Flash Memory

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

SST39SF010A-70-4I-WHE-T

Microchip Technology

FLASH

INDUSTRIAL

32

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

4K

35 mA

131072 words

5

YES

5

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP32,.56,20

Flash Memories

100

.5 mm

85 Cel

3-STATE

128KX8

128K

-40 Cel

32

YES

MATTE TIN

DUAL

1

R-PDSO-G32

3

5.5 V

1.2 mm

100000 Write/Erase Cycles

8 mm

Not Qualified

1048576 bit

4.5 V

e3

260

NOR TYPE

.0001 Amp

12.4 mm

70 ns

5

YES

SST39VF3201C-70-4I-B3KE-T

Microchip Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

15 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

100

.8 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

8,63

YES

TIN SILVER COPPER

YES

BOTTOM

1

R-PBGA-B48

3.6 V

1.2 mm

100000 Write/Erase Cycles

6 mm

Not Qualified

BOTTOM

33554432 bit

2.7 V

BOTTOM BOOT BLOCK

e1

NOR TYPE

.00005 Amp

8 mm

YES

70 ns

3

YES

SST39VF3202C-70-4I-B3KE-T

Microchip Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

15 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

100

.8 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

8,63

YES

TIN SILVER COPPER

YES

BOTTOM

1

R-PBGA-B48

3.6 V

1.2 mm

100000 Write/Erase Cycles

6 mm

Not Qualified

TOP

33554432 bit

2.7 V

TOP BOOT BLOCK

e1

NOR TYPE

.00005 Amp

8 mm

YES

70 ns

3

YES

SST39VF6401B-70-4C-B1KE-T

Microchip Technology

FLASH

COMMERCIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

2K

35 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

100

.8 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

2K

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

1

R-PBGA-B48

3.6 V

1.2 mm

100000 Write/Erase Cycles

8 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

e1

NOR TYPE

.00002 Amp

10 mm

YES

70 ns

3

YES

SST39VF6401B-70-4C-EKE-T

Microchip Technology

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

2K

35 mA

4194304 words

3

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

100

.5 mm

70 Cel

3-STATE

4MX16

4M

0 Cel

2K

YES

MATTE TIN

DUAL

1

R-PDSO-G48

3.6 V

1.2 mm

100000 Write/Erase Cycles

12 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

e3

NOR TYPE

.00002 Amp

18.4 mm

YES

70 ns

3

YES

SST38VF6401-90-5I-B3KE-T

Microchip Technology

FLASH

INDUSTRIAL

48

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K

50 mA

4194304 words

3

YES

3/3.3

16

GRID ARRAY, FINE PITCH

BGA48,6X8,32

Flash Memories

100

.8 mm

85 Cel

3-STATE

4MX16

4M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

1

R-PBGA-B48

3.6 V

1.2 mm

100000 Write/Erase Cycles

6 mm

Not Qualified

BOTTOM

67108864 bit

2.7 V

BOTTOM BOOT BLOCK

4

e1

NOR TYPE

.00003 Amp

8 mm

YES

90 ns

3

YES

MT29F64G08AKCCBH2-10Z:C

Micron Technology

FLASH

COMMERCIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

512K

50 mA

8589934592 words

NO

3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

70 Cel

8GX8

8G

0 Cel

16K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

68719476736 bit

4K

SLC NAND TYPE

.00005 Amp

20 ns

NO

MT29F2G08ABAEAH4-ITX:E

Micron Technology

FLASH

INDUSTRIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

35 mA

268435456 words

NO

3/3.3

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

2147483648 bit

2K

SLC NAND TYPE

.0001 Amp

25 ns

NO

MT29F2G08ABBEAH4-ITX:E

Micron Technology

FLASH

INDUSTRIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

20 mA

268435456 words

1.8

NO

1.8

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

256MX8

256M

-40 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

2147483648 bit

2K

SLC NAND TYPE

.00005 Amp

25 ns

NO

MT29F4G08ABADAH4-ITX:D

Micron Technology

FLASH

INDUSTRIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

35 mA

536870912 words

NO

3/3.3

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

85 Cel

512MX8

512M

-40 Cel

4K

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B63

Not Qualified

4294967296 bit

2K

e1

30

260

SLC NAND TYPE

