| Part | RoHS | Manufacturer | Logic IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Schmitt Trigger | Surface Mount | No. of Functions | Technology | Screening Level | No. of Inputs | No. of Bits | Translation | Packing Method | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Load Capacitance (CL) | Package Style (Meter) | Package Equivalence Code | Propagation Delay (tpd) | Maximum I (ol) | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Output Characteristics | Minimum Operating Temperature | Terminal Finish | Terminal Position | Control Type | Minimum fmax | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Width | Qualification | Output Polarity | Minimum Supply Voltage (Vsup) | Maximum Power Supply Current (ICC) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Family |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
Diodes Incorporated |
BUFFER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
2 |
CMOS |
1 |
TR |
3 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
20.8 ns |
1.7 Amp |
Gates |
.35 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
1 |
3.6 V |
.4 mm |
1 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||
|
|
Texas Instruments |
NOR GATE |
NO LEAD |
14 |
DIE |
RECTANGULAR |
50k Rad(Si) |
UNSPECIFIED |
YES |
4 |
CMOS |
2 |
TUBE |
5 |
UNCASED CHIP |
UPPER |
R-XUUC-N14 |
5.5 V |
1.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
AC |
||||||||||||||||||||||||||||
|
|
Texas Instruments |
NOR GATE |
NO LEAD |
14 |
DIE |
RECTANGULAR |
50k Rad(Si) |
UNSPECIFIED |
YES |
4 |
CMOS |
2 |
TUBE |
5 |
UNCASED CHIP |
UPPER |
R-XUUC-N14 |
5.5 V |
1.5 V |
NOT SPECIFIED |
NOT SPECIFIED |
AC |
||||||||||||||||||||||||||||
|
|
Onsemi |
NAND GATE |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
AEC-Q100 |
2 |
TR |
3 |
2/5.5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
19.6 ns |
8 Amp |
Gates |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
2 V |
.04 mA |
e3 |
30 |
260 |
2 mm |
AHC/VHC/H/U/V |
|||||||||
|
|
Texas Instruments |
OR GATE |
INDUSTRIAL |
NO LEAD |
5 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.8 |
SMALL OUTLINE |
8 ns |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N5 |
1 |
5.5 V |
1.65 V |
e4 |
30 |
260 |
LVC/LCX/Z |
|||||||||||||||||||||||
|
|
Onsemi |
NAND GATE |
MILITARY |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
8 |
5 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
265 ns |
.65 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G14 |
1 |
6 V |
1.2 mm |
4.4 mm |
2 V |
e4 |
30 |
260 |
5 mm |
HC/UH |
|||||||||||||||||||
|
Texas Instruments |
INVERTER |
INDUSTRIAL |
NO LEAD |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
6 |
CMOS |
1 |
5 |
UNCASED CHIP |
9 ns |
85 Cel |
-40 Cel |
UPPER |
R-XUUC-N |
5.5 V |
4.5 V |
AHCT/VHCT/VT |
||||||||||||||||||||||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
27 ns |
.35 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
3.6 V |
.5 mm |
1 mm |
.8 V |
e4 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||||||||
|
|
Diodes Incorporated |
BUFFER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
20.7 ns |
.35 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
3.6 V |
.5 mm |
1 mm |
.8 V |
e4 |
260 |
1 mm |
AUP/ULP/V |
||||||||||||||||||||
|
|
Diodes Incorporated |
OR GATE |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
1.2 |
SMALL OUTLINE, VERY THIN PROFILE |
23.7 ns |
.35 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
3.6 V |
.5 mm |
1 mm |
.8 V |
e4 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||||||||
|
|
Onsemi |
NAND GATE |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
AEC-Q100 |
2 |
TR |
3 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
19.6 ns |
8 Amp |
Gate |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
2 V |
.04 mA |
e3 |
30 |
260 |
2 mm |
AHC/VHC/H/U/V |
|||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
3 |
1.2/3.3 |
30 pF |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
21.3 ns |
1.7 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.4 mm |
.9 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
1.4 mm |
AUP/ULP/V |
||||||||||
|
|
Diodes Incorporated |
AND GATE |
AUTOMOTIVE |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
2 |
TR |
3 |
1.2/3.3 |
30 pF |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
24 ns |
1.7 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.4 mm |
