153 Flash Memory 98

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Toggle Bit	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Minimum Data Retention Time	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Command User Interface	Terminal Finish	Ready or Busy	Terminal Position	Write Protection	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Type	Maximum Standby Current	Length	Programming Voltage (V)	Data Polling
MTFC128GAPALNS-AAT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		137438953472 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	105 Cel		128GX8	128G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	1099511627776 bit	2.7 V		e1	30	260			13 mm	2.7
MTFC128GAPALNS-AIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		137438953472 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	85 Cel		128GX8	128G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	1099511627776 bit	2.7 V		e1	30	260			13 mm	2.7
MTFC32GAPALBH-AAT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		34359738368 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	105 Cel		32GX8	32G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	274877906944 bit	2.7 V		e1	30	260			13 mm	2.7
MTFC32GAPALBH-AIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		34359738368 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	85 Cel		32GX8	32G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	274877906944 bit	2.7 V		e1	30	260			13 mm	2.7
MTFC64GAPALBH-AAT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		68719476736 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	105 Cel		64GX8	64G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	549755813888 bit	2.7 V			30	260			13 mm	2.7
MTFC64GAPALBH-AIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		68719476736 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	85 Cel		64GX8	64G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	549755813888 bit	2.7 V		e1	30	260			13 mm	2.7
MTFC64GASAONS-AITES	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		68719476736 words	3.3		8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	95 Cel		64GX8	64G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.461 mm	52 MHz	11.5 mm	549755813888 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	NAND TYPE		13 mm
MTFC16GLWDM-4MAITZ	Micron Technology	FLASH CARD	INDUSTRIAL	153	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words			8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		16GX8	16G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.364 mm	52 MHz	11.5 mm	137438953742 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	NAND TYPE		13 mm
MTFC4GLGDM-AITA	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		4GX8	4G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.374 mm	52 MHz	11.5 mm	34359738368 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	NAND TYPE		13 mm
MTFC4GMWDM-3MAITA	Micron Technology	FLASH CARD	INDUSTRIAL	153	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words			8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		4GX8	4G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.364 mm	52 MHz	11.5 mm	34359738368 bit	2.7 V					NAND TYPE		13 mm
MTFC8GLGDM-AITZ	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		8GX8	8G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.374 mm	52 MHz	11.5 mm	68719476736 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	NAND TYPE		13 mm
MTFC8GLWDM-AITA	Micron Technology	FLASH CARD	INDUSTRIAL	153	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words			8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		8GX8	8G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.364 mm	52 MHz	11.5 mm	68719476736 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	NAND TYPE		13 mm
MTFC8GLWDM-AITZ	Micron Technology	FLASH CARD	INDUSTRIAL	153	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words			8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		8GX8	8G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.364 mm	52 MHz	11.5 mm	68719476736 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	NAND TYPE		13 mm
MTFC8GAMALBH-IT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel	3-STATE	8GX8	8G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1.1 mm	200 MHz	11.5 mm	68719476736 bit	2.7 V					NAND TYPE		13 mm	2.7