.0001 Amp

25 ns

NO

MT29F8G16ADADAH4:D

Micron Technology

FLASH

COMMERCIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

64K

20 mA

536870912 words

NO

3/3.3

16

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

512MX16

512M

0 Cel

8K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

8589934592 bit

1K

SLC NAND TYPE

.00005 Amp

25 ns

NO

MT29F32G08ABAAAWP-Z:A

Micron Technology

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

1M

50 mA

4294967296 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

4GX8

4G

0 Cel

4K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

34359738368 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F32G08ABCABH1-10Z:A

Micron Technology

FLASH

COMMERCIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

4294967296 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

70 Cel

4GX8

4G

0 Cel

4K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

34359738368 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F64G08AFAAAWP-Z:A

Micron Technology

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

1M

50 mA

8589934592 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

8GX8

8G

0 Cel

8K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

68719476736 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F64G08AECABH1-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

8589934592 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

8GX8

8G

-40 Cel

8K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

68719476736 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F64G08AECABH1-10Z:A

Micron Technology

FLASH

COMMERCIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

8589934592 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

70 Cel

8GX8

8G

0 Cel

8K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

68719476736 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F64G08AECABJ1-10Z:A

Micron Technology

FLASH

COMMERCIAL

132

PLASTIC/EPOXY

YES

CMOS

PARALLEL

1M

50 mA

8589934592 words

NO

1.8,3/3.3

8

BGA132,11X17,40

Flash Memories

70 Cel

8GX8

8G

0 Cel

8K

YES

YES

Not Qualified

68719476736 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AJAAAWP-Z:A

Micron Technology

FLASH

COMMERCIAL

48

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

1M

50 mA

17179869184 words

NO

3/3.3

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP48,.8,20

Flash Memories

.5 mm

70 Cel

16GX8

16G

0 Cel

16K

YES

YES

DUAL

R-PDSO-G48

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AKAAAC5-Z:A

Micron Technology

FLASH

COMMERCIAL

52

LGA

PLASTIC/EPOXY

YES

CMOS

NO LEAD

PARALLEL

1M

50 mA

17179869184 words

NO

3/3.3

8

GRID ARRAY

LGA52(UNSPEC)

Flash Memories

70 Cel

16GX8

16G

0 Cel

16K

YES

YES

BOTTOM

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AKAAAC5-ITZ:A

Micron Technology

FLASH

INDUSTRIAL

52

LGA

PLASTIC/EPOXY

YES

CMOS

NO LEAD

PARALLEL

1M

50 mA

17179869184 words

NO

3/3.3

8

GRID ARRAY

LGA52(UNSPEC)

Flash Memories

85 Cel

16GX8

16G

-40 Cel

16K

YES

YES

BOTTOM

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AKCABH2-10Z:A

Micron Technology

FLASH

COMMERCIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

17179869184 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

70 Cel

16GX8

16G

0 Cel

16K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AKCABH2-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

17179869184 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

16GX8

16G

-40 Cel

16K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AMAAAC5-Z:A

Micron Technology

FLASH

COMMERCIAL

52

LGA

PLASTIC/EPOXY

YES

CMOS

NO LEAD

PARALLEL

1M

50 mA

17179869184 words

NO

3/3.3

8

GRID ARRAY

LGA52(UNSPEC)

Flash Memories

70 Cel

16GX8

16G

0 Cel

16K

YES

YES

BOTTOM

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AMAAAC5-ITZ:A

Micron Technology

FLASH

INDUSTRIAL

52

LGA

PLASTIC/EPOXY

YES

CMOS

NO LEAD

PARALLEL

1M

50 mA

17179869184 words

NO

3/3.3

8

GRID ARRAY

LGA52(UNSPEC)

