Integrated Silicon Solution Flash Memory 58

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Maximum Supply Current	No. of Words	Nominal Supply Voltage / Vsup (V)	Toggle Bit	Memory Width	Package Style (Meter)	Package Equivalence Code	Alternate Memory Width	Minimum Data Retention Time	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Command User Interface	Terminal Finish	Terminal Position	Write Protection	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Endurance	Maximum Clock Frequency (fCLK)	Width	Serial Bus Type	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Type	Maximum Standby Current	Length	Maximum Access Time	Programming Voltage (V)	Data Polling
IS25LQ032B-JBLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		33554432 words	3		1	SMALL OUTLINE				1.27 mm	105 Cel		32MX1	32M	-40 Cel			DUAL		S-PDSO-G8		3.6 V	2.16 mm		104 MHz	5.28 mm		33554432 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			5.28 mm		2.7
IS25LP064D-JLLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS		8388608 words	3		8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		1		1.27 mm	105 Cel		8MX8	8M	-40 Cel		Tin (Sn)	DUAL		R-PDSO-N8		3.6 V	.8 mm		166 MHz	6 mm		67108864 bit	2.7 V		e3	30	260			8 mm		3
IS25WP01G-RILE	Integrated Silicon Solution	FLASH	INDUSTRIAL	24	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	SERIAL	SYNCHRONOUS		134217728 words	1.8		8	GRID ARRAY, LOW PROFILE		1		1 mm	105 Cel		128MX8	128M	-40 Cel			BOTTOM		R-PBGA-B24		1.95 V	1.4 mm		104 MHz	6 mm		1073741824 bit	1.7 V							8 mm		1.8
IS25WP512M-RHLE-TR	Integrated Silicon Solution	FLASH																																												NOT SPECIFIED	NOT SPECIFIED					1.8
IS22TF32G-JCLA2	Integrated Silicon Solution	FLASH		153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	SERIAL	SYNCHRONOUS	55 mA	34359738368 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20			.5 mm	105 Cel	3-STATE	32GX8	32G	-40 Cel			BOTTOM	HARDWARE/SOFTWARE	R-PBGA-B153		3.6 V	1 mm		200 MHz	11.5 mm		274877906944 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED	TLC NAND TYPE	.00003 Amp	13 mm		3.3
IS25WP512M-RMLA3-TR	Integrated Silicon Solution	FLASH																																																		1.8
IS25LQ010B-JNLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		1048576 words	3		1	SMALL OUTLINE				1.27 mm	105 Cel		1MX1	1M	-40 Cel		TIN	DUAL		R-PDSO-G8		3.6 V	1.75 mm		104 MHz	3.9 mm		1048576 bit	2.3 V		e3	30	260			4.9 mm		3
IS25LQ020B-JBLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		2097152 words	3		1	SMALL OUTLINE				1.27 mm	105 Cel		2MX1	2M	-40 Cel			DUAL		S-PDSO-G8		3.6 V	2.16 mm		104 MHz	5.28 mm		2097152 bit	2.3 V							5.28 mm		3
IS25LQ025B-JNLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		262144 words	3		1	SMALL OUTLINE				1.27 mm	105 Cel		256KX1	256K	-40 Cel		TIN	DUAL		R-PDSO-G8		3.6 V	1.75 mm		104 MHz	3.9 mm		262144 bit	2.3 V		e3	30	260			4.9 mm		3
IS25LQ040B-JKLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS		4194304 words	3		1	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				1.27 mm	105 Cel		4MX1	4M	-40 Cel			DUAL		R-PDSO-N8		3.6 V	.8 mm		104 MHz	5 mm		4194304 bit	2.3 V							6 mm		3
IS25LQ040B-JNLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		4194304 words	3		1	SMALL OUTLINE				1.27 mm	105 Cel		4MX1	4M	-40 Cel		TIN	DUAL		R-PDSO-G8		3.6 V	1.75 mm		104 MHz	3.9 mm		4194304 bit	2.3 V		e3	30	260			4.9 mm		3
IS25LP064A-JMLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS	25 mA	67108864 words	3		1	SMALL OUTLINE	SOP16,.4	1	20	1.27 mm	105 Cel	3-STATE	64MX1	64M	-40 Cel		TIN	DUAL	HARDWARE/SOFTWARE	R-PDSO-G16		3.6 V	2.65 mm	100000 Write/Erase Cycles	133 MHz	7.5 mm	SPI	67108864 bit	2.3 V		e3	10	260	NOR TYPE	.000035 Amp	10.3 mm		3
