32 FIFO 32

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Maximum Standby Current	Length	Maximum Access Time
7200L15JGI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	J BEND		ASYNCHRONOUS	80 mA	256 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		256X9	256	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	1			40 MHz		Not Qualified				e3	30	260		.005 Amp		15 ns
CY7C4201-15JC	Cypress Semiconductor	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS	130 mA	256 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	256X9	256	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3	5.5 V	3.55 mm	66.7 MHz	11.43 mm	Not Qualified	2304 bit	4.5 V		e0			YES	.028 Amp	13.97 mm	10 ns
SN74ACT7200L-50RJR	Texas Instruments		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	65 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		256 words	5		9	CHIP CARRIER			1.27 mm	70 Cel	3-STATE	256X9	256	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.4554 mm	Not Qualified	2304 bit	4.5 V	RETRANSMIT				NO		13.995 mm	50 ns
SN74ACT7201LA-25RJR	Texas Instruments		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		512 words	5		9	CHIP CARRIER			1.27 mm	70 Cel	3-STATE	512X9	512	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm		11.4554 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT				NO		13.995 mm	25 ns
SN74ACT72211L-20RJ	Texas Instruments	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	20 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS	140 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	512X9	512	0 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.56 mm	50 MHz	11.4554 mm	Not Qualified	4608 bit	4.5 V		e0			YES		13.995 mm	12 ns
SN74ACT72241L-20RJ	Texas Instruments	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	20 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS	160 mA	4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	4KX9	4K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32		5.5 V	3.56 mm	50 MHz	11.4554 mm	Not Qualified	36864 bit	4.5 V		e0			YES		13.995 mm	12 ns
CY7C4291V-15JC	Cypress Semiconductor	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS	25 mA	131072 words	3.3	3.3	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel	3-STATE	128KX9	128K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	3	3.6 V	3.556 mm	66 MHz	11.43 mm	Not Qualified	1179648 bit	3 V		e0			YES	.004 Amp	13.97 mm	10 ns
SN74ACT7200L35RJ	Texas Instruments	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	45 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	256 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		256X9	256	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	22.2 MHz	11.4554 mm	Not Qualified	2304 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	NO	.008 Amp	13.995 mm	35 ns
SN74ACT7204L35RJ	Texas Instruments		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		4096 words	5		9	CHIP CARRIER				70 Cel		4KX9	4K	0 Cel		QUAD	R-PQCC-J32		5.5 V				Not Qualified	36864 bit	4.5 V					NO
SN74ACT72211L35RJ	Texas Instruments		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES		1	CMOS	J BEND	PARALLEL	SYNCHRONOUS		512 words	5		9	CHIP CARRIER				70 Cel		512X9	512	0 Cel		QUAD	R-PQCC-J32		5.5 V				Not Qualified	4608 bit	4.5 V					YES
SN74ACT7202LA15RJ	Texas Instruments	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		1KX9	1K	0 Cel		QUAD	R-PQCC-J32		5.5 V	3.56 mm	40 MHz	11.4554 mm	Not Qualified	9216 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	NO	.0005 Amp	13.995 mm	15 ns
SN74ACT7204L15RJ	Texas Instruments	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		4KX9	4K	0 Cel		QUAD	R-PQCC-J32		5.5 V		40 MHz		Not Qualified	36864 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	NO	.002 Amp		15 ns
SN74ACT7204L25RJ	Texas Instruments	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		4KX9	4K	0 Cel		QUAD	R-PQCC-J32		5.5 V		28.8 MHz		Not Qualified	36864 bit	4.5 V			NOT SPECIFIED	NOT SPECIFIED	NO	.002 Amp		25 ns
CY7C419-15JXCT	Cypress Semiconductor		COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		256 words	5		9	CHIP CARRIER			1.27 mm	70 Cel		256X9	256	0 Cel	MATTE TIN	QUAD	R-PQCC-J32		5.5 V	3.55 mm		11.43 mm	Not Qualified	2304 bit	4.5 V	RETRANSMIT	e3			NO		13.97 mm	15 ns