Flash Memories

85 Cel

16GX8

16G

-40 Cel

16K

YES

YES

BOTTOM

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AMCABH2-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

17179869184 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

16GX8

16G

-40 Cel

16K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

137438953472 bit

8K

30

260

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AMCABH2-10Z:A

Micron Technology

FLASH

COMMERCIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

17179869184 words

NO

1.8,3/3.3

8

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

70 Cel

16GX8

16G

0 Cel

16K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F128G08AMCABJ2-10Z:A

Micron Technology

FLASH

COMMERCIAL

132

PLASTIC/EPOXY

YES

CMOS

PARALLEL

1M

50 mA

17179869184 words

NO

1.8,3/3.3

8

BGA132,11X17,40

Flash Memories

70 Cel

16GX8

16G

0 Cel

16K

YES

YES

Not Qualified

137438953472 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F256G08AUAAAC5-ITZ:A

Micron Technology

FLASH

INDUSTRIAL

52

LGA

PLASTIC/EPOXY

YES

CMOS

NO LEAD

PARALLEL

1M

50 mA

NO

3/3.3

GRID ARRAY

LGA52(UNSPEC)

Flash Memories

85 Cel

-40 Cel

32K

YES

YES

BOTTOM

Not Qualified

274877906944 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F256G08AUCABH3-10ITZ:A

Micron Technology

FLASH

INDUSTRIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

NO

1.8,3/3.3

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

85 Cel

-40 Cel

32K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

274877906944 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F256G08AUCABH3-10Z:A

Micron Technology

FLASH

COMMERCIAL

100

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

1M

50 mA

NO

1.8,3/3.3

GRID ARRAY

BGA100,10X17,40

Flash Memories

1 mm

70 Cel

0 Cel

32K

YES

YES

BOTTOM

R-PBGA-B100

Not Qualified

274877906944 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F256G08AUCABJ3-10Z:A