IS26KL256S-DABLI00	Integrated Silicon Solution	FLASH	INDUSTRIAL	24	VBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		33554432 words	3		8	GRID ARRAY, VERY THIN PROFILE				1 mm	85 Cel		32MX8	32M	-40 Cel			BOTTOM		R-PBGA-B24		3.6 V	1 mm			6 mm		268435456 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED			8 mm	96 ns	3
IS25LP256D-JMLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS	30 mA	33554432 words	3		8	SMALL OUTLINE	SOP16,.4		20	1.27 mm	105 Cel	3-STATE	32MX8	32M	-40 Cel			DUAL	HARDWARE/SOFTWARE	R-PDSO-G16		3.6 V	2.65 mm	100000 Write/Erase Cycles	133 MHz	7.49 mm	SPI	268435456 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	.00003 Amp	10.31 mm		3
IS25LP256D-RMLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS	30 mA	33554432 words	3		8	SMALL OUTLINE	SOP16,.4		20	1.27 mm	105 Cel	3-STATE	32MX8	32M	-40 Cel			DUAL	HARDWARE/SOFTWARE	R-PDSO-G16		3.6 V	2.65 mm	100000 Write/Erase Cycles	133 MHz	7.49 mm	SPI	268435456 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	.00003 Amp	10.31 mm		3
IS34ML04G084-TLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	SYNCHRONOUS		536870912 words	3.3		8	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		512MX8	512M	-40 Cel		TIN	DUAL		R-PDSO-G48		3.6 V	1.2 mm			12 mm		4294967296 bit	2.7 V		e3			SLC NAND TYPE		18.4 mm		3.3
IS25WP064A-RHLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	24	TBGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		BALL	SERIAL	SYNCHRONOUS	29 mA	8388608 words	1.8		8	GRID ARRAY, THIN PROFILE	BGA24,5X5,40	1	20	1 mm	105 Cel	3-STATE	8MX8	8M	-40 Cel		TIN SILVER COPPER	BOTTOM	HARDWARE/SOFTWARE	S-PBGA-B24		1.95 V	1.2 mm	100000 Write/Erase Cycles	133 MHz	5 mm	SPI	67108864 bit	1.65 V		e1	10	260	NOR TYPE	.000035 Amp	5 mm		1.8
IS25LQ040B-JKLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS		4194304 words	3		1	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				1.27 mm	105 Cel		4MX1	4M	-40 Cel			DUAL		R-PDSO-N8		3.6 V	.8 mm		104 MHz	5 mm		4194304 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			6 mm		3
IS21ES04G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B153	3	3.6 V	1 mm			11.5 mm		34359738368 bit	2.7 V		e1	10	260			13 mm		3.3
IS21ES04G-JQLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	100	LBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, LOW PROFILE				1 mm	85 Cel		4GX8	4G	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B100	3	3.6 V	1.4 mm			14 mm		34359738368 bit	2.7 V		e1	10	260			18 mm		3.3
IS21ES08G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20	1		.5 mm	85 Cel	3-STATE	8GX8	8G	-40 Cel	NO	TIN SILVER COPPER	BOTTOM		R-PBGA-B153	3	3.6 V	1 mm		200 MHz	11.5 mm		68719476736 bit	2.7 V		e1	10	260	MLC NAND TYPE		13 mm		3.3	NO
IS21ES16G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		17179869184 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20	1		.5 mm	85 Cel	3-STATE	16GX8	16G	-40 Cel	NO	TIN SILVER COPPER	BOTTOM		R-PBGA-B153	3	3.6 V	1 mm		200 MHz	11.5 mm		137438953472 bit	2.7 V		e1	10	260	MLC NAND TYPE		13 mm		3.3	NO
IS21ES32G-JCLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		34359738368 words	3.3	NO	8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	BGA153,14X14,20	1		.5 mm	85 Cel	3-STATE	32GX8	32G	-40 Cel	NO	TIN SILVER COPPER	BOTTOM		R-PBGA-B153	3	3.6 V	1 mm		200 MHz	11.5 mm		274877906944 bit	2.7 V		e1	10	260	MLC NAND TYPE		13 mm		3.3	NO
IS22ES04G-JCLA1	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel		TIN SILVER COPPER	BOTTOM		R-PBGA-B153	3	3.6 V	1 mm			11.5 mm		34359738368 bit	2.7 V		e1	10	260			13 mm		3.3
IS34ML01G084-TLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		134217728 words	3.3		8	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		128MX8	128M	-40 Cel		TIN	DUAL		R-PDSO-G48	3	3.6 V	1.2 mm			12 mm		1073741824 bit	2.7 V		e3			SLC NAND TYPE		18.4 mm		3.3
