| Part | RoHS | Manufacturer | Memory IC Type | Temperature Grade | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Nominal Negative Supply Voltage | Terminal Form | Parallel or Serial | Operating Mode | Maximum Supply Current | No. of Words | Input/Output Type | Nominal Supply Voltage / Vsup (V) | Power Supplies (V) | Memory Width | Package Style (Meter) | Package Equivalence Code | Alternate Memory Width | Sub-Category | Minimum Data Retention Time | Terminal Pitch | Maximum Operating Temperature | Reverse Pinout | Output Characteristics | Organization | No. of Words Code | Minimum Operating Temperature | Terminal Finish | Terminal Position | No. of Ports | Write Protection | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Supply Voltage (Vsup) | Maximum Seated Height | Endurance | Maximum Clock Frequency (fCLK) | Width | Qualification | Memory Density | Minimum Supply Voltage (Vsup) | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Maximum Standby Current | Length | Maximum Access Time | Programming Voltage (V) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
70 ns |
12.75 |
|||||||||||||||
|
|
STMicroelectronics |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
32KX8 |
32K |
-40 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
90 ns |
12.75 |
|||||||||||||||
|
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
42 |
SDIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
70 mA |
2097152 words |
COMMON |
5 |
5 |
16 |
IN-LINE, SHRINK PITCH |
DIP42,.6 |
OTP ROMs |
1.778 mm |
70 Cel |
3-STATE |
2MX16 |
2M |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T42 |
5.5 V |
5.08 mm |
15.24 mm |
Not Qualified |
33554432 bit |
4.5 V |
e3 |
.0001 Amp |
36.83 mm |
100 ns |
||||||||||||||||
|
|
Atmel |
OTP ROM |
INDUSTRIAL |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE |
SOP28,.5 |
OTP ROMs |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
2 |
5.5 V |
2.79 mm |
8.69 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
250 |
.0001 Amp |
18.25 mm |
70 ns |
||||||||||||||
|
|
Atmel |
OTP ROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
DUAL |
R-PDSO-G28 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
524288 bit |
4.5 V |
.0001 Amp |
11.8 mm |
70 ns |
||||||||||||||||||
|
Texas Instruments |
OTP ROM |
MILITARY |
16 |
DIP |
RECTANGULAR |
CERAMIC, GLASS-SEALED |
NO |
1 |
CMOS |
38535Q/M;38534H;883B |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
110 mA |
32 words |
SEPARATE |
5 |
5 |
8 |
IN-LINE |
DIP16,.3 |
OTP ROMs |
2.54 mm |
125 Cel |
32X8 |
32 |
-55 Cel |
TIN LEAD |
DUAL |
R-GDIP-T16 |
5.5 V |
5.08 mm |
7.62 mm |
Not Qualified |
256 bit |
4.5 V |
e0 |
19.56 mm |
50 ns |
||||||||||||||||||
|
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
90 ns |
||||||||||||||||
|
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
32768 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
32KX8 |
32K |
0 Cel |
MATTE TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
262144 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
90 ns |
||||||||||||||||
|
|
Atmel |
OTP ROM |
INDUSTRIAL |
32 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
CMOS |
THROUGH-HOLE |
PARALLEL |
ASYNCHRONOUS |
35 mA |
131072 words |
COMMON |
5 |
5 |
8 |
IN-LINE |
DIP32,.6 |
OTP ROMs |
2.54 mm |
85 Cel |
3-STATE |
128KX8 |
128K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDIP-T32 |
1 |
5.5 V |
4.826 mm |
15.24 mm |
Not Qualified |
1048576 bit |
4.5 V |
e3 |
245 |
.00001 Amp |
42.037 mm |
45 ns |
||||||||||||||
|
|
Atmel |
OTP ROM |
INDUSTRIAL |
28 |
TSOP1 |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
PARALLEL |
ASYNCHRONOUS |
20 mA |
65536 words |
COMMON |
5 |
5 |
8 |
SMALL OUTLINE, THIN PROFILE |
TSSOP28,.53,22 |
OTP ROMs |
.55 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G28 |
3 |
5.5 V |
1.2 mm |
8 mm |
Not Qualified |
524288 bit |
4.5 V |
e3 |
260 |
.0001 Amp |
11.8 mm |
45 ns |
||||||||||||||
|
|
Texas Instruments |
OTP ROM |
INDUSTRIAL |
3 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
