SYNCHRONOUS DRAM DRAM 387

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

MT48LC32M8A2P-75IT:DTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

32MX8

32M

-40 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e3

30

260

22.22 mm

5.4 ns

MT48H16M16LFBF-75:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B54

1.95 V

1 mm

8 mm

Not Qualified

268435456 bit

1.7 V

AUTO/SELF REFRESH

e1

9 mm

6 ns

MT48LC32M16A2P-75:CTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

32MX16

32M

0 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

e3

30

260

22.22 mm

5.4 ns

MT48LC4M32LFB5-8IT:GTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX32

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

8 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e1

13 mm

7 ns

MT48H16M32LFCM-6IT:B

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

105 mA

16777216 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

166 MHz

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

1,2,4,8

13 mm

5 ns

MT48H32M16LFBF-6:B

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

VFBGA

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

100 mA

33554432 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

32MX16

32M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B54

1.95 V

1 mm

166 MHz

8 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

.00001 Amp

1,2,4,8

9 mm

5 ns

MT48H16M32LFCM-75IT:ATR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX32

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

10 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e1

13 mm

6 ns

MT48H8M16LFB4-8ITTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

1.95 V

1 mm

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

8 mm

7 ns

MT48H8M16LFB4-8IT:JTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

1.95 V

1 mm

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

8 mm

6 ns

MT48LC16M16A2BG-75IT:DTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX16

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B54

3.6 V

1 mm

8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e1

14 mm

5.4 ns

MT48LC16M16A2FG-75IT:DTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX16

16M

-40 Cel

TIN LEAD SILVER

BOTTOM

1

R-PBGA-B54

3.6 V

1 mm

8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e0

14 mm

5.4 ns

MT48LC16M16A2P-75IT:DTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

270 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e3

30

260

.002 Amp

1,2,4,8

22.22 mm

5.4 ns

MT48LC16M16A2TG-75IT:DTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

8192

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

270 mA

16777216 words

1,2,4,8,FP

YES

COMMON

3.3

3.3

16

SMALL OUTLINE, THIN PROFILE

TSOP54,.46,32

DRAMs

.8 mm

85 Cel

3-STATE

16MX16

16M

-40 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

133 MHz

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e0

.002 Amp

1,2,4,8

22.22 mm

5.4 ns

MT48LC16M16A2TG-7E:DTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

16MX16

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.4 ns

MT48LC16M8A2TG-75:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

16777216 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

16MX8

16M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.4 ns

MT48LC2M32B2TG-6:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

86

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

2097152 words

YES

3.3

32

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

70 Cel

2MX32

2M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G86

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

30

235

22.22 mm

5.5 ns

MT48LC4M16A2P-75IT:GTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

4194304 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

4MX16

4M

-40 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e3

30

260

22.22 mm

5.4 ns

MT48LC4M16A2TG-75:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

4194304 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

4MX16

4M

0 Cel

Tin/Lead (Sn/Pb)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

30

235

22.22 mm

5.4 ns

MT48LC4M16A2TG-7E:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

4194304 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

4MX16

4M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.4 ns

MT48LC4M32B2F5-7IT:GTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

4194304 words

YES

3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

4MX32

4M

-40 Cel

TIN LEAD SILVER

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

8 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

13 mm

5.5 ns

MT48LC4M32B2TG-7:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

86

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