7200L25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	125 mA	256 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	2304 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.0005 Amp	13.97 mm	25 ns
7201LA15JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	40 MHz	11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.005 Amp	13.97 mm	15 ns
7202LA25J8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		1KX9	1K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.0005 Amp	13.97 mm	25 ns
7202LA25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.0005 Amp	13.97 mm	25 ns
7202LA50J8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	65 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		1KX9	1K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	15 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.0005 Amp	13.97 mm	50 ns
7203L12J8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	20 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		2KX9	2K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	50 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.9954 mm	12 ns
7203L15J8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		2KX9	2K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.9954 mm	15 ns
7203L15JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.012 Amp	13.9954 mm	15 ns
7203L15JI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.012 Amp	13.9954 mm	15 ns
7203L25J8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		2KX9	2K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.97 mm	25 ns
7203L25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.97 mm	25 ns
7204L15J8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS		4096 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		4KX9	4K	0 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.9954 mm	15 ns
72V231L20PF8	Integrated Device Technology	OTHER FIFO	COMMERCIAL	32	LQFP	SQUARE	PLASTIC/EPOXY	YES	20 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	20 mA	2048 words	3.3	3.3	9	FLATPACK, LOW PROFILE	QFP32,.35SQ,32	FIFOs	.8 mm	70 Cel		2KX9	2K	0 Cel	TIN LEAD	QUAD	S-PQFP-G32	3	3.6 V	1.6 mm	50 MHz	7 mm	Not Qualified	18432 bit	3 V		e0	20	225	YES	.005 Amp	7 mm	12 ns
CY7C421-15AXC	Cypress Semiconductor	OTHER FIFO	COMMERCIAL	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	25 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	65 mA	512 words	5	5	9	FLATPACK, THIN PROFILE	QFP32,.35SQ,32	FIFOs	.8 mm	70 Cel		512X9	512	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	5.5 V	1.2 mm	40 MHz	7 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e3	20	260	NO	.005 Amp	7 mm	15 ns
CY7C4211V-15AXI	Cypress Semiconductor	OTHER FIFO	INDUSTRIAL	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	20 mA	512 words	3.3	3.3	9	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	FIFOs	.8 mm	85 Cel		512X9	512	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	3.6 V	1.2 mm	66.7 MHz	7 mm	Not Qualified	4608 bit	3 V		e3	20	260	YES	.006 Amp	7 mm	11 ns
CY7C4291V-10JXC	Cypress Semiconductor	OTHER FIFO	COMMERCIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	10 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS	25 mA	131072 words	3.3	3.3	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	70 Cel		128KX9	128K	0 Cel	Matte Tin (Sn)	QUAD	R-PQCC-J32	3	3.6 V	3.556 mm	100 MHz	11.43 mm	Not Qualified	1179648 bit	3 V		e3	20	260	YES	.004 Amp	13.97 mm	8 ns
CY7C433-10AXC	Cypress Semiconductor	OTHER FIFO	COMMERCIAL	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	20 ns	1	CMOS	GULL WING	PARALLEL	ASYNCHRONOUS	85 mA	4096 words	5	5	9	FLATPACK, THIN PROFILE	QFP32,.35SQ,32	FIFOs	.8 mm	70 Cel		4KX9	4K	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	5.5 V	1.2 mm	50 MHz	7 mm	Not Qualified	36864 bit	4.5 V	RETRANSMIT	e3	20	260	NO	.005 Amp	7 mm	10 ns
7207L20JGI	Renesas Electronics	BI-DIRECTIONAL FIFO		32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	30 ns	1	CMOS	NO LEAD	PARALLEL	ASYNCHRONOUS	120 mA	32768 words	5		9	CHIP CARRIER	LDCC32,.5X.6		1.27 mm	85 Cel		32KX9	32K	-40 Cel	MATTE TIN	QUAD	R-PQCC-N32	3	5.5 V	3.556 mm		12.446 mm		294912 bit	4.5 V		e3	30	260	NO	.012 Amp	14.986 mm	20 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.