MILITARY EEPROM 11

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

25LC512-M/SN

Microchip Technology

EEPROM

MILITARY

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

10 mA

65536 words

5

8

SMALL OUTLINE

SOP8,.23

200

1.27 mm

125 Cel

64KX8

64K

-55 Cel

MATTE TIN

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

10 MHz

3.9 mm

5 ms

SPI

524288 bit

2.5 V

e3

30

260

.00002 Amp

4.9 mm

5

25LC512T-M/SN

Microchip Technology

EEPROM

MILITARY

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

10 mA

65536 words

5

8

SMALL OUTLINE

SOP8,.23

200

1.27 mm

125 Cel

64KX8

64K

-55 Cel

MATTE TIN

DUAL

1

HARDWARE

R-PDSO-G8

3

5.5 V

1.75 mm

1000000 Write/Erase Cycles

10 MHz

3.9 mm

5 ms

SPI

524288 bit

2.5 V

e3

.00002 Amp

4.9 mm

5

24LC16B-M/SN

Microchip Technology

EEPROM

MILITARY

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

5

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

125 Cel

OPEN-DRAIN

2KX8

2K

-55 Cel

Matte Tin (Sn)

1010MMMR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

16384 bit

2.5 V

e3

30

260

.000001 Amp

4.9 mm

5

24LC16BT-M/SN

Microchip Technology

EEPROM

MILITARY

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

3 mA

2048 words

5

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

125 Cel

2KX8

2K

-55 Cel

Matte Tin (Sn)

1010MMMR

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

.4 MHz

3.9 mm

Not Qualified

5 ms

I2C

16384 bit

2.5 V

e3

30

260

.000005 Amp

4.9 mm

5

XQ18V04VQ44N

Xilinx

CONFIGURATION MEMORY

MILITARY

44

TQFP

SQUARE

40k Rad(Si)

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL/SERIAL

SYNCHRONOUS

50 mA

524288 words

3.3

2.5/3.3

8

FLATPACK, THIN PROFILE

TQFP44,.47SQ,32

Flash Memories

10

.8 mm

125 Cel

512KX8

512K

-55 Cel

Tin/Lead (Sn85Pb15)

QUAD

S-PQFP-G44

3

3.6 V

1.2 mm

20000 Write/Erase Cycles

20 MHz

10 mm

Not Qualified

4194304 bit

3 V

e0

30

240

NOR TYPE

.02 Amp

10 mm

25LC640A-M/SN

Microchip Technology

EEPROM

MILITARY

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

5 mA

8192 words

5

3/5

8

SMALL OUTLINE

SOP8,.23

EEPROMs

200

1.27 mm

125 Cel

8KX8

8K

-55 Cel

Matte Tin (Sn)

DUAL

1

HARDWARE

R-PDSO-G8

1

5.5 V

1.75 mm

1000000 Write/Erase Cycles

10 MHz

3.9 mm

Not Qualified

5 ms

SPI

65536 bit

4.5 V

2.5V TO 4.5V @ 5MHz

e3

30

260

.000005 Amp

4.9 mm

5

XQF32PVOG48M

Xilinx

CONFIGURATION MEMORY

MILITARY

48

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL/SERIAL

SYNCHRONOUS

40 mA

33554432 words

1.8

1.8/3.3,1.8

1

SMALL OUTLINE

TSSOP48,.8,20

Flash Memories

20

.5 mm

125 Cel

32MX1

32M

-55 Cel

NICKEL PALLADIUM GOLD

DUAL

R-PDSO-G48

3

2 V

20000 Write/Erase Cycles

Not Qualified

33554432 bit

1.65 V

e4

30

260

NOR TYPE

30 ns

AT28C256-15DM/883-815

Microchip Technology

EEPROM

MILITARY

28

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

MIL-STD-883 Class C

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

32768 words

5

8

IN-LINE

2.54 mm

125 Cel

32KX8

32K

-55 Cel

TIN LEAD

DUAL

R-GDIP-T28

5.5 V

5.72 mm

15.24 mm

10 ms

262144 bit

4.5 V

e0

37.215 mm

150 ns

5

25LC512-E/SN16KVAO

Microchip Technology

EEPROM

MILITARY

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

10 mA

65536 words

5

8

SMALL OUTLINE

SOP8,.25

200

1.27 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

5.5 V

1.75 mm

1000000 Write/Erase Cycles

20 MHz

3.9 mm

5 ms

SPI

524288 bit

4.5 V

2.5V TO 5.5V @ 10MHz

.00001 Amp

4.9 mm

5

25LC512T-E/SN16KVAO

Microchip Technology

EEPROM

MILITARY

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

10 mA

65536 words

5

8

SMALL OUTLINE

SOP8,.25

200

1.27 mm

125 Cel

3-STATE

64KX8

64K

-40 Cel

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

5.5 V

1.75 mm

1000000 Write/Erase Cycles

20 MHz

3.9 mm

5 ms

SPI

524288 bit

4.5 V

2.5V TO 5.5V @ 10MHz

.00001 Amp

4.9 mm

5

AT28C256F-15DM/883-815

Microchip Technology

EEPROM

MILITARY

28

DIP

RECTANGULAR

CERAMIC, GLASS-SEALED

NO

1

CMOS

MIL-STD-883 Class B

THROUGH-HOLE

PARALLEL

ASYNCHRONOUS

50 mA

32768 words

5

YES

8

IN-LINE

DIP28,.6

10

2.54 mm

125 Cel

32KX8

32K

-55 Cel

NO

DUAL

1

R-GDIP-T28

5.5 V

5.72 mm

10000 Write/Erase Cycles

15.24 mm

3 ms

262144 bit

4.5 V

AUTOMATIC WRITE

64

.0003 Amp

37.215 mm

150 ns

5

YES

EEPROM

EEPROM, or Electrically Erasable Programmable Read-Only Memory, is a type of non-volatile computer memory that can store and retrieve data even when the power is turned off. EEPROM is commonly used in digital devices, such as computers, mobile phones, and digital cameras, to store configuration data, firmware, and other important information.

EEPROM works by storing data in a grid of memory cells that can be individually programmed and erased using electrical signals. Each memory cell consists of a transistor and a floating gate. The floating gate can hold an electric charge, which determines the state of the memory cell. To write data to the EEPROM, an electrical signal is applied to the transistor, which charges or discharges the floating gate. To read data from the EEPROM, an electrical signal is applied to the transistor, which determines the state of the floating gate.

One of the advantages of EEPROM is that it is non-volatile, which means that it can store data even when the power is turned off. This makes it ideal for storing critical data, such as system settings and firmware, that must be retained even in the absence of power.

EEPROM can also be reprogrammed and erased many times, which makes it a versatile and flexible memory technology. EEPROM can be programmed and erased in blocks or individually, depending on the specific requirements of the application.

One of the disadvantages of EEPROM is that it is slower than other types of computer memory, such as RAM or cache memory. EEPROM access times are measured in microseconds, which is much slower than access times for other types of memory. This makes EEPROM less suitable for applications that require high-speed data access.