4194304 words

YES

3.3

32

SMALL OUTLINE, THIN PROFILE

.5 mm

70 Cel

4MX32

4M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G86

3.6 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.5 ns

MT48LC4M32B2TG-7IT:GTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

86

TSSOP

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

4194304 words

YES

3.3

32

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

.5 mm

85 Cel

4MX32

4M

-40 Cel

TIN LEAD

DUAL

1

R-PDSO-G86

3.6 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.5 ns

MT48LC4M32LFF5-8IT:GTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

8388608 words

YES

3.3

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX32

8M

-40 Cel

TIN LEAD SILVER

BOTTOM

1

R-PBGA-B90

3.6 V

1 mm

8 mm

Not Qualified

268435456 bit

3 V

AUTO/SELF REFRESH

e0

13 mm

7 ns

MT48LC8M16A2P-75IT:GTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

8MX16

8M

-40 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e3

30

260

22.22 mm

5.4 ns

MT48LC8M16A2TG-75:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

8MX16

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.4 ns

MT48LC8M16A2TG-75IT:GTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

8MX16

8M

-40 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.4 ns

MT48LC8M16A2TG-7E:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

8MX16

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

134217728 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.4 ns

MT48LC8M8A2TG-75:GTR

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

8388608 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

70 Cel

8MX8

8M

0 Cel

TIN LEAD

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

67108864 bit

3 V

AUTO/SELF REFRESH

e0

22.22 mm

5.4 ns

IS42S16160J-6BL

Integrated Silicon Solution

SYNCHRONOUS DRAM

COMMERCIAL

54

TFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

3.6 V

1.2 mm

8 mm

268435456 bit

3 V

PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH

e1

260

8 mm

5.4 ns

IS42S16160J-7BL

Integrated Silicon Solution

SYNCHRONOUS DRAM

COMMERCIAL

54

TFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

70 Cel

16MX16

16M

0 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

3.6 V

1.2 mm

8 mm

268435456 bit

3 V

PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH

e1

260

8 mm

5.4 ns

IS42S32800J-7BL

Integrated Silicon Solution

SYNCHRONOUS DRAM

COMMERCIAL

90

TFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

170 mA

8388608 words

1,2,4,8,FP

YES

COMMON

3.3

32

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA90,9X15,32

.8 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B90

3

3.6 V

1.2 mm

143 MHz

8 mm

268435456 bit

3 V

AUTO/SELF REFRESH

e1

10

260

.004 Amp

1,2,4,8

13 mm

5.4 ns

IS42S32800J-7TL

Integrated Silicon Solution

SYNCHRONOUS DRAM

COMMERCIAL

86

TSOP2

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

170 mA

8388608 words

1,2,4,8,FP

YES

COMMON

3.3

32

SMALL OUTLINE, THIN PROFILE

TSSOP86,.46,20

.5 mm

70 Cel

3-STATE

8MX32

8M

0 Cel

Tin (Sn)

DUAL

1

R-PDSO-G86

3

3.6 V

1.2 mm

143 MHz

10.16 mm

268435456 bit

3 V

AUTO/SELF REFRESH

e3

10

260

.004 Amp

1,2,4,8

22.22 mm

5.4 ns

MT48LC16M8A2BB-6AAAT:L

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

16777216 words

YES

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

105 Cel

16MX8

16M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

8 mm

134217728 bit

3 V

AUTO/SELF REFRESH

e1

30

260

16 mm

5.4 ns

MT48LC16M8A2BB-6AAIT:L

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

60

TFBGA

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

16777216 words

YES

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

.8 mm

85 Cel

16MX8

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B60

3.6 V

1.2 mm

8 mm

134217728 bit

3 V

AUTO/SELF REFRESH

e1

30

260

16 mm

5.4 ns

MT48LC16M8A2P-6AAIT:L

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

AEC-Q100

GULL WING

SYNCHRONOUS

16777216 words

YES

3.3

8

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

16MX8

16M

-40 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

134217728 bit

3 V

AUTO/SELF REFRESH

e3

30

260

22.22 mm

5.4 ns

MT48LC8M16A2B4-6AAIT:L

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

AEC-Q100

BALL

SYNCHRONOUS

8388608 words

YES

3.3

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.8 mm

85 Cel

8MX16

8M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

S-PBGA-B54

3.6 V

1 mm

8 mm

134217728 bit

3 V

AUTO/SELF REFRESH

e1

30

260

8 mm

5.4 ns

MT48LC8M16A2P-6AAIT:L

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

AEC-Q100

GULL WING

SYNCHRONOUS

8388608 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

8MX16

8M

-40 Cel

Matte Tin (Sn)

