AUTOMOTIVE Flash Memory 35

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

M29W800FB70ZA3SE

Micron Technology

FLASH

AUTOMOTIVE

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

125 Cel

512KX16

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

BOTTOM

8388608 bit

3 V

BOTTOM BOOT BLOCK

e1

8 mm

70 ns

3

M29W800FT70ZA3SE

Micron Technology

FLASH

AUTOMOTIVE

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

524288 words

3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

125 Cel

512KX16

512K

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

TOP

8388608 bit

3 V

TOP BOOT BLOCK

e1

8 mm

70 ns

3

M25P80-VMN3PB

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

15 mA

8388608 words

3/3.3

1

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

125 Cel

8MX1

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

15 ms

SPI

8388608 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

4.9 mm

2.7

M29W256GH70N3E

Micron Technology

FLASH

AUTOMOTIVE

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16777216 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

16MX16

16M

-40 Cel

MATTE TIN

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

BOTTOM/TOP

268435456 bit

2.7 V

e3

NOR TYPE

18.4 mm

70 ns

3

M25P16-VMN3PB

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

125 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

SPI

16777216 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

4.9 mm

3

M25P16-VMN3TPB

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

125 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

SPI

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

4.9 mm

3

N25Q064A11ESEA0F

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

8388608 words

1.8

8

SMALL OUTLINE

1.27 mm

125 Cel

8MX8

8M

-40 Cel

DUAL

S-PDSO-G8

2 V

2.16 mm

108 MHz

5.285 mm

67108864 bit

1.7 V

NOT SPECIFIED

NOT SPECIFIED

5.285 mm

1.8

N25Q512A83G12A0F

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

536870912 words

3

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

512MX1

512M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

108 MHz

6 mm

536870912 bit

2.7 V

NOR TYPE

8 mm

3

M25P32-VMW3GB

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

4194304 words

3

8

SMALL OUTLINE

1.27 mm

125 Cel

4MX8

4M

-40 Cel

DUAL

S-PDSO-G8

3.6 V

2.16 mm

75 MHz

5.285 mm

33554432 bit

2.7 V

30

260

5.285 mm

2.7

M25P16-VMN3YPB

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.25

Flash Memories

20

1.27 mm

125 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

75 MHz

3.9 mm

Not Qualified

SPI

16777216 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.0001 Amp

4.9 mm

2.7

M29W512GH70N3E

Micron Technology

FLASH

AUTOMOTIVE

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

SYNCHRONOUS

33554432 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

32MX16

32M

-40 Cel

DUAL

R-PDSO-G56

3.6 V

1.2 mm

14 mm

536870912 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

18.4 mm

80 ns

2.7

M29F400BB70N3T

STMicroelectronics

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

262144 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

256KX16

256K

-40 Cel

1,2,1,7

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

100000 Write/Erase Cycles

12 mm

Not Qualified

BOTTOM

4194304 bit

4.5 V

BOTTOM BOOT BLOCK

e0

NOR TYPE

.0001 Amp

18.4 mm

70 ns

5

YES

M29F200BB50N3

STMicroelectronics

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

16K,8K,32K,64K

20 mA

131072 words

5

YES

5

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

8

Flash Memories

.5 mm

125 Cel

128KX16

128K

-40 Cel

