULAR

UNSPECIFIED

NO

YES

1

CMOS

1

TR

3

50 pF

SMALL OUTLINE, VERY THIN PROFILE

SOLCC6,.04,20

125 ns

2.6 Amp

.5 mm

85 Cel

-40 Cel

DUAL

R-XDSO-N6

6 V

.55 mm

1 mm

2 V

25 mA

1.45 mm

HC

74AUP1T08GXH

Nexperia

AND GATE

NO LEAD

5

HVSON

SQUARE

PLASTIC/EPOXY

YES

YES

1

CMOS

2

TR, 7 INCH

2.5

30 pF

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC5,.03,20

11.9 ns

.5 mm

125 Cel

-40 Cel

TIN

DUAL

S-PDSO-N5

1

3.6 V

.35 mm

.8 mm

2.3 V

.0035 mA

e3

30

260

.8 mm

AUP/ULPA

Logic Gates

Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.

Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.

Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.

Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.

Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.

Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.