INDUSTRIAL FIFO 23

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	Cycle Time	No. of Functions	Technology	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Output Enable	Maximum Standby Current	Length	Maximum Access Time
7200L15JGI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	J BEND		ASYNCHRONOUS	80 mA	256 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		256X9	256	-40 Cel	Matte Tin (Sn) - annealed	QUAD	R-PQCC-J32	1			40 MHz		Not Qualified				e3	30	260		.005 Amp		15 ns
72V82L15PAGI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES			CMOS	GULL WING		ASYNCHRONOUS	100 mA	2048 words	3.3	3.3	9	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP56,.3,20	FIFOs	.5 mm	85 Cel		2KX9	2K	-40 Cel	Matte Tin (Sn) - annealed	DUAL	R-PDSO-G56	1			40 MHz		Not Qualified	18432 bit			e3	30	260		.005 Amp		15 ns
SN74ACT7882-15PN	Texas Instruments	OTHER FIFO	INDUSTRIAL	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS		2048 words	5	5	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.55SQ,20	FIFOs	.5 mm	85 Cel	3-STATE	2KX18	2K	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQFP-G80	3	5.5 V	1.6 mm	67 MHz	12 mm	Not Qualified	36864 bit	4.5 V		e4	30	260	YES		12 mm	12 ns
SN74ACT2228DWR	Texas Instruments	OTHER FIFO	INDUSTRIAL	24	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	45.45 ns	2	CMOS	GULL WING	SERIAL	SYNCHRONOUS	.4 mA	256 words	5	5	1	SMALL OUTLINE	SOP24,.4	FIFOs	1.27 mm	85 Cel	TOTEM POLE	256X1	256	-40 Cel	NICKEL PALLADIUM GOLD	DUAL	R-PDSO-G24	1	5.5 V	2.65 mm	22 MHz	7.5 mm	Not Qualified	256 bit	4.5 V		e4	30	260	NO	.0004 Amp	15.4 mm	20 ns
SN74ACT2236-20FN	Texas Instruments	BI-DIRECTIONAL FIFO	INDUSTRIAL	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	20 ns	1	CMOS	J BEND	PARALLEL	SYNCHRONOUS		2048 words	5	5	9	CHIP CARRIER	LDCC44,.7SQ	FIFOs	1.27 mm	85 Cel	3-STATE	2KX9	2K	-40 Cel		QUAD	S-PQCC-J44		5.5 V	4.57 mm	50 MHz	16.5862 mm	Not Qualified	18432 bit	4.5 V	BYPASS XCVR		NOT SPECIFIED	NOT SPECIFIED	YES	.0004 Amp	16.5862 mm	25 ns
7200L25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	125 mA	256 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		256X9	256	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	2304 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.0005 Amp	13.97 mm	25 ns
7201LA15JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	80 mA	512 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		512X9	512	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	40 MHz	11.43 mm	Not Qualified	4608 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.005 Amp	13.97 mm	15 ns
7202LA25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.0005 Amp	13.97 mm	25 ns
7202LA25TPI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	35 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	125 mA	1024 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	85 Cel		1KX9	1K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	1	5.5 V	4.572 mm	28.5 MHz	7.62 mm	Not Qualified	9216 bit	4.5 V	RETRANSMIT	e0		245	NO	.0005 Amp	34.671 mm	25 ns
7203L15JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.012 Amp	13.9954 mm	15 ns
7203L15JI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	25 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.556 mm	40 MHz	11.4554 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.012 Amp	13.9954 mm	15 ns
7203L15TPI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	25 ns	1	CMOS	THROUGH-HOLE	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	IN-LINE	DIP28,.3	FIFOs	2.54 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	DUAL	R-PDIP-T28	1	5.5 V	4.572 mm	40 MHz	7.62 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0		245	NO	.012 Amp	34.671 mm	15 ns
7203L25JI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	32	QCCJ	RECTANGULAR	PLASTIC/EPOXY	YES	35 ns	1	CMOS	J BEND	PARALLEL	ASYNCHRONOUS	120 mA	2048 words	5	5	9	CHIP CARRIER	LDCC32,.5X.6	FIFOs	1.27 mm	85 Cel		2KX9	2K	-40 Cel	TIN LEAD	QUAD	R-PQCC-J32	1	5.5 V	3.55 mm	28.5 MHz	11.43 mm	Not Qualified	18432 bit	4.5 V	RETRANSMIT	e0	20	225	NO	.002 Amp	13.97 mm	25 ns
72V255LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	8192 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32	FIFOs	.8 mm	85 Cel		8KX18	8K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	147456 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
