DIMM Other Function Memory ICs 11

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Part	Manufacturer	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Package Body Material	Surface Mount	Technology	Terminal Form	Maximum Supply Current	No. of Words	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Output Characteristics	Organization	No. of Words Code	Minimum Operating Temperature	Terminal Position	JESD-30 Code	Maximum Clock Frequency (fCLK)	Qualification	Memory Density	Maximum Standby Current	Maximum Access Time
MT9VDDT6472HY-40BF2	Micron Technology	COMMERCIAL	200	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	4050 mA	67108864 words	COMMON	2.6	2.6	72	MICROELECTRONIC ASSEMBLY	DIMM200,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M	0 Cel	DUAL	R-PDMA-N200	200 MHz	Not Qualified	4831838208 bit	.045 Amp	.7 ns
MT9HTF3272Y-40EB2	Micron Technology	COMMERCIAL	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2070 mA	33554432 words	COMMON	1.8	1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	70 Cel	3-STATE	32MX72	32M	0 Cel	DUAL	R-PDMA-N240	200 MHz	Not Qualified	2415919104 bit	.045 Amp	.6 ns
MT9VDDF3272Y-40BK1	Micron Technology	COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	4050 mA	33554432 words	COMMON	2.6	2.6	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M	0 Cel	DUAL	R-PDMA-N184	200 MHz	Not Qualified	2415919104 bit	.036 Amp	.7 ns
MT36HTF51272FZ-667H1N8	Micron Technology		240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	4480 mA	536870912 words	COMMON		1.5,1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm		3-STATE	512MX72	512M		DUAL	R-PDMA-N240	333 MHz	Not Qualified	38654705664 bit
MT72HTS1G72FZ-667H1D6	Micron Technology	OTHER	240	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD		1073741824 words	COMMON		1.5,1.8	72	MICROELECTRONIC ASSEMBLY	DIMM240,40	Other Memory ICs	1 mm	95 Cel	3-STATE	1GX72	1G	0 Cel	DUAL	R-PDMA-N240	333 MHz	Not Qualified	77309411328 bit		.45 ns
MT18VDDF12872DG-335J1	Micron Technology	COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	5220 mA	134217728 words	COMMON	2.5	2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	128MX72	128M	0 Cel	DUAL	R-PDMA-N184	166 MHz	Not Qualified	9663676416 bit	.09 Amp	.7 ns
MT18HTF25672PKZ-667H1	Micron Technology	COMMERCIAL	244	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	3870 mA	268435456 words	COMMON	1.8	1.8	72	MICROELECTRONIC ASSEMBLY	DIMM244,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	256MX72	256M	0 Cel	DUAL	R-PDMA-N244	333 MHz	Not Qualified	19327352832 bit		.45 ns
MT9HVF6472PKZ-667G1	Micron Technology	COMMERCIAL	244	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	2160 mA	67108864 words	COMMON	1.8	1.8	72	MICROELECTRONIC ASSEMBLY	DIMM244,24	Other Memory ICs	.6 mm	70 Cel	3-STATE	64MX72	64M	0 Cel	DUAL	R-PDMA-N244	333 MHz	Not Qualified	4831838208 bit	.063 Amp	.45 ns
MT9VDDT3272AG-335G4	Micron Technology	COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	3690 mA	33554432 words	COMMON	2.5	2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M	0 Cel	DUAL	R-PDMA-N184	167 MHz	Not Qualified	2415919104 bit	.036 Amp	.7 ns
MT9VDDT3272AG-265G4	Micron Technology	COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	3285 mA	33554432 words	COMMON	2.5	2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	32MX72	32M	0 Cel	DUAL	R-PDMA-N184	133 MHz	Not Qualified	2415919104 bit	.036 Amp	.75 ns
MT9VDDT6472AG-335F1	Micron Technology	COMMERCIAL	184	DIMM	8192	RECTANGULAR	PLASTIC/EPOXY	NO	CMOS	NO LEAD	3645 mA	67108864 words	COMMON	2.5	2.5	72	MICROELECTRONIC ASSEMBLY	DIMM184	Other Memory ICs	1.27 mm	70 Cel	3-STATE	64MX72	64M	0 Cel	DUAL	R-PDMA-N184	167 MHz	Not Qualified	4831838208 bit	.045 Amp	.7 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.