200 DRAM 146

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Nominal Negative Supply Voltage Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position No. of Ports JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Maximum Clock Frequency (fCLK) Width Qualification Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Interleaved Burst Length Length Maximum Access Time

MT8VDDT6464HDY-40BF2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1940 mA

67108864 words

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

200 MHz

Not Qualified

4294967296 bit

.04 Amp

.7 ns

MT18VDDF12872HY-40BF1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

6210 mA

134217728 words

COMMON

2.6

2.6

72

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

R-PDMA-N200

200 MHz

Not Qualified

9663676416 bit

.09 Amp

.7 ns

MT16HTF12864HZ-667G1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1976 mA

134217728 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

R-PDMA-N200

333 MHz

Not Qualified

8589934592 bit

.112 Amp

.45 ns

MT8VDDT6464HDY-40BJ1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1940 mA

67108864 words

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

200 MHz

Not Qualified

4294967296 bit

.04 Amp

.7 ns

MT9HTF6472RHZ-667G1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1260 mA

67108864 words

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX72

64M

0 Cel

DUAL

R-PDMA-N200

333 MHz

Not Qualified

4831838208 bit

.063 Amp

.45 ns

MT4VDDT3264HIY-335J1

Micron Technology

DDR DRAM MODULE

INDUSTRIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1620 mA

33554432 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

85 Cel

3-STATE

32MX64

32M

-40 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

2147483648 bit

.7 ns

MT4VDDT3264HY-335J1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1620 mA

33554432 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

2147483648 bit

.7 ns

MT8VDDT6464HY-335J1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

3240 mA

67108864 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

4294967296 bit

.04 Amp

.7 ns

MT16HTS25664HY-667A1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

2336 mA

268435456 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

256MX64

256M

0 Cel

MATTE TIN

DUAL

R-PDMA-N200

1

333 MHz

Not Qualified

17179869184 bit

e3

.112 Amp

MT16VDDF12864HY-40BJ1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

5520 mA

134217728 words

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

MATTE TIN

DUAL

R-PDMA-N200

1

200 MHz

Not Qualified

8589934592 bit

e3

.08 Amp

.7 ns

MT18HTS25672RHZ-80EH1

Micron Technology

SYNCHRONOUS DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3123 mA

268435456 words

YES

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM200,24

Other Memory ICs

.6 mm

70 Cel

3-STATE

256MX72

256M

0 Cel

MATTE TIN

ZIG-ZAG

1

R-XZMA-N200

1

1.9 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

19327352832 bit

1.7 V

AUTO/SELF REFRESH; WD-MAX

e3

67.6 mm

.4 ns

MT4HTF3264HZ-667G1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1400 mA

33554432 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

MATTE TIN

DUAL

R-PDMA-N200

1

333 MHz

Not Qualified

2147483648 bit

e3

.028 Amp

.45 ns

MT4HTF3264HZ-800G1

Micron Technology

DDR DRAM MODULE

OTHER

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1480 mA

33554432 words

YES

COMMON

1.8

1.8

16

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

85 Cel

3-STATE

32MX16

32M

0 Cel

MATTE TIN

DUAL

1

R-PDMA-N200

1

3.6 V

30.15 mm

400 MHz

2.45 mm

Not Qualified

536870912 bit

1.7 V

AUTO/SELF REFRESH

e3

.028 Amp

67.6 mm

.4 ns

MT4HTF6464HZ-800H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1760 mA

67108864 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

MATTE TIN

ZIG-ZAG

1

R-XZMA-N200

1

1.9 V

30.15 mm

400 MHz

2.45 mm

Not Qualified

4294967296 bit

1.7 V

SELF REFRESH; WD-MAX

e3

.028 Amp

67.6 mm

MT8HTF12864HZ-667H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2240 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

MATTE TIN

ZIG-ZAG

1

R-XZMA-N200

1

1.9 V

30.15 mm

333 MHz

3.8 mm

Not Qualified

8589934592 bit

1.7 V

SELF REFRESH; WD-MAX

e3

.056 Amp

67.6 mm

MT8HTF12864HZ-800H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2680 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

MATTE TIN

ZIG-ZAG

1

R-XZMA-N200

1

1.9 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

8589934592 bit

1.7 V

SELF REFRESH; WD-MAX

e3

.056 Amp

67.6 mm

MT16HTF51264HZ-800C1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

536870912 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

512MX64

512M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

1.9 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

34359738368 bit

1.7 V

AUTO/SELF REFRESH; WD-MAX

e4

67.6 mm

.4 ns

MT16HTF25664HIZ-667H1

Micron Technology

DDR DRAM MODULE

INDUSTRIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3440 mA

268435456 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

85 Cel

3-STATE

256MX64

256M

-40 Cel

Gold (Au)