72V265LA15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.6SQ,32	FIFOs	.8 mm	85 Cel		16KX18	16K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	294912 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
72V265LA15TFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	55 mA	16384 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	FIFOs	.5 mm	85 Cel		16KX18	16K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	294912 bit	3 V		e0	30	240	YES	.02 Amp	10 mm	10 ns
72V285L15TFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	65536 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	FIFOs	.5 mm	85 Cel		64KX18	64K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	1179648 bit	3 V		e0	30	240	YES	.02 Amp	10 mm	10 ns
72V285L15TFI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	65536 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	FIFOs	.5 mm	85 Cel		64KX18	64K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	10 mm	Not Qualified	1179648 bit	3 V		e0	30	240	YES	.02 Amp	10 mm	10 ns
72V36100L15PFI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	40 mA	65536 words	3.3	3.3	36	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	FIFOs	.5 mm	85 Cel		64KX36	64K	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	3.45 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	2359296 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e0	30	225	YES	.015 Amp	20 mm	10 ns
72V36110L15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	40 mA	131072 words	3.3	3.3	36	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	FIFOs	.5 mm	85 Cel		128KX36	128K	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	3.45 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	4718592 bit	3.15 V	RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE	e0	30	225	YES	.015 Amp	20 mm	10 ns
72V845L15PFI8	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	4096 words	3.3	3.3	18	FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63X.87,20	FIFOs	.5 mm	85 Cel		4KX18	4K	-40 Cel	TIN LEAD	QUAD	R-PQFP-G128	3	3.6 V	1.6 mm		14 mm	Not Qualified	73728 bit	3 V		e0	30	225	YES	.01 Amp	20 mm	10 ns
72V295L15PFI	Integrated Device Technology	OTHER FIFO	INDUSTRIAL	64	LQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	60 mA	131072 words	3.3	3.3	18	FLATPACK, LOW PROFILE	QFP64,.66SQ,32	FIFOs	.8 mm	85 Cel		128KX18	128K	-40 Cel	TIN LEAD	QUAD	S-PQFP-G64	3	3.6 V	1.6 mm	66.7 MHz	14 mm	Not Qualified	2359296 bit	3 V		e0	30	240	YES	.02 Amp	14 mm	10 ns
CY7C4211V-15AXI	Cypress Semiconductor	OTHER FIFO	INDUSTRIAL	32	TQFP	SQUARE	PLASTIC/EPOXY	YES	15 ns	1	CMOS	GULL WING	PARALLEL	SYNCHRONOUS	20 mA	512 words	3.3	3.3	9	FLATPACK, THIN PROFILE	TQFP32,.35SQ,32	FIFOs	.8 mm	85 Cel		512X9	512	-40 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G32	3	3.6 V	1.2 mm	66.7 MHz	7 mm	Not Qualified	4608 bit	3 V		e3	20	260	YES	.006 Amp	7 mm	11 ns

FIFO

FIFO, or First-In, First-Out, is a type of digital circuit that is used in computer systems and digital devices to manage the flow of data. A FIFO circuit stores data in a buffer and retrieves the data in the same order in which it was received, with the first data received being the first data to be retrieved.

FIFO circuits are used in many applications where data needs to be stored and retrieved in a specific order, such as in data communication systems, disk drives, and multimedia devices. For example, in a data communication system, a FIFO circuit can be used to store incoming data packets in a buffer and retrieve them in the order in which they were received, ensuring that the data is processed correctly and in a timely manner.

FIFO circuits are typically implemented using a combination of flip-flops, multiplexers, and control logic. The control logic manages the input and output of data to the FIFO buffer and ensures that the data is stored and retrieved in the correct order.

One of the advantages of using a FIFO circuit is that it provides a simple and efficient way to manage the flow of data. FIFO circuits are easy to implement and can handle large amounts of data. They can also be used in conjunction with other types of digital circuits to implement more complex data processing algorithms.