QCCJ Other Function Memory ICs 2

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Part	RoHS	Manufacturer	Memory IC Type	Temperature Grade	No. of Terminals	Package Code	Refresh Cycles	Package Shape	Total Dose (V)	Package Body Material	Access Mode	Surface Mount	No. of Functions	Technology	Screening Level	Terminal Form	Parallel or Serial	Operating Mode	Sector Size (Words)	Maximum Supply Current	No. of Words	Sequential Burst Length	Self Refresh	Input/Output Type	Nominal Supply Voltage / Vsup (V)	Mixed Memory Type	Toggle Bit	Power Supplies (V)	Memory Width	Package Style (Meter)	Package Equivalence Code	Sub-Category	Minimum Data Retention Time	Terminal Pitch	Maximum Operating Temperature	Reverse Pinout	Output Characteristics	Organization	No. of Words Code	Minimum Standby Voltage	Minimum Operating Temperature	No. of Sectors/Size	Command User Interface	Terminal Finish	I2C Control Byte	Terminal Position	No. of Ports	Write Protection	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Endurance	Maximum Clock Frequency (fCLK)	Width	Qualification	Serial Bus Type	Boot Block	Memory Density	Minimum Supply Voltage (Vsup)	Additional Features	Page Size (words)	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Type	Maximum Standby Current	Interleaved Burst Length	Length	Common Flash Interface	Maximum Access Time	Programming Voltage (V)	Data Polling
DSM2180F3V-15K6		STMicroelectronics	MEMORY CIRCUIT	INDUSTRIAL	52	QCCJ		SQUARE		PLASTIC/EPOXY		YES	1	CMOS		J BEND		ASYNCHRONOUS			131072 words				3.3				8	CHIP CARRIER				1.27 mm	85 Cel			128KX8	128K		-40 Cel			MATTE TIN		QUAD			S-PQCC-J52		3.6 V	4.57 mm			19.1262 mm	Not Qualified			1048576 bit	3 V			e3						19.1262 mm
DSM2190F4V-15K6		STMicroelectronics	MEMORY CIRCUIT	INDUSTRIAL	52	QCCJ		SQUARE		PLASTIC/EPOXY		YES	1	CMOS		J BEND		ASYNCHRONOUS			262144 words				3.3				8	CHIP CARRIER				1.27 mm	85 Cel			256KX8	256K		-40 Cel			MATTE TIN		QUAD			S-PQCC-J52		3.6 V	4.57 mm			19.1262 mm	Not Qualified			2097152 bit	3 V	ALSO CONTAINS 32K X 8 SECONDARY FLASH MEMORY		e3						19.1262 mm

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.