1,2,1,3

YES

TIN LEAD

YES

DUAL

R-PDSO-G48

5.5 V

1.2 mm

100000 Write/Erase Cycles

12 mm

Not Qualified

BOTTOM

2097152 bit

4.5 V

BOTTOM BOOT BLOCK

e0

NOR TYPE

.0001 Amp

18.4 mm

50 ns

5

YES

AT25SF041-SSHDHR-T

Adesto Technologies

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

4194304 words

1

SMALL OUTLINE

125 Cel

4MX1

4M

-40 Cel

DUAL

R-PDSO-G8

3.6 V

85 MHz

4194304 bit

2.5 V

2.7

M29W640GB70N3E

Micron Technology

FLASH

AUTOMOTIVE

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4194304 words

3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

8

.5 mm

125 Cel

4MX16

4M

-40 Cel

DUAL

R-PDSO-G48

3.6 V

1.2 mm

12 mm

BOTTOM

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

18.4 mm

70 ns

3

N25Q032A13EF4A0FTR

Micron Technology

FLASH

AUTOMOTIVE

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

33554432 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

.8 mm

125 Cel

32MX1

32M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

.6 mm

108 MHz

3 mm

33554432 bit

2.7 V

NOR TYPE

4 mm

3

IS25WP512M-RHLA3

Integrated Silicon Solution

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

35 mA

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

20

1 mm

125 Cel

3-STATE

64MX8

64M

-40 Cel

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

1.95 V

1.2 mm

100000 Write/Erase Cycles

133 MHz

6 mm

SPI

536870912 bit

1.65 V

e1

10

260

NOR TYPE

.00026 Amp

8 mm

1.8

M29W320DB80ZA3E

Micron Technology

FLASH

AUTOMOTIVE

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2097152 words

3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

8

.8 mm

125 Cel

2MX16

2M

-40 Cel

BOTTOM

R-PBGA-B48

3.6 V

1.2 mm

6 mm

33554432 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

80 ns

3

M25P16-VMF3PB

Micron Technology

FLASH

AUTOMOTIVE

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

15 mA

2097152 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

125 Cel

2MX8

2M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

75 MHz

7.5 mm

Not Qualified

SPI

16777216 bit

2.7 V

NOR TYPE

.0001 Amp

10.3 mm

3

MT25QL128ABB8E12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

16777216 words

3

8

GRID ARRAY, THIN PROFILE

1

1 mm

125 Cel

16MX8

16M

-40 Cel

BOTTOM

R-PBGA-B24

3.6 V

1.2 mm

133 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

IS25LP032D-JBLA3-TR

Integrated Silicon Solution

FLASH

AUTOMOTIVE

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

4194304 words

3

8

SMALL OUTLINE

1.27 mm

125 Cel

4MX8

4M

-40 Cel

DUAL

S-PDSO-G8

3.6 V

2.16 mm

133 MHz

5.28 mm

33554432 bit

2.3 V

NOT SPECIFIED

NOT SPECIFIED

5.28 mm

3

MT35XU02GCBA2G12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

256MX8

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

200 MHz

6 mm

2147483648 bit

1.7 V

e1

30

260

8 mm

1.8

MT35XU256ABA1G12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

268435456 words

1.8

1

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

256MX1

256M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

166 MHz

6 mm

268435456 bit

1.7 V

e1

30

260

8 mm

1.8

MT35XU256ABA2G12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

33554432 words

1.8

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

32MX8

32M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

200 MHz

6 mm

268435456 bit

1.7 V

e1

30

260

8 mm

1.8

MT35XU512ABA2G12-0AUT

Micron Technology

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

1 mm

125 Cel

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

R-PBGA-B24

2 V

1.2 mm

200 MHz

6 mm

536870912 bit

1.7 V

e1

30

260

8 mm

1.8

SST26VF016B-80E/SN70SVAO