.9 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
1.4 mm |
AUP/ULP/V |
|||||||||||
|
|
Diodes Incorporated |
AND GATE |
AUTOMOTIVE |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
2 |
TR |
3 |
1.2/3.3 |
30 pF |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
24 ns |
1.7 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.4 mm |
.9 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
1.4 mm |
AUP/ULP/V |
||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
NO LEAD |
4 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
1 |
TR |
3 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC5(UNSPEC) |
22.5 ns |
1.7 Amp |
Gates |
.48 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N4 |
3.6 V |
.35 mm |
.8 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
.8 mm |
AUP/ULP/V |
||||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
1 |
TR |
3 |
1.2/3.3 |
30 pF |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
22.5 ns |
1.7 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.4 mm |
.9 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
1.4 mm |
AUP/ULP/V |
|||||||||||
|
|
Diodes Incorporated |
BUFFER |
AUTOMOTIVE |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
YES |
1 |
CMOS |
1 |
TR |
3 |
1.2/3.3 |
30 pF |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
20.1 ns |
1.7 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.4 mm |
.9 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
1.4 mm |
AUP/ULP/V |
|||||||||||
|
|
Diodes Incorporated |
XOR GATE |
AUTOMOTIVE |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
2 |
TR |
3 |
1.2/3.3 |
30 pF |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
BGA6,2X3,20 |
26.6 ns |
1.7 Amp |
Gates |
.5 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
3.6 V |
.4 mm |
.9 mm |
Not Qualified |
.8 V |
e4 |
30 |
260 |
1.4 mm |
AUP/ULP/V |
|||||||||||
|
|
Onsemi |
XOR GATE |
MILITARY |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
4 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
2/6 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP14,.25 |
150 ns |
4 Amp |
Gates |
.65 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G14 |
1 |
6 V |
1.2 mm |
4.4 mm |
Not Qualified |
2 V |
e4 |
30 |
260 |
5 mm |
HC/UH |
||||||||||
|
|
Onsemi |
OR GATE |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
3.3/5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
15.5 ns |
8 Amp |
Gate |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
3 V |
.04 mA |
e3 |
30 |
260 |
2 mm |
AHC/VHC/H/U/V |
|||||||||
|
|
Onsemi |
OR GATE |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
3.3/5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSSOP5/6,.08 |
15.5 ns |
8 Amp |
Gate |
.65 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.25 mm |
Not Qualified |
3 V |
.04 mA |
e3 |
30 |
260 |
2 mm |
AHC/VHC/H/U/V |
|||||||||
|
|
Onsemi |
INVERTER |
MILITARY |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
3 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,20 |
20 ns |
.3 Amp |
Gates |
.5 mm |
125 Cel |
OPEN-DRAIN |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.55 mm |
1 mm |
Not Qualified |
.9 V |
e4 |
30 |
260 |
1.45 mm |
LVP |
||||||||||
|
|
Onsemi |
XOR GATE |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
AEC-Q100 |
2 |
TR |
5 |
2/5.5 |
50 pF |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TSOP5/6,.11,37 |
19.5 ns |
8 Amp |
Gates |
.95 mm |
125 Cel |
-55 Cel |
MATTE TIN |
DUAL |
R-PDSO-G5 |
1 |
5.5 V |
1.1 mm |
1.5 mm |
Not Qualified |
2 V |
.04 mA |
e3 |
30 |
260 |
3 mm |
AHC/VHC/H/U/V |
|||||||||
|
Toshiba |
NAND GATE |
4 |
2 |
2.7 |
6 ns |
3.6 V |
2 V |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
GULL WING |
14 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
6 |
CMOS |
1 |
3.3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
19.5 ns |
.65 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.2 mm |
4.4 mm |
2 V |
e3 |
30 |
260 |
5 mm |
LV/LV-A/LVX/H |
||||||||||||||||||
|
|
Diodes Incorporated |
XOR GATE |
AUTOMOTIVE |
GULL WING |
14 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
4 |
CMOS |
2 |
3.3 |
SMALL OUTLINE |
27.5 ns |
1.27 mm |
125 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G14 |
1 |
5.5 V |
1.73 mm |
3.9 mm |
2 V |
e3 |
30 |
260 |
8.635 mm |
LV/LV-A/LVX/H |
|||||||||||||||||||
|
|
Texas Instruments |
BUFFER |
INDUSTRIAL |
NO LEAD |