MTFC128GAPALNS-IT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		137438953472 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel	3-STATE	128GX8	128G	-40 Cel		Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		R-PBGA-B153		3.6 V	1.1 mm	200 MHz	11.5 mm	1099511627776 bit	2.7 V		e1	30	260	NAND TYPE		13 mm	2.7
MTFC4GLDEA-0MWTTR	Micron Technology	FLASH CARD	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		4GX8	4G	-25 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	.8 mm	52 MHz	11.5 mm	34359738368 bit	2.7 V		e1			MLC NAND TYPE		13 mm	3.3	NO
MTFC16GAPALBH-AATTR	Micron Technology	FLASH CARD		153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	105 Cel		16GX8	16G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm	200 MHz	11.5 mm	137438953472 bit	2.7 V		e1	30	260	NAND TYPE		13 mm
MTFC8GAMALBH-AITTR	Micron Technology	FLASH CARD		153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q104	BALL	PARALLEL	SYNCHRONOUS		8589934592 words		NO	8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20	4	5	.5 mm	85 Cel	OPEN-DRAIN	8GX8	8G	-40 Cel	NO	TIN SILVER COPPER	YES	BOTTOM		R-PBGA-B153		3.6 V	1.2 mm	200 MHz	11.5 mm	68719476736 bit	2.7 V		e1	30	260	NAND TYPE		13 mm	2.7	NO
MTFC8GLWDM-AITATR	Micron Technology	FLASH CARD	INDUSTRIAL	153	LFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words			8	GRID ARRAY, LOW PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		8GX8	8G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm	52 MHz	11.5 mm	68719476736 bit	2.7 V		e1	30	260	NAND TYPE		13 mm	2.7
MTFC32GAPALBH-IT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		34359738368 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel	3-STATE	32GX8	32G	-40 Cel		Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		R-PBGA-B153		3.6 V	1.1 mm	200 MHz	11.5 mm	274877906944 bit	2.7 V		e1	30	260	NAND TYPE		13 mm	2.7
IS22TF32G-JCLA2	Integrated Silicon Solution	FLASH		153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	SERIAL	SYNCHRONOUS	55 mA	34359738368 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	105 Cel	3-STATE	32GX8	32G	-40 Cel				BOTTOM	HARDWARE/SOFTWARE	R-PBGA-B153		3.6 V	1 mm	200 MHz	11.5 mm	274877906944 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	TLC NAND TYPE	.00003 Amp	13 mm	3.3
MTFC8GAKAJCN-1MWT	Micron Technology	FLASH CARD	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel	OPEN-DRAIN	8GX8	8G	-25 Cel	NO			BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	68719476736 bit	2.7 V	ALSO AVAILABE WITH TAPE AND REEL		NOT SPECIFIED	NOT SPECIFIED	MLC NAND TYPE		13 mm		NO
MTFC4GACAJCN-1MWT	Micron Technology	FLASH CARD	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel	OPEN-DRAIN	4GX8	4G	-25 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	34359738368 bit	2.7 V	ALSO AVAILABE WITH TAPE AND REEL		30	260	MLC NAND TYPE		13 mm		NO
MTFC8GLWDM-3LAATZ	Micron Technology	FLASH CARD	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	105 Cel	OPEN-DRAIN	8GX8	8G	-40 Cel			YES	BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	68719476736 bit	2.7 V							13 mm
MTFC4GMDEA-1MWT	Micron Technology	FLASH CARD	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		4GX8	4G	-25 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	.8 mm	52 MHz	11.5 mm	34359738368 bit	2.7 V					MLC NAND TYPE		13 mm	3.3	NO
MTFC4GLDEA-0MWT	Micron Technology	FLASH CARD	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		4GX8	4G	-25 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	.8 mm	52 MHz	11.5 mm	34359738368 bit	2.7 V					MLC NAND TYPE		13 mm	3.3	NO
MTFC8GLDEA-1MWT	Micron Technology	FLASH CARD	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		8GX8	8G	-25 Cel	NO	TIN SILVER COPPER NICKEL		BOTTOM		R-PBGA-B153		3.6 V	.8 mm	52 MHz	11.5 mm	68719476736 bit	2.7 V					MLC NAND TYPE		13 mm	3.3	NO
S40410081B1B1I000	Cypress Semiconductor	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		4		.5 mm	85 Cel		8GX8	8G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	68719476736 bit	2.7 V					MLC NAND TYPE		13 mm	3
S40410081B1B1W000	Cypress Semiconductor	FLASH	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		4		.5 mm	85 Cel		8GX8	8G	-25 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	68719476736 bit	2.7 V					MLC NAND TYPE		13 mm	3
S40410161B1B1I010	Cypress Semiconductor	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words	3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		4		.5 mm	85 Cel		16GX8	16G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	137438953472 bit	2.7 V					MLC NAND TYPE		13 mm	3