ASYNCHRONOUS |
.02 mA |
1024 words |
COMMON |
2.7 |
3/5 |
1 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
TO-236 |
OTP ROMs |
.95 mm |
85 Cel |
OPEN-DRAIN |
1KX1 |
1K |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G3 |
1 |
5.5 V |
1.12 mm |
.01667 MHz |
1.3 mm |
Not Qualified |
1024 bit |
2.65 V |
ORGANIZED AS 4 PAGES OF 32 BYTES EACH |
e4 |
30 |
260 |
2.92 mm |
|||||||||||||
|
|
STMicroelectronics |
OTP ROM |
COMMERCIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
35 mA |
1048576 words |
COMMON |
5 |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
OTP ROMs |
1.27 mm |
70 Cel |
3-STATE |
1MX8 |
1M |
0 Cel |
TIN |
QUAD |
R-PQCC-J32 |
5.5 V |
3.56 mm |
11.43 mm |
Not Qualified |
8388608 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
55 ns |
||||||||||||||||
|
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
25 mA |
262144 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
256KX8 |
256K |
-40 Cel |
MATTE TIN |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
2097152 bit |
4.5 V |
e3 |
.0001 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||||||||
|
|
Texas Instruments |
OTP ROM |
OTHER |
3 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
GULL WING |
SERIAL |
SYNCHRONOUS |
1024 words |
3 |
1 |
SMALL OUTLINE |
.95 mm |
70 Cel |
1KX1 |
1K |
-20 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
DUAL |
R-PDSO-G3 |
1 |
5.5 V |
1.12 mm |
1.3 mm |
1024 bit |
2.65 V |
e4 |
NOT SPECIFIED |
260 |
2.92 mm |
||||||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
30 mA |
524288 words |
COMMON |
5 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
QUAD |
1 |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
4194304 bit |
4.5 V |
.00001 Amp |
13.97 mm |
70 ns |
13 |
||||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
10 mA |
524288 words |
COMMON |
3.3 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
512KX8 |
512K |
-40 Cel |
QUAD |
1 |
R-PQCC-J32 |
3.6 V |
3.556 mm |
11.43 mm |
4194304 bit |
3 V |
ALSO OPERATES AT 5V SUPPLY |
.00002 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
8 mA |
65536 words |
COMMON |
3.3 |
8 |
CHIP CARRIER |
LCC32,.45X.55 |
1.27 mm |
85 Cel |
3-STATE |
64KX8 |
64K |
-40 Cel |
QUAD |
1 |
R-PQCC-J32 |
3.6 V |
3.556 mm |
11.43 mm |
524288 bit |
3 V |
ALSO OPERATES AT 5V SUPPLY |
.00002 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||||||||||
|
Microchip Technology |
OTP ROM |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
40 mA |
1048576 words |
SEPARATE |
5 |
8 |
CHIP CARRIER |
LDCC32,.5X.6 |
1.27 mm |
85 Cel |
1MX8 |
1M |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
8388608 bit |
4.5 V |
.001 Amp |
13.97 mm |
90 ns |
13 |
|||||||||||||||||||||||
|
Microchip Technology |
OTP ROM |
INDUSTRIAL |
32 |
QCCJ |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
J BEND |
PARALLEL |
ASYNCHRONOUS |
32768 words |
5 |
8 |
CHIP CARRIER |
1.27 mm |
85 Cel |
32KX8 |
32K |
-40 Cel |
QUAD |
R-PQCC-J32 |
5.5 V |
3.556 mm |
11.43 mm |
262144 bit |
4.5 V |
13.97 mm |
70 ns |
OTP ROM, or One-Time Programmable Read-Only Memory, is a type of non-volatile computer memory that is programmed once and cannot be reprogrammed. OTP ROM is used to store data that needs to be permanently stored and cannot be changed or updated in the future.
OTP ROM is created using a process similar to that used to manufacture Mask ROM. However, instead of programming the memory during the manufacturing process, OTP ROM is programmed after the manufacturing process, but before it is delivered to the customer. This allows the customer to program the memory with the data that they need to store permanently.
OTP ROM is commonly used in devices such as microcontrollers, smart cards, and other electronic devices that require permanent storage of data. It is ideal for storing critical data, such as system settings, encryption keys, and other sensitive information that needs to be permanently stored and cannot be changed or updated in the future.