5 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3.3 |
SMALL OUTLINE |
11 ns |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N5 |
1 |
5.5 V |
1.65 V |
e4 |
30 |
260 |
LVC/LCX/Z |
|||||||||||||||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
BALL |
6 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
3.3 |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
8.2 ns |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-PBGA-B6 |
1 |
5.5 V |
.4 mm |
.9 mm |
1.65 V |
e4 |
30 |
260 |
1.4 mm |
LVC/LCX/Z |
||||||||||||||||||
|
|
Texas Instruments |
NOR GATE |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
3.3 |
SMALL OUTLINE, VERY THIN PROFILE |
9 ns |
32 Amp |
.35 mm |
125 Cel |
-40 Cel |
Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
DUAL |
S-PDSO-N6 |
1 |
5.5 V |
.4 mm |
1 mm |
1.65 V |
e4 |
NOT SPECIFIED |
260 |
1 mm |
LVC/LCX/Z |
||||||||||||||||||
|
|
Onsemi |
NAND GATE |
MILITARY |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
3 |
SMALL OUTLINE, VERY THIN PROFILE |
24.4 ns |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.55 mm |
1 mm |
.9 V |
e4 |
30 |
260 |
1.45 mm |
17SG |
|||||||||||||||||||
|
|
Onsemi |
NOR GATE |
MILITARY |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
2 |
3 |
SMALL OUTLINE, VERY THIN PROFILE |
20.3 ns |
.5 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.55 mm |
1 mm |
.9 V |
e4 |
30 |
260 |
1.45 mm |
17SG |
|||||||||||||||||||
|
|
Onsemi |
INVERTER |
MILITARY |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
NO |
YES |
1 |
CMOS |
1 |
TR |
3 |
1.2/3.3 |
30 pF |
SMALL OUTLINE, VERY THIN PROFILE |
SOLCC6,.04,14 |
22.3 ns |
.3 Amp |
Gates |
.35 mm |
125 Cel |
-55 Cel |
Nickel/Gold/Palladium (Ni/Au/Pd) |
DUAL |
S-PDSO-N6 |
1 |
3.6 V |
.55 mm |
1 mm |
Not Qualified |
.9 V |
30 |
260 |
1 mm |
17SG |
||||||||||||
|
|
Onsemi |
BUFFER |
MILITARY |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3 |
SMALL OUTLINE, VERY THIN PROFILE |
58.1 ns |
.5 mm |
125 Cel |
-55 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.55 mm |
1 mm |
.9 V |
e4 |
30 |
260 |
1.45 mm |
17SG |
|||||||||||||||||||
|
|
Onsemi |
BUFFER |
MILITARY |
GULL WING |
5 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1 |
3 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
58.1 ns |
.65 mm |
125 Cel |
-55 Cel |
Matte Tin (Sn) - annealed |
DUAL |
R-PDSO-G5 |
1 |
3.6 V |
1.1 mm |
1.25 mm |
.9 V |
e3 |
30 |
260 |
2 mm |
17SG |
|||||||||||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
3 |
SMALL OUTLINE |
23 ns |
.3 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.35 mm |
.9 mm |
.8 V |
e4 |
30 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||||||
|
|
Diodes Incorporated |
INVERTER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
3 |
SMALL OUTLINE, VERY THIN PROFILE |
25.8 ns |
.35 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
1 |
3.6 V |
.4 mm |
1 mm |
.8 V |
e4 |
30 |
260 |
1 mm |
AUP/ULP/V |
||||||||||||||||||
|
|
Diodes Incorporated |
BUFFER |
AUTOMOTIVE |
NO LEAD |
6 |
SON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
3 |
SMALL OUTLINE |
25.8 ns |
.3 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.35 mm |
.9 mm |
.8 V |
e4 |
30 |
260 |
1 mm |
AUP/ULP/V |
||||||||||||||||||
|
|
Diodes Incorporated |
BUFFER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
3 |
SMALL OUTLINE, VERY THIN PROFILE |
25.8 ns |
.5 mm |
125 Cel |
OPEN-DRAIN |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-N6 |
1 |
3.6 V |
.4 mm |
1 mm |
.8 V |
e4 |
30 |
260 |
1.4 mm |
AUP/ULP/V |
||||||||||||||||||
|
|
Diodes Incorporated |
BUFFER |
AUTOMOTIVE |
NO LEAD |
6 |
VSON |
SQUARE |
PLASTIC/EPOXY |
YES |
2 |
CMOS |
1 |
3 |
SMALL OUTLINE, VERY THIN PROFILE |
20 ns |
.35 mm |
125 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N6 |
1 |
3.6 V |
.4 mm |
1 mm |
.8 V |
e4 |
30 |
260 |
1 mm |
AUP/ULP/V |
|||||||||||||||||||
|
Texas Instruments |
NAND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
TTL |
2 |
TUBE |
5 |
5 |
50 pF |
IN-LINE |
DIP14,.3 |
6.5 ns |
1 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T14 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
10.2 mA |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
F/FAST |
||||||||||||
|
Texas Instruments |
NOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
4 |
TTL |
2 |
TUBE |
5 |
5 |
50 pF |
IN-LINE |
DIP14,.3 |
6.5 ns |
