AUTOMOTIVE Other Function Memory ICs 13

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Refresh Cycles Package Shape Total Dose (V) Package Body Material Access Mode Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Sequential Burst Length Self Refresh Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish I2C Control Byte Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Interleaved Burst Length Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

CC2544RHBT

Texas Instruments

MEMORY CIRCUIT

AUTOMOTIVE

HVQCCN

SQUARE

PLASTIC/EPOXY

YES

NO LEAD

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

LCC32,.2SQ,20

.5 mm

125 Cel

-40 Cel

NICKEL PALLADIUM GOLD SILVER

QUAD

S-PQCC-N32

3

3.6 V

1 mm

2496 MHz

5 mm

2 V

e4

30

260

5 mm

MR2A16AMYS35R

Everspin Technologies

MEMORY CIRCUIT

AUTOMOTIVE

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

ASYNCHRONOUS

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

125 Cel

256KX16

256K

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

4194304 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

18.41 mm

MR2A16AMYS35

Everspin Technologies

MEMORY CIRCUIT

AUTOMOTIVE

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

ASYNCHRONOUS

262144 words

3.3

16

SMALL OUTLINE, THIN PROFILE

.8 mm

125 Cel

256KX16

256K

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

4194304 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

18.41 mm

MR25H256MDC

Everspin Technologies

MEMORY CIRCUIT

AUTOMOTIVE

8

HSON

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

NO LEAD

SYNCHRONOUS

32768 words

3.3

3/3.3

8

SMALL OUTLINE, HEAT SINK/SLUG

SOLCC8,.25

SRAMs

1.27 mm

125 Cel

32KX8

32K

-40 Cel

DUAL

R-PDSO-N8

3.6 V

1.05 mm

5 mm

Not Qualified

262144 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.00001 Amp

6 mm

MR2A08AMYS35R

Everspin Technologies

MEMORY CIRCUIT

AUTOMOTIVE

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

ASYNCHRONOUS

135 mA

262144 words

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

.8 mm

125 Cel

256KX8

256K

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

2097152 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.02 Amp

18.41 mm

35 ns

MR2A08AMYS35

Everspin Technologies

MEMORY CIRCUIT

AUTOMOTIVE

44

TSOP2

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

ASYNCHRONOUS

135 mA

262144 words

3.3

3.3

8

SMALL OUTLINE, THIN PROFILE

TSOP44,.46,32

SRAMs

.8 mm

125 Cel

256KX8

256K

-40 Cel

DUAL

R-PDSO-G44

3.6 V

1.2 mm

10.16 mm

Not Qualified

2097152 bit

3 V

NOT SPECIFIED

NOT SPECIFIED

.02 Amp

18.41 mm

35 ns

47C04-E/SN

Microchip Technology

MEMORY CIRCUIT

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

512 words

5

EEPROM+SRAM

8

SMALL OUTLINE

SOP8,.23

1.27 mm

125 Cel

512X8

512

-40 Cel

MATTE TIN

DUAL

1

R-PDSO-G8

3

5.5 V

1.75 mm

3.9 mm

4096 bit

4.5 V

e3

40

260

4.9 mm

400 ns

47C04-E/ST

Microchip Technology

MEMORY CIRCUIT

AUTOMOTIVE

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

512 words

5

EEPROM+SRAM

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

.65 mm

125 Cel

512X8

512

-40 Cel

MATTE TIN

DUAL

1

R-PDSO-G8

1

5.5 V

1.2 mm

3 mm

4096 bit

4.5 V

e3

40

260

4.4 mm

400 ns

47C04T-E/SN

Microchip Technology

MEMORY CIRCUIT

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

512 words

5

EEPROM+SRAM

8

SMALL OUTLINE

SOP8,.23

1.27 mm

125 Cel

512X8

512

-40 Cel

MATTE TIN

DUAL

1

R-PDSO-G8

3

5.5 V

1.75 mm

3.9 mm

4096 bit

4.5 V

e3

40

260

4.9 mm

400 ns

47C04T-E/ST

Microchip Technology

MEMORY CIRCUIT

AUTOMOTIVE

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

512 words

5

EEPROM+SRAM

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

.65 mm

125 Cel

512X8

512

-40 Cel

MATTE TIN

DUAL

1

R-PDSO-G8

1

5.5 V

1.2 mm

3 mm

4096 bit

4.5 V

e3

40

260

4.4 mm

400 ns

47L16-E/P

Microchip Technology

MEMORY CIRCUIT

AUTOMOTIVE

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SYNCHRONOUS

2048 words

EEPROM+SRAM

8

IN-LINE

DIP8,.3

2.54 mm

125 Cel

2KX8

2K

-40 Cel

MATTE TIN

DUAL

1

R-PDIP-T8

3.6 V

5.334 mm

7.62 mm

16384 bit

2.7 V

e3

9.271 mm

400 ns

47L16T-E/SN

Microchip Technology

MEMORY CIRCUIT

AUTOMOTIVE

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

2048 words

EEPROM+SRAM

8

SMALL OUTLINE

SOP8,.23

1.27 mm

125 Cel

2KX8

2K

-40 Cel

MATTE TIN

DUAL

1

R-PDSO-G8

3

3.6 V

1.75 mm

3.9 mm

16384 bit

2.7 V

e3

40

260

4.9 mm

400 ns

47L16T-E/ST

Microchip Technology

MEMORY CIRCUIT

AUTOMOTIVE

8

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

SYNCHRONOUS

2048 words

EEPROM+SRAM

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP8,.25

.65 mm

125 Cel

2KX8

2K

-40 Cel

MATTE TIN

DUAL

1

R-PDSO-G8

1

3.6 V

1.2 mm

3 mm

16384 bit

2.7 V

e3

40

260

4.4 mm

400 ns

Other Function Memory ICs

Other function memory ICs are a group of integrated circuits that perform specialized functions in addition to storing data. These ICs are used in a wide range of digital devices, including computers, smartphones, and electronic devices.

One example of an other function memory IC is cache memory. Cache memory is a type of memory that stores frequently accessed data and instructions. Cache memory is used to improve the performance of the system by reducing the time it takes to access data from the main memory.

Another example of an other function memory IC is dynamic random-access memory (DRAM). DRAM is a type of memory that stores data as a charge in a capacitor. DRAM is commonly used as the main memory in computers and other digital devices.

Static random-access memory (SRAM) is another type of other function memory IC. SRAM is a type of memory that stores data as a flip-flop, which retains the data as long as power is supplied to the system. SRAM is commonly used as cache memory and in other applications where high-speed access to data is required.

Memory controller ICs are another type of other function memory IC. Memory controller ICs are used to manage the flow of data between the CPU and the memory subsystem. These ICs are commonly used in computer systems and other digital devices to ensure that data is transferred efficiently and reliably.