IS34ML01G081-BLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	63	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	ASYNCHRONOUS		134217728 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.8 mm	85 Cel		128MX8	128M	-40 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM		R-PBGA-B63	3	3.6 V	1 mm			9 mm		1073741824 bit	2.7 V		e1	10	260	SLC NAND TYPE		11 mm		3.3
IS34ML02G084-TLI	Integrated Silicon Solution	FLASH	INDUSTRIAL	48	TSOP1	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		268435456 words	3.3		8	SMALL OUTLINE, THIN PROFILE				.5 mm	85 Cel		256MX8	256M	-40 Cel		Matte Tin (Sn)	DUAL		R-PDSO-G48	3	3.6 V	1.2 mm			12 mm		2147483648 bit	2.7 V		e3	10	260	SLC NAND TYPE		18.4 mm		3.3
IS25LP128F-RMLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS	30 mA	16777216 words	3		8	SMALL OUTLINE	SOP16,.4	1	20	1.27 mm	105 Cel	3-STATE	16MX8	16M	-40 Cel			DUAL	HARDWARE/SOFTWARE	R-PDSO-G16		3.6 V	2.65 mm	100000 Write/Erase Cycles	166 MHz	7.49 mm	SPI	134217728 bit	2.3 V	ALSO OPERATES WITH 133MHZ @ 2.3VMIN SUPPLY		NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	.00007 Amp	10.31 mm		3
IS25WP128F-JKLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS	30 mA	16777216 words	1.8		8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.25	1	20	1.27 mm	105 Cel	3-STATE	16MX8	16M	-40 Cel			DUAL	HARDWARE/SOFTWARE	R-PDSO-N8		1.95 V	.8 mm	100000 Write/Erase Cycles	166 MHz	5 mm	SPI	134217728 bit	1.65 V	ALSO OPERATES WITH 133MHZ @ 1.65VMIN SUPPLY		NOT SPECIFIED	NOT SPECIFIED	NOR TYPE	.000075 Amp	6 mm		1.8
IS25WP512M-RHLA3	Integrated Silicon Solution	FLASH	AUTOMOTIVE	24	TBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	BALL	SERIAL	SYNCHRONOUS	35 mA	67108864 words	1.8		8	GRID ARRAY, THIN PROFILE	BGA24,5X5,40	1	20	1 mm	125 Cel	3-STATE	64MX8	64M	-40 Cel		Tin/Silver/Copper (Sn/Ag/Cu)	BOTTOM	HARDWARE/SOFTWARE	R-PBGA-B24		1.95 V	1.2 mm	100000 Write/Erase Cycles	133 MHz	6 mm	SPI	536870912 bit	1.65 V		e1	10	260	NOR TYPE	.00026 Amp	8 mm		1.8
IS25WP512M-RMLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS	35 mA	67108864 words	1.8		8	SMALL OUTLINE	SOP16,.4	1	20	1.27 mm	105 Cel	3-STATE	64MX8	64M	-40 Cel		Tin (Sn)	DUAL	HARDWARE/SOFTWARE	R-PDSO-G16		1.95 V	2.65 mm	100000 Write/Erase Cycles	133 MHz	7.49 mm	SPI	536870912 bit	1.65 V		e3	10	260	NOR TYPE	.00014 Amp	10.31 mm		1.8
IS25WP256E-JLLE	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS		33554432 words	1.8		8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		1		1.27 mm	105 Cel		32MX8	32M	-40 Cel			DUAL		R-PDSO-N8		1.95 V	.8 mm		166 MHz	6 mm		268435456 bit	1.65 V			NOT SPECIFIED	NOT SPECIFIED			8 mm		1.8
IS29GL128-70SLEB	Integrated Silicon Solution	FLASH	INDUSTRIAL	56	TSSOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	PARALLEL	ASYNCHRONOUS		134217728 words	3		1	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH				.5 mm	105 Cel		128MX1	128M	-40 Cel		TIN	DUAL		R-PDSO-G56		3.6 V	1.2 mm			14 mm		134217728 bit	2.7 V		e3					18.4 mm	70 ns	3
IS25LQ040B-JNLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		524288 words	3		8	SMALL OUTLINE		1		1.27 mm	105 Cel		512KX8	512K	-40 Cel		TIN	DUAL		R-PDSO-G8		3.6 V	1.75 mm		104 MHz	3.9 mm		4194304 bit	2.3 V	CLOCK FREQUENCY FOR READ MODE 33 MHZ	e3	30	260	NOR TYPE		4.9 mm		3
IS25LQ010B-JNLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		131072 words	3		8	SMALL OUTLINE		1		1.27 mm	105 Cel		128KX8	128K	-40 Cel		TIN	DUAL		R-PDSO-G8	1	3.6 V	1.75 mm		104 MHz	3.9 mm		1048576 bit	2.3 V		e3	30	260			4.9 mm		3
IS21ES04G-JCLI-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		4294967296 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		4GX8	4G	-40 Cel			BOTTOM		R-PBGA-B153		3.6 V	1 mm			11.5 mm		34359738368 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED			13 mm		3.3