1 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T14 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
13 mA |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
F/FAST |
||||||||||||
|
Texas Instruments |
NAND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
TTL |
3 |
TUBE |
5 |
5 |
50 pF |
IN-LINE |
DIP14,.3 |
6.5 ns |
1 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T14 |
5.5 V |
5.08 mm |
6.67 mm |
Not Qualified |
4.5 V |
7.7 mA |
e0 |
19.56 mm |
F/FAST |
||||||||||||||
|
Texas Instruments |
AND GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
NO |
3 |
TTL |
3 |
TUBE |
5 |
5 |
50 pF |
IN-LINE |
DIP14,.3 |
7.5 ns |
20 Amp |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
Tin/Lead (Sn/Pb) |
DUAL |
R-GDIP-T14 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
9.7 mA |
e0 |
NOT SPECIFIED |
NOT SPECIFIED |
19.56 mm |
F/FAST |
||||||||||||
|
Texas Instruments |
AND-OR-INVERT GATE |
COMMERCIAL |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
2 |
TTL |
6 |
5 |
5 |
50 pF |
IN-LINE |
DIP14,.3 |
4.5 ns |
20 Amp |
Gates |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-PDIP-T14 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
4.5 V |
7.5 mA |
ASYMMETRICAL INPUTS |
NOT SPECIFIED |
NOT SPECIFIED |
19.305 mm |
F/FAST |
||||||||||||||
|
Texas Instruments |
NAND GATE |
MILITARY |
FLAT |
14 |
DFP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
YES |
2 |
TTL |
4 |
5 |
15 pF |
FLATPACK |
15 ns |
1.27 mm |
125 Cel |
OPEN-COLLECTOR |
-55 Cel |
DUAL |
R-GDFP-F14 |
5.5 V |
2.03 mm |
6.29 mm |
Not Qualified |
4.5 V |
11 mA |
9.21 mm |
TTL/H/L |
|||||||||||||||||||||
|
|
STMicroelectronics |
NOR GATE |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
4 |
CMOS |
2 |
TUBE |
5 |
5/15 |
50 pF |
IN-LINE |
DIP14,.3 |
200 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T14 |
20 V |
5.1 mm |
7.62 mm |
Not Qualified |
3 V |
e4 |
4000/14000/40000 |
||||||||||||||||
|
|
STMicroelectronics |
INVERTER |
MILITARY |
THROUGH-HOLE |
14 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
NO |
6 |
CMOS |
1 |
TUBE |
5 |
5/15 |
50 pF |
IN-LINE |
DIP14,.3 |
280 ns |
Gates |
2.54 mm |
125 Cel |
-55 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T14 |
20 V |
5.1 mm |
7.62 mm |
Not Qualified |
3 V |
e4 |
4000/14000/40000 |
||||||||||||||||
|
|
STMicroelectronics |
NAND GATE |
MILITARY |
THROUGH-HOLE |
8 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
NO |
2 |
CMOS |
2 |
TUBE |
5 |
5/15 |
50 pF |
IN-LINE |
DIP8,.3 |
200 ns |
Gates |
2.54 mm |
125 Cel |
OPEN-DRAIN |
-55 Cel |
MATTE TIN |
DUAL |
R-PDIP-T8 |
20 V |
4.8 mm |
7.62 mm |
Not Qualified |
3 V |
e3 |
4000/14000/40000 |
Logic gates are electronic circuits that perform basic logical operations on one or more inputs to produce a single output. They are the building blocks of digital circuits and are used to implement digital logic functions, such as AND, OR, NOT, XOR, and NAND.
Logic gates are designed using various technologies, including transistor-transistor logic (TTL), complementary metal-oxide-semiconductor (CMOS), and field-programmable gate arrays (FPGAs). They can be classified into three main types based on their operation: combinational logic gates, sequential logic gates, and programmable logic gates.
Combinational logic gates are logic gates that produce an output based solely on the current input values. These gates include the AND gate, OR gate, NOT gate, XOR gate, and NAND gate. The output of a combinational logic gate depends on the input values and the logic function implemented by the gate.
Sequential logic gates are logic gates that have memory elements and can store information. These gates include the SR flip-flop, D flip-flop, JK flip-flop, and T flip-flop. The output of a sequential logic gate depends on the current input values and the previous state of the gate.
Programmable logic gates are logic gates that can be programmed to implement different logic functions. These gates include programmable logic arrays (PLAs), programmable array logic (PALs), and field-programmable gate arrays (FPGAs). Programmable logic gates can be reprogrammed to adapt to changing system requirements.
Logic gates are used in various applications, including digital signal processing, control systems, and memory systems. They are essential components of digital systems and can be found in many electronic devices, such as computers, mobile phones, and digital cameras.