ZIG-ZAG

1

R-XZMA-N200

1.9 V

30.15 mm

333 MHz

3.8 mm

Not Qualified

17179869184 bit

1.7 V

SELF REFRESH; WD-MAX

e4

.112 Amp

67.6 mm

MT16VDDF12864HY-40BF2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

5520 mA

134217728 words

YES

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

31.9 mm

200 MHz

3.8 mm

Not Qualified

8589934592 bit

AUTO/SELF REFRESH; WD-MAX

e4

.08 Amp

67.6 mm

.7 ns

MT4VDDT3264HY-335F2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1620 mA

33554432 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

2.7 V

31.9 mm

167 MHz

2.45 mm

Not Qualified

2147483648 bit

2.3 V

AUTO/SELF REFRESH; WD-MAX

e4

67.6 mm

.7 ns

MT4VDDT3264HY-40BJ1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1920 mA

33554432 words

YES

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

2.7 V

31.9 mm

200 MHz

2.45 mm

Not Qualified

2147483648 bit

2.5 V

AUTO/SELF REFRESH; WD-MAX

e4

67.6 mm

.7 ns

MT16HTF25664HZ-667H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

3440 mA

268435456 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

256MX64

256M

0 Cel

DUAL

R-PDMA-N200

333 MHz

Not Qualified

17179869184 bit

30

260

.112 Amp

MT16HTF25664HZ-800H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3760 mA

268435456 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

256MX64

256M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

1.9 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

17179869184 bit

1.7 V

AUTO/SELF REFRESH; WD-MAX

e4

.112 Amp

67.6 mm

MT8HTF12864HDZ-667H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1430 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.45 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

3.6 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

8589934592 bit

1.7 V

AUTO/SELF REFRESH; WD-MAX

e4

.056 Amp

67.6 mm

.4 ns

MT8HTF12864HDZ-800H1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1790 mA

134217728 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.45 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

3.6 V

30.15 mm

400 MHz

3.8 mm

Not Qualified

8589934592 bit

1.7 V

SELF REFRESH; WD-MAX

e4

.056 Amp

67.6 mm

.4 ns

MT9HTF12872RHZ-80EH1

Micron Technology

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1890 mA

134217728 words

COMMON

1.8

1.8

72

MICROELECTRONIC ASSEMBLY

DIMM200,24

Other Memory ICs

.6 mm

70 Cel

3-STATE

128MX72

128M

0 Cel

DUAL

R-PDMA-N200

400 MHz

Not Qualified

9663676416 bit

30

260

.063 Amp

.4 ns

MT8HTF6464HDY-667D3

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

1480 mA

67108864 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

GOLD

DUAL

1

R-XDMA-N200

1.9 V

3.8 mm

333 MHz

30.5 mm

Not Qualified

4294967296 bit

1.7 V

AUTO/SELF REFRESH

e4

.056 Amp

67.6 mm

.45 ns

MT8HTF6464HDY-53ED3

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1380 mA

67108864 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

266 MHz

Not Qualified

4294967296 bit

.056 Amp

.5 ns

MT4HTF3264HY-53ED3

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1360 mA

33554432 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

R-PDMA-N200

267 MHz

Not Qualified

2147483648 bit

.028 Amp

.5 ns

MT16VDDF12864HG-335D2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3280 mA

