20 Other Function Memory ICs 7

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Part	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Terminal Form	Operating Mode	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Maximum Clock Frequency (fCLK)	Width	Qualification	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Maximum Standby Current	Length	Maximum Access Time
TMS4C1050-60DJ	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	20	SOJ	RECTANGULAR	PLASTIC/EPOXY	YES		CMOS	J BEND		35 mA			5	5		SMALL OUTLINE	SOJ20/26,.34	Other Memory ICs	1.27 mm	70 Cel				0 Cel		DUAL	R-PDSO-J20						Not Qualified					NOT SPECIFIED	NOT SPECIFIED	.01 Amp		60 ns
XC17S40SO20C	Xilinx	MEMORY CIRCUIT	COMMERCIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	10 mA	329312 words	COMMON	5	5	1	SMALL OUTLINE	SOP20,.4	OTP ROMs	1.27 mm	70 Cel	3-STATE	329312X1	329312	0 Cel	TIN LEAD	DUAL	R-PDSO-G20	3	5.25 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	329312 bit	4.75 V		e0	30	225	.00005 Amp	12.8 mm
XC17S40SO20I	Xilinx	MEMORY CIRCUIT	INDUSTRIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	10 mA	329312 words	COMMON	5	5	1	SMALL OUTLINE	SOP20,.4	OTP ROMs	1.27 mm	85 Cel	3-STATE	329312X1	329312	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	3	5.5 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	329312 bit	4.5 V		e0	30	225	.00005 Amp	12.8 mm
XC17S40XLSO20C	Xilinx	MEMORY CIRCUIT	COMMERCIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	5 mA	330696 words	COMMON	3.3	3.3	1	SMALL OUTLINE	SOP20,.4	OTP ROMs	1.27 mm	70 Cel	3-STATE	330696X1	330696	0 Cel	TIN LEAD	DUAL	R-PDSO-G20	3	3.6 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	330696 bit	3 V		e0	30	225	.00005 Amp	12.8 mm
XC17S40XLSO20I	Xilinx	MEMORY CIRCUIT	INDUSTRIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	5 mA	330696 words	COMMON	3.3	3.3	1	SMALL OUTLINE	SOP20,.4	OTP ROMs	1.27 mm	85 Cel	3-STATE	330696X1	330696	-40 Cel	TIN LEAD	DUAL	R-PDSO-G20	3	3.6 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	330696 bit	3 V		e0	30	225	.00005 Amp	12.8 mm
SN74LS600ADW	Texas Instruments	MEMORY CIRCUIT	COMMERCIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	TTL	GULL WING	ASYNCHRONOUS		16384 words		5		1	SMALL OUTLINE			1.27 mm	70 Cel		16KX1	16K	0 Cel		DUAL	R-PDSO-G20		5.25 V	2.65 mm		7.5 mm	Not Qualified	16384 bit	4.75 V	DRAM IS CONFIGURED AS 4 K X 1		NOT SPECIFIED	NOT SPECIFIED		12.8 mm
XC17S150XLSO20C	Xilinx	MEMORY CIRCUIT	COMMERCIAL	20	SOP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS	GULL WING	SYNCHRONOUS	5 mA	1040128 words	COMMON	3.3	3.3	1	SMALL OUTLINE	SOP20,.4	OTP ROMs	1.27 mm	70 Cel	3-STATE	1040128X1	1040128	0 Cel	TIN LEAD	DUAL	R-PDSO-G20	3	3.6 V	2.65 mm	10 MHz	7.5 mm	Not Qualified	1040128 bit	3 V		e0	30	225	.00005 Amp	12.8 mm

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.