IS21ES08G-JCLI-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	153	VFBGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		BALL	PARALLEL	SYNCHRONOUS		8589934592 words	3.3		8	GRID ARRAY, VERY THIN PROFILE, FINE PITCH				.5 mm	85 Cel		8GX8	8G	-40 Cel			BOTTOM		R-PBGA-B153		3.6 V	1 mm			11.5 mm		68719476736 bit	2.7 V			NOT SPECIFIED	NOT SPECIFIED			13 mm		3.3
IS25LP032D-JBLA3-TR	Integrated Silicon Solution	FLASH	AUTOMOTIVE	8	SOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	AEC-Q100	GULL WING	SERIAL	SYNCHRONOUS		4194304 words	3		8	SMALL OUTLINE				1.27 mm	125 Cel		4MX8	4M	-40 Cel			DUAL		S-PDSO-G8		3.6 V	2.16 mm		133 MHz	5.28 mm		33554432 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			5.28 mm		3
IS25LP032D-JMLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		4194304 words	3		8	SMALL OUTLINE		1		1.27 mm	105 Cel		4MX8	4M	-40 Cel			DUAL		R-PDSO-G16		3.6 V	2.65 mm		133 MHz	7.49 mm		33554432 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			10.31 mm		3
IS25LP128-JKLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS	14 mA	16777216 words	3		8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE	SOLCC8,.2	1	20	1.27 mm	105 Cel	3-STATE	16MX8	16M	-40 Cel			DUAL	HARDWARE/SOFTWARE	R-PDSO-N8		3.6 V	.8 mm	100000 Write/Erase Cycles	133 MHz	5 mm	4-WIRE	134217728 bit	2.7 V						.000065 Amp	6 mm
IS25LP256D-RMLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		33554432 words	3		8	SMALL OUTLINE				1.27 mm	105 Cel		32MX8	32M	-40 Cel			DUAL		R-PDSO-G16		3.6 V	2.65 mm		133 MHz	7.49 mm		268435456 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			10.31 mm		3
IS25LP512M-RMLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		67108864 words	3		8	SMALL OUTLINE		1		1.27 mm	105 Cel		64MX8	64M	-40 Cel			DUAL		R-PDSO-G16		3.6 V	2.65 mm		133 MHz	7.49 mm		536870912 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			10.31 mm		3
IS25LQ025B-JNLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		262144 words	3		1	SMALL OUTLINE				1.27 mm	105 Cel		256KX1	256K	-40 Cel		TIN	DUAL		R-PDSO-G8		3.6 V	1.75 mm		104 MHz	3.9 mm		262144 bit	2.3 V		e3	30	260			4.9 mm		3
IS25LQ032B-JBLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		33554432 words	3		1	SMALL OUTLINE				1.27 mm	105 Cel		32MX1	32M	-40 Cel			DUAL		S-PDSO-G8		3.6 V	2.16 mm		104 MHz	5.28 mm		33554432 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			5.28 mm		2.7
IS25LQ512B-JULE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS		524288 words	3		1	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE				.5 mm	105 Cel		512KX1	512K	-40 Cel			DUAL		R-PDSO-N8		3.6 V	.6 mm		104 MHz	2 mm		524288 bit	2.3 V			NOT SPECIFIED	NOT SPECIFIED			3 mm		3
IS25WP016D-JBLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	SOP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		2097152 words	1.8		8	SMALL OUTLINE		1		1.27 mm	105 Cel		2MX8	2M	-40 Cel			DUAL		S-PDSO-G8		1.95 V	2.16 mm		133 MHz	5.28 mm		16777216 bit	1.65 V			NOT SPECIFIED	NOT SPECIFIED			5.28 mm		1.8
IS25WP064A-JLLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	8	HVSON	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		NO LEAD	SERIAL	SYNCHRONOUS		8388608 words	1.8		8	SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE		1		1.27 mm	105 Cel		8MX8	8M	-40 Cel			DUAL		R-PDSO-N8		1.95 V	.85 mm		133 MHz	6 mm		67108864 bit	1.65 V			NOT SPECIFIED	NOT SPECIFIED			8 mm		1.8
IS25WP064A-JMLE-TR	Integrated Silicon Solution	FLASH	INDUSTRIAL	16	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		GULL WING	SERIAL	SYNCHRONOUS		8388608 words	1.8		8	SMALL OUTLINE				1.27 mm	105 Cel		8MX8	8M	-40 Cel			DUAL		R-PDSO-G16		1.95 V	2.65 mm		133 MHz	7.49 mm		67108864 bit	1.65 V			NOT SPECIFIED	NOT SPECIFIED			10.31 mm		1.8

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.