134217728 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

TIN LEAD

DUAL

1

R-XDMA-N200

2.7 V

167 MHz

Not Qualified

8589934592 bit

2.3 V

AUTO/SELF REFRESH

e0

.08 Amp

.7 ns

MT16HTS51264HY-667A1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

2824 mA

536870912 words

YES

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

512MX64

512M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

1.9 V

3.8 mm

333 MHz

30 mm

Not Qualified

34359738368 bit

1.7 V

AUTO/SELF REFRESH

e4

.128 Amp

67.6 mm

.45 ns

MT16VDDF12864HY-335F2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

4640 mA

134217728 words

YES

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

2.7 V

167 MHz

Not Qualified

8589934592 bit

2.3 V

AUTO/SELF REFRESH

e4

.08 Amp

.7 ns

MT8VDDT6464HDG-40BF2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1940 mA

67108864 words

COMMON

2.6

2.6

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

200 MHz

Not Qualified

4294967296 bit

.04 Amp

.7 ns

MT8VDDT6464HDG-335F2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1640 mA

67108864 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

4294967296 bit

.04 Amp

.7 ns

MT8VDDT3264HY-335G3

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

3280 mA

33554432 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

2147483648 bit

.7 ns

MT4VDDT3264HG-335F2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1620 mA

33554432 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

32MX64

32M

0 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

2147483648 bit

.7 ns

MT16VDDF6464HY-335G2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

4080 mA

67108864 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

4294967296 bit

.064 Amp

.7 ns

MT16VDDF6464HG-335G2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

4080 mA

67108864 words

COMMON

2.5

2.5

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

167 MHz

Not Qualified

4294967296 bit

.064 Amp

.7 ns

MT9VDDT6472HY-335F2

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

3645 mA

67108864 words

YES

COMMON

2.5

2.5

72

MICROELECTRONIC ASSEMBLY

DIMM200,24

Other Memory ICs

.6 mm

70 Cel

3-STATE

64MX72

64M

0 Cel

GOLD

ZIG-ZAG

1

R-XZMA-N200

2.7 V

3.8 mm

166 MHz

31.75 mm

Not Qualified

4831838208 bit

2.3 V

AUTO/SELF REFRESH

e4

.045 Amp

67.6 mm

.7 ns

MT18VDDF12872HY-335F1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

2.5

72

MICROELECTRONIC ASSEMBLY

70 Cel

128MX72

128M

0 Cel

Gold (Au)

DUAL

1

R-XDMA-N200

2.7 V

Not Qualified

9663676416 bit

2.3 V

AUTO/SELF REFRESH

e4

30

260

MT8HTF6464HDY-53EB3

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1680 mA

67108864 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

65 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

267 MHz

Not Qualified

4294967296 bit

.04 Amp

.5 ns

MT16HTF12864HY-667B3

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

3360 mA

134217728 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

65 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

R-PDMA-N200

333 MHz

Not Qualified

8589934592 bit

.08 Amp

.45 ns

MT8HTF6464HDY-667B3

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1760 mA

67108864 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

65 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

333 MHz

Not Qualified

4294967296 bit

.04 Amp

.45 ns

MT8HTF12864HDY-667E1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

2160 mA

134217728 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

128MX64

128M

0 Cel

DUAL

R-PDMA-N200

333 MHz

Not Qualified

8589934592 bit

.056 Amp

.45 ns

MT4HTF6464HY-667E1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

8192

RECTANGULAR

PLASTIC/EPOXY

NO

CMOS

NO LEAD

1400 mA

67108864 words

COMMON

1.8

1.8

64

MICROELECTRONIC ASSEMBLY

DIMM200,24

DRAMs

.6 mm

70 Cel

3-STATE

64MX64

64M

0 Cel

DUAL

R-PDMA-N200

333 MHz

Not Qualified

4294967296 bit

.028 Amp

.45 ns

MT18HTS25672RHZ-80EM1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

268435456 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

70 Cel

256MX72

256M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1.9 V

30.15 mm

3.8 mm

19327352832 bit

1.7 V

PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH; WD-MAX

67.6 mm

MT8HTF12864HDZ-800M1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

RECTANGULAR

UNSPECIFIED

DUAL BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.8

64

MICROELECTRONIC ASSEMBLY

70 Cel

128MX64

128M

0 Cel

DUAL

1

R-XDMA-N200

1.9 V

30.15 mm

3.8 mm

8589934592 bit

1.7 V

PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH; WD-MAX

67.6 mm

MT9HTF12872RHZ-80EM1

Micron Technology

DDR DRAM MODULE

COMMERCIAL

200

DIMM

RECTANGULAR

UNSPECIFIED

SINGLE BANK PAGE BURST

NO

1

CMOS

NO LEAD

SYNCHRONOUS

134217728 words

YES

1.8

72

MICROELECTRONIC ASSEMBLY

70 Cel

128MX72

128M

0 Cel

ZIG-ZAG

1

R-XZMA-N200

1.9 V

30.15 mm

3.8 mm

9663676416 bit

1.7 V

PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH; WD-MAX

67.6 mm

DRAM

DRAM, or Dynamic Random Access Memory, is a type of volatile computer memory that stores data in a digital format. It is commonly used in personal computers, laptops, mobile devices, and other digital devices.

DRAM stores digital data as a charge on a capacitor. Each capacitor in DRAM represents one bit of data, and the state of the capacitor is refreshed periodically to maintain its charge. The refreshing process is necessary because the charge on the capacitor leaks over time, leading to data loss. The refreshing process is managed by a control circuitry that is integrated into the DRAM module.

DRAM is an important component of modern computer systems because it provides fast access to data for the processor. DRAM access times are measured in nanoseconds, which is much faster than access times for secondary storage devices like hard drives or solid-state drives. DRAM is also cheaper and more energy-efficient than other types of computer memory.

There are different types of DRAM, including SDRAM (Synchronous DRAM), DDR SDRAM (Double Data Rate Synchronous DRAM), and GDDR SDRAM (Graphics Double Data Rate Synchronous DRAM). These different types of DRAM have different characteristics, such as speed, capacity, and power consumption, and are used in different types of computer systems.

One of the disadvantages of DRAM is that it is volatile, which means that it loses data when the power is turned off. To prevent data loss, DRAM is typically used in conjunction with non-volatile storage devices like hard drives or solid-state drives, which can store data even when the power is turned off.