S40410161B1B1W010	Cypress Semiconductor	FLASH	OTHER	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words	3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		4		.5 mm	85 Cel		16GX8	16G	-25 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	137438953472 bit	2.7 V					MLC NAND TYPE		13 mm	3
MTFC4GACAJCN-4MIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words		NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		4GX8	4G	-40 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1 mm	52 MHz	11.5 mm	34359738368 bit	2.7 V			30	260	MLC NAND TYPE		13 mm		NO
MTFC8GAKAJCN-4MIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words		NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	85 Cel		8GX8	8G	-40 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1 mm	52 MHz	11.5 mm	68719476736 bit	2.7 V		e1	30	260	MLC NAND TYPE		13 mm		NO
MTFC16GAKAECN-4MIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words			8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		16GX8	16G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	137438953472 bit	2.7 V		e1			MLC NAND TYPE		13 mm	2.7
MTFC64GAKAEEY-4MIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		68719476736 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	85 Cel		64GX8	64G	-40 Cel		Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	549755813888 bit	2.7 V		e1	30	260	MLC NAND TYPE		13 mm	2.7
IS21ES04G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153	3	3.6 V	1 mm		11.5 mm	34359738368 bit	2.7 V		e1	10	260			13 mm	3.3
IS21ES08G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20	1		.5 mm	85 Cel	3-STATE	8GX8	8G	-40 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153	3	3.6 V	1 mm	200 MHz	11.5 mm	68719476736 bit	2.7 V		e1	10	260	MLC NAND TYPE		13 mm	3.3	NO
IS21ES16G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20	1		.5 mm	85 Cel	3-STATE	16GX8	16G	-40 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153	3	3.6 V	1 mm	200 MHz	11.5 mm	137438953472 bit	2.7 V		e1	10	260	MLC NAND TYPE		13 mm	3.3	NO
IS21ES32G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		34359738368 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20	1		.5 mm	85 Cel	3-STATE	32GX8	32G	-40 Cel	NO	TIN SILVER COPPER		BOTTOM		R-PBGA-B153	3	3.6 V	1 mm	200 MHz	11.5 mm	274877906944 bit	2.7 V		e1	10	260	MLC NAND TYPE		13 mm	3.3	NO
IS22ES04G-JCLA1	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153	3	3.6 V	1 mm		11.5 mm	34359738368 bit	2.7 V		e1	10	260			13 mm	3.3
THGBMHG7C2LBAIL	Toshiba	FLASH	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS		17179869184 words			8	GRID ARRAY					85 Cel		16GX8	16G	-25 Cel				BOTTOM		R-PBGA-B153		3.6 V				137438953472 bit	2.7 V								2.7
IS21ES04G-JCLI-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	34359738368 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED			13 mm	3.3
IS21ES08G-JCLI-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		8GX8	8G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	68719476736 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED			13 mm	3.3
MTFC16GAKAEJP-4MIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words			8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		16GX8	16G	-40 Cel		Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	137438953472 bit	2.7 V		e1	30	260			13 mm	2.7
MTFC32GAKAEJP-4MIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		34359738368 words			8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		32GX8	32G	-40 Cel		Tin/Silver/Copper (Sn/Ag/Cu)		BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	274877906944 bit	2.7 V		e1	30	260			13 mm	2.7
EM04APGD4-BA000-2	Delkin Devices	FLASH CARD	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	34359738368 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED			13 mm	3.3
EM04APYD3-BA000-2	Delkin Devices	FLASH CARD	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel				BOTTOM		R-PBGA-B153		3.6 V	1 mm		11.5 mm	34359738368 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED			13 mm	3.3
MTFC8GAMALBH-AIT	Micron Technology	FLASH CARD	INDUSTRIAL	153	TFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words			8	GRID ARRAY, THIN PROFILE, FINE PITCH				.5 mm	85 Cel		8GX8	8G	-40 Cel		TIN SILVER COPPER		BOTTOM		R-PBGA-B153		3.6 V	1.2 mm		11.5 mm	68719476736 bit	2.7 V		e1	30	260	NAND TYPE		13 mm	2.7

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.