Microchip Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

SERIAL

SYNCHRONOUS

25 mA

16777216 words

3

1

SMALL OUTLINE

SOP8,.23

100

1.27 mm

125 Cel

3-STATE

16MX1

16M

-40 Cel

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

104 MHz

3.9 mm

SPI

16777216 bit

2.7 V

NOR TYPE

.000045 Amp

4.9 mm

3

SST26VF016BT-80E/SN70SVAO

Microchip Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

SERIAL

SYNCHRONOUS

25 mA

16777216 words

3

1

SMALL OUTLINE

SOP8,.23

100

1.27 mm

125 Cel

3-STATE

16MX1

16M

-40 Cel

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

104 MHz

3.9 mm

SPI

16777216 bit

2.7 V

NOR TYPE

.000045 Amp

4.9 mm

3

SST25PF040C-40E/MF18GVAO

Microchip Technology

FLASH

AUTOMOTIVE

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

524288 words

3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.25

20

1.27 mm

125 Cel

3-STATE

512KX8

512K

-40 Cel

DUAL

1

SOFTWARE

R-PDSO-N8

3.6 V

.8 mm

100000 Write/Erase Cycles

40 MHz

5 mm

SPI

4194304 bit

2.3 V

NOR TYPE

.00001 Amp

6 mm

3.3

SST25PF040CT-40E/SN18GVAO

Microchip Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

15 mA

524288 words

3.3

8

SMALL OUTLINE

SOP8,.23

20

1.27 mm

125 Cel

3-STATE

512KX8

512K

-40 Cel

DUAL

1

SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

40 MHz

3.9 mm

SPI

4194304 bit

2.3 V

NOR TYPE

.00001 Amp

4.9 mm

3.3

N25Q128A13EF8A0FTR

Micron Technology

FLASH

AUTOMOTIVE

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

134217728 words

3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

1.27 mm

125 Cel

128MX1

128M

-40 Cel

DUAL

R-PDSO-N8

3.6 V

1 mm

108 MHz

6 mm

134217728 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

8 mm

3

N25Q032A13ESCA0FTR

Micron Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

33554432 words

3

1

SMALL OUTLINE

1.27 mm

125 Cel

32MX1

32M

-40 Cel

DUAL

R-PDSO-G8

3.6 V

1.75 mm

108 MHz

3.9 mm

33554432 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

4.9 mm

3

SST26VF016B-80E/SM

Microchip Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

25 mA

16777216 words

2.5

1

SMALL OUTLINE

SOP8,.3

100

1.27 mm

125 Cel

3-STATE

16MX1

16M

-40 Cel

DUAL

1

HARDWARE/SOFTWARE

R-PDSO-G8

3.6 V

2.03 mm

100000 Write/Erase Cycles

80 MHz

5.25 mm

SPI

16777216 bit

2.3 V

NOR TYPE

.000025 Amp

5.26 mm

2.5

SST25PF040C-40E/MF

Microchip Technology

FLASH

AUTOMOTIVE

10

HVSON

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

NO LEAD

SERIAL

SYNCHRONOUS

15 mA

4194304 words

3.3

1

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC10,.12,20

20

.5 mm

125 Cel

3-STATE

4MX1

4M

-40 Cel

DUAL

1

SOFTWARE

S-PDSO-N10

3.6 V

1 mm

100000 Write/Erase Cycles

40 MHz

3 mm

SPI

4194304 bit

2.3 V

NOR TYPE

.00001 Amp

3 mm

3.3

SST25PF040C-40E/SN

Microchip Technology

FLASH

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

TS 16949

GULL WING

SERIAL

SYNCHRONOUS

15 mA

4194304 words

3.3

1

SMALL OUTLINE

SOP8,.23

20

1.27 mm

125 Cel

3-STATE

4MX1

4M

-40 Cel

DUAL

1

SOFTWARE

R-PDSO-G8

3.6 V

1.75 mm

100000 Write/Erase Cycles

40 MHz

3.9 mm

SPI

4194304 bit

2.3 V

NOR TYPE

.00001 Amp

4.9 mm

3.3

IS25WP512M-RHLA3-TR

Integrated Silicon Solution

FLASH

AUTOMOTIVE

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

BALL

SERIAL

SYNCHRONOUS

35 mA

67108864 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

20

1 mm

125 Cel

3-STATE

64MX8

64M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3

1.95 V

1.2 mm

100000 Write/Erase Cycles

112 MHz

6 mm

SPI

536870912 bit

1.7 V

30

260

NOR TYPE

.00026 Amp

8 mm

1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.