153 Other Function Memory ICs 17

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	No. of Words	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Qualification	Memory Density
MTFC2GMTEA-WT	Micron Technology		OTHER	153	FBGA	SQUARE	PLASTIC/EPOXY	YES			BALL			1.8/3.3,3/3.3		GRID ARRAY, FINE PITCH	BGA153,14X14,20	Other Memory ICs	.5 mm	85 Cel			-25 Cel	BOTTOM	S-PBGA-B153	Not Qualified	17179869184 bit
MTFC4GMTEA-WT	Micron Technology		OTHER	153	FBGA	SQUARE	PLASTIC/EPOXY	YES			BALL			1.8/3.3,3/3.3		GRID ARRAY, FINE PITCH	BGA153,14X14,20	Other Memory ICs	.5 mm	85 Cel			-25 Cel	BOTTOM	S-PBGA-B153	Not Qualified	34359738368 bit
THGBMGG9U4LBAIR	Toshiba	MEMORY CIRCUIT	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		68719476736 words		8	GRID ARRAY				85 Cel	64GX8	64G	-25 Cel	BOTTOM	R-PBGA-B153		549755813888 bit
THGBMGT0U8LBAIG	Toshiba	MEMORY CIRCUIT	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		137438953472 words		8	GRID ARRAY				85 Cel	128GX8	128G	-25 Cel	BOTTOM	R-PBGA-B153		1099511627776 bit
THGBMHG6C1LBAIL	Toshiba	MEMORY CIRCUIT	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		8589934592 words		8	GRID ARRAY				85 Cel	8GX8	8G	-25 Cel	BOTTOM	R-PBGA-B153		68719476736 bit
THGBMHG6C1LBAU6	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		8589934592 words		8	GRID ARRAY				105 Cel	8GX8	8G	-40 Cel	BOTTOM	R-PBGA-B153		68719476736 bit
THGBMHG7C1LBAIL	Toshiba	MEMORY CIRCUIT	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		17179869184 words		8	GRID ARRAY				85 Cel	16GX8	16G	-25 Cel	BOTTOM	R-PBGA-B153		137438953472 bit
THGBMHG7C2LBAU7	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		17179869184 words		8	GRID ARRAY				105 Cel	16GX8	16G	-40 Cel	BOTTOM	R-PBGA-B153		137438953472 bit
THGBMHG8C2LBAIL	Toshiba	MEMORY CIRCUIT	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		34359738368 words		8	GRID ARRAY				85 Cel	32GX8	32G	-25 Cel	BOTTOM	R-PBGA-B153		274877906944 bit
THGBMHG8C4LBAU7	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		34359738368 words		8	GRID ARRAY				105 Cel	32GX8	32G	-40 Cel	BOTTOM	R-PBGA-B153		274877906944 bit
THGBMHG9C4LBAIR	Toshiba	MEMORY CIRCUIT	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		68719476736 words		8	GRID ARRAY				85 Cel	64GX8	64G	-25 Cel	BOTTOM	R-PBGA-B153		549755813888 bit
THGBMHG9C8LBAU8	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		68719476736 words		8	GRID ARRAY				105 Cel	64GX8	64G	-40 Cel	BOTTOM	R-PBGA-B153		549755813888 bit
THGBMHT0C8LBAIG	Toshiba	MEMORY CIRCUIT	OTHER	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL		137438953472 words		8	GRID ARRAY				85 Cel	128GX8	128G	-25 Cel	BOTTOM	R-PBGA-B153		1099511627776 bit
THGBMHG6C1LBAWL	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS	8589934592 words		8	GRID ARRAY				85 Cel	8GX8	8G	-40 Cel	BOTTOM	R-PBGA-B153		68719476736 bit
THGBMHG7C2LBAWR	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS	17179869184 words		8	GRID ARRAY				85 Cel	16GX8	16G	-40 Cel	BOTTOM	R-PBGA-B153		137438953472 bit
THGBMHG8C4LBAWR	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS	34359738368 words		8	GRID ARRAY				85 Cel	32GX8	32G	-40 Cel	BOTTOM	R-PBGA-B153		274877906944 bit
THGBMHG9C8LBAWG	Toshiba	MEMORY CIRCUIT	INDUSTRIAL	153	BGA	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	BALL	ASYNCHRONOUS	68719476736 words		8	GRID ARRAY				85 Cel	64GX8	64G	-40 Cel	BOTTOM	R-PBGA-B153		549755813888 bit

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.