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

134217728 bit

3 V

AUTO/SELF REFRESH

e3

30

260

22.22 mm

5.4 ns

MT48LC32M16A2P-75IT:CTR

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

TSOP2

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

GULL WING

SYNCHRONOUS

33554432 words

YES

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

85 Cel

32MX16

32M

-40 Cel

MATTE TIN

DUAL

1

R-PDSO-G54

3.6 V

1.2 mm

10.16 mm

Not Qualified

536870912 bit

3 V

AUTO/SELF REFRESH

e3

22.22 mm

5.4 ns

MT48H4M32LFB5-6IT:K

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

100 mA

4194304 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

166 MHz

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

.0002 Amp

1,2,4,8

13 mm

5 ns

MT48H4M32LFB5-75:K

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

90 mA

4194304 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

70 Cel

3-STATE

4MX32

4M

0 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

.0002 Amp

1,2,4,8

13 mm

5.4 ns

MT48H4M32LFB5-75IT:K

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

90

VFBGA

4096

RECTANGULAR

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

90 mA

4194304 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

32

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA90,9X15,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX32

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

R-PBGA-B90

1.95 V

1 mm

133 MHz

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

.0002 Amp

1,2,4,8

13 mm

5.4 ns

MT48H8M16LFB4-6IT:K

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

80 mA

8388608 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX16

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

1.95 V

1 mm

166 MHz

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

.0002 Amp

1,2,4,8

8 mm

5 ns

MT48H8M16LFB4-75:K

Micron Technology

SYNCHRONOUS DRAM

COMMERCIAL

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

70 mA

8388608 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

70 Cel

3-STATE

8MX16

8M

0 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

1.95 V

1 mm

133 MHz

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

.0002 Amp

1,2,4,8

8 mm

5.4 ns

MT48H8M16LFB4-75IT:K

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

70 mA

8388608 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

8MX16

8M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

1.95 V

1 mm

133 MHz

8 mm

Not Qualified

134217728 bit

1.7 V

AUTO/SELF REFRESH

e1

30

260

.0002 Amp

1,2,4,8

8 mm

5.4 ns

MT48H4M16LFB4-8IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

80 mA

4194304 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

1.9 V

1 mm

125 MHz

8 mm

Not Qualified

67108864 bit

1.7 V

AUTO/SELF REFRESH

e1

260

.00001 Amp

1,2,4,8

8 mm

6 ns

MT48H4M16LFB4-8

Micron Technology

SYNCHRONOUS DRAM

OTHER

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

80 mA

4194304 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN SILVER COPPER

BOTTOM

1

S-PBGA-B54

1.9 V

1 mm

125 MHz

8 mm

Not Qualified

67108864 bit

1.7 V

AUTO/SELF REFRESH

e1

260

.00001 Amp

1,2,4,8

8 mm

6 ns

MT48H4M16LFF4-10IT

Micron Technology

SYNCHRONOUS DRAM

INDUSTRIAL

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

80 mA

4194304 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

TIN LEAD

BOTTOM

1

S-PBGA-B54

1.9 V

1 mm

104 MHz

8 mm

Not Qualified

67108864 bit

1.7 V

AUTO/SELF REFRESH

e0

.00001 Amp

1,2,4,8

8 mm

7 ns

MT48H4M16LFF4-10

Micron Technology

SYNCHRONOUS DRAM

OTHER

54

VFBGA

4096

SQUARE

PLASTIC/EPOXY

FOUR BANK PAGE BURST

YES

1

CMOS

BALL

SYNCHRONOUS

80 mA

4194304 words

1,2,4,8,FP

YES

COMMON

1.8

1.8

16

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA54,9X9,32

DRAMs

.8 mm

85 Cel

3-STATE

4MX16

4M

-25 Cel

TIN LEAD

BOTTOM

1

S-PBGA-B54

1.9 V

1 mm

104 MHz

8 mm

Not Qualified

67108864 bit

1.7 V

AUTO/SELF REFRESH

e0

.00001 Amp

1,2,4,8

8 mm

7 ns

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.