Micron Technology

FLASH

COMMERCIAL

132

PLASTIC/EPOXY

YES

CMOS

PARALLEL

1M

50 mA

NO

1.8,3/3.3

BGA132,11X17,40

Flash Memories

70 Cel

0 Cel

32K

YES

YES

Not Qualified

274877906944 bit

8K

SLC NAND TYPE

.00001 Amp

20 ns

NO

MT29F2G08ABBFAH4:F

Micron Technology

FLASH

COMMERCIAL

63

FBGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

20 mA

268435456 words

1.8

NO

1.8

8

GRID ARRAY, FINE PITCH

BGA63,10X12,32

Flash Memories

.8 mm

70 Cel

256MX8

256M

0 Cel

2K

YES

YES

BOTTOM

R-PBGA-B63

Not Qualified

2147483648 bit

2K

SLC NAND TYPE

.00005 Amp

25 ns

NO

N25Q064A13E14D0E

Micron Technology

FLASH

INDUSTRIAL

24

BGA

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

BALL

SERIAL

20 mA

8388608 words

3/3.3

8

GRID ARRAY

BGA24,4X6,40

Flash Memories

20

1 mm

85 Cel

8MX8

8M

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

100000 Write/Erase Cycles

108 MHz

Not Qualified

SPI

67108864 bit

NOR TYPE

.0001 Amp

M29W128GL70ZA6DE

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W128GSH70N6E

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

DUAL

R-PDSO-G56

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W128GSH70ZA6E

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W128GSH70ZS6E

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W128GSL70N6E

Micron Technology

FLASH

INDUSTRIAL

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

CMOS

GULL WING

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

8

Flash Memories

.5 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

DUAL

R-PDSO-G56

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W128GSL70ZA6E

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

M29W128GSL70ZS6E

Micron Technology

FLASH

INDUSTRIAL

64

BGA

SQUARE

PLASTIC/EPOXY

YES

CMOS

BALL

PARALLEL

128K

20 mA

8388608 words

YES

3/3.3

16

GRID ARRAY

BGA64,8X8,40

8

Flash Memories

1 mm

85 Cel

8MX16

8M

-40 Cel

128

YES

YES

BOTTOM

S-PBGA-B64

Not Qualified

134217728 bit

8/16

NOR TYPE

.0001 Amp

YES

70 ns

YES

PC28F256P30TFE

Micron Technology

FLASH

INDUSTRIAL

64

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

SYNCHRONOUS

16K,64K

31 mA

16777216 words

1.8

NO

1.8,1.8/3.3

16

GRID ARRAY, THIN PROFILE

BGA64,8X8,40

Flash Memories

1 mm

85 Cel

16MX16

16M

-40 Cel

4,255

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BOTTOM

R-PBGA-B64

2 V

1.2 mm

10 mm

Not Qualified

TOP

268435456 bit

1.7 V

e1

30

260

NOR TYPE

.00021 Amp

13 mm

YES

100 ns

1.8

NO

W25Q64CVSSIG

Winbond Electronics

FLASH

INDUSTRIAL

8

SOP

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

25 mA

8388608 words

3

3/3.3

8

SMALL OUTLINE

SOP8,.3

Flash Memories

20

1.27 mm

85 Cel

8MX8

8M

-40 Cel

DUAL

HARDWARE/SOFTWARE

S-PDSO-G8

3.6 V

2.16 mm

100000 Write/Erase Cycles

80 MHz

5.28 mm

Not Qualified

SPI

67108864 bit

2.7 V

NOT SPECIFIED

NOT SPECIFIED

NOR TYPE

.000005 Amp

5.28 mm

8.5 ns

2.7

SST39VF3202C-70-4I-B3KE

Microchip Technology

FLASH

INDUSTRIAL

48

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

4K,32K

45 mA

2097152 words

3

YES

3/3.3

16

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA48,6X8,32

Flash Memories

100

.8 mm

85 Cel

3-STATE

2MX16

2M

-40 Cel

8,63

YES

TIN SILVER COPPER

YES

BOTTOM

1

R-PBGA-B48

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

6 mm

Not Qualified

TOP

33554432 bit

2.7 V

TOP BOOT-BLOCK

e1

40

260

NOR TYPE

.00005 Amp

8 mm

YES

70 ns

3

YES

N25Q128A13B1240E

Micron Technology

FLASH

INDUSTRIAL

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

Flash Memories

20

1 mm

85 Cel

16MX8

16M

-40 Cel

TIN SILVER COPPER

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

BOTTOM

134217728 bit

2.7 V

e1

NOR TYPE

.0001 Amp

8 mm

3

N25Q128A13BF840E

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

BOTTOM

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

8 mm

3

N25Q128A13BSF40G

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

BOTTOM

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

N25Q128A13TF840E

Micron Technology

FLASH

INDUSTRIAL

8

HVSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

NO LEAD

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

SOLCC8,.3

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-N8

3.6 V

1 mm

100000 Write/Erase Cycles

108 MHz

6 mm

Not Qualified

SPI

TOP

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

8 mm

3

N25Q128A13TSF40G

Micron Technology

FLASH

INDUSTRIAL

16

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SERIAL

SYNCHRONOUS

20 mA

16777216 words

3

3/3.3

8

SMALL OUTLINE

SOP16,.4

Flash Memories

20

1.27 mm

85 Cel

16MX8

16M

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDSO-G16

3.6 V

2.65 mm

100000 Write/Erase Cycles

108 MHz

7.5 mm

Not Qualified

SPI

TOP

134217728 bit

2.7 V

30

260

NOR TYPE

.0001 Amp

10.3 mm

3

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.