50 % XO Clock Oscillators 172

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Part	Manufacturer	Oscillator Type	Mounting Feature	No. of Terminals	Frequency Stability	Frequency Adjustment (Mechanical)	Package Body Material	Maximum Supply Voltage	Technology	Screening Level	Output Load	Maximum Supply Current	Nominal Supply Voltage	Package Equivalence Code	Maximum Rise Time	Physical Dimension	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Nominal Operating Frequency	Maximum Fall Time	Maximum Symmetry (%)	Maximum Output Low Current	Additional Features	JESD-609 Code
MX553LBB148M500	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO		3.63 V			100 OHM				.4 ms	5.0mm x 3.2mm x 1.4mm	2.375 V	85 Cel	-40 Cel	MATTE TIN	148.5 MHz	.4 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT	e3
MX554BBG322M265	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO		3.63 V			100 OHM				.4 ms	5.0mm x 3.2mm x 1.4mm	2.375 V	85 Cel	-40 Cel	MATTE TIN	322.265 MHz	.4 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT	e3
MX573ABC212M500-TR	Microchip Technology	CMOS	SURFACE MOUNT	6	50 %	NO		3.63 V							.5 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel	MATTE TIN	212.5 MHz	.5 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; TR	e3
MX573EBB125M000	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO		3.63 V			100 OHM				.4 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel	MATTE TIN	125 MHz	.4 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT	e3
MX574BBD322M265-TR	Microchip Technology	HCSL	SURFACE MOUNT	6	50 %	NO		3.63 V			50 OHM				.45 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel	MATTE TIN	322.265 MHz	.45 ns	52/48		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR	e3
MX575ABB50M0000-TR	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO		3.63 V			100 OHM				.4 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel	MATTE TIN	50 MHz	.4 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR	e3
MX575ABB50M0000	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO		3.63 V			100 OHM				.4 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel	MATTE TIN	50 MHz	.4 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT	e3
MX573NBA622M080-TR	Microchip Technology	PECL	SURFACE MOUNT	6	50 %	NO		3.63 V			50 OHM				.35 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel		622.08 MHz	.35 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR
MX573NBB311M040-TR	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO		3.63 V			100 OHM				.4 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel		311.04 MHz	.4 ns	55/45		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR
MX573NBD311M040-TR	Microchip Technology	HCSL	SURFACE MOUNT	6	50 %	NO		3.63 V			50 OHM				.45 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	85 Cel	-40 Cel		311.04 MHz	.45 ns	52/48		TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR
NX53D3301Z	Diodes Incorporated	CMOS	SURFACE MOUNT	6	50 %	NO		3.465 V	CMOS		35 OHM	70 mA	3.3 V		.5 ms	5.0mm x 3.2mm x 1.2mm	3.135 V	85 Cel	-40 Cel		133.333333 MHz	.5 ns	45/55		STANDBY; ENABLE/DISABLE FUNCTION; TR, 7 INCH
ECS-2520Q-33-260BS-TR	Ecs International	HCMOS	SURFACE MOUNT	4	50 %	NO	CERAMIC	3.465 V		AEC-Q200	15 pF	7 mA	3.3 V	LCC4,.08X.1,68/52	10 ms	2.5mm x 2.0mm x 0.8mm	3.135 V	125 Cel	-40 Cel	Gold (Au)	26 MHz	10 ns	45/55		TRI-STATE; ENABLE/DISABLE FUNCTION	e4
CA50C2403IMT	Cts	HCMOS	SURFACE MOUNT	4	50 %	NO	CERAMIC	1.89 V	HCMOS	AEC-Q200	15 pF	25 mA	1.8 V	DILCC4,.12	5 ms	5.0mm x 3.2mm x 1.3mm	1.71 V	85 Cel	-40 Cel	Gold Flash (Au) - with Nickel (Ni) barrier	24 MHz	5 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION
CA50C1473GNT	Cts	HCMOS	SURFACE MOUNT	4	50 %	NO	CERAMIC	2.665 V	HCMOS	AEC-Q200	15 pF	30 mA	2.5 V	DILCC4,.12	5 ms	5.0mm x 3.2mm x 1.3mm	2.375 V	105 Cel	-40 Cel	Gold Flash (Au) - with Nickel (Ni) barrier	14.7456 MHz	5 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION
CA70C1473GNT	Cts	HCMOS	SURFACE MOUNT	4	50 %	NO	CERAMIC	2.625 V	HCMOS	AEC-Q200	15 pF	30 mA	2.5 V		5 ms	7.0mm x 5.0mm x 1.4mm	2.375 V	105 Cel	-40 Cel	Gold (Au) - with Nickel (Ni) barrier	14.7456 MHz	5 ns	55/45	4 Amp	STANDBY; ENABLE/DISABLE FUNCTION	e4
643H10003I3R	Cts	HCSL	SURFACE MOUNT	6	50 %	NO	CERAMIC	3.465 V			50 OHM	60 mA	3.3 V	LCC6,.1X.12,75/51	.7 ms	3.2mm x 2.5mm x 0.9mm	3.135 V	85 Cel	-40 Cel	GOLD OVER NICKEL	100 MHz	.7 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT	e4
643H2503G3R	Cts	HCSL	SURFACE MOUNT	6	50 %	NO	CERAMIC	3.465 V			50 OHM	60 mA	3.3 V	LCC6,.1X.12,75/51	.7 ms	3.2mm x 2.5mm x 0.9mm	3.135 V	105 Cel	-40 Cel	GOLD OVER NICKEL	25 MHz	.7 ns	55/45		STANDBY; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT	e4
CA32C2403HMT	Cts	HCMOS	SURFACE MOUNT	4	50 %	NO	CERAMIC	1.89 V	HCMOS	AEC-Q200	15 pF	40 mA	1.8 V	LCC4,.1X.12,83/65	7 ms	3.2mm x 2.5mm x 1.2mm	1.71 V	125 Cel	-40 Cel	Gold (Au) - with Nickel (Ni) barrier	24 MHz	7 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION	e4
HT-MM900A7-7K-EE-50M0000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO		3.63 V					3.3 V	SOLCC4,.1,43	3 ms	2.5mm x 2.0mm x 0.75mm	2.97 V	125 Cel	-40 Cel		50 MHz	3 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION
HT-MM900AC-7K-EE-100M000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO		3.63 V					3.3 V	SOLCC4,.1,43	3 ms	2.5mm x 2.0mm x 0.75mm	2.97 V	125 Cel	-55 Cel		100 MHz	3 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION
HT-MM900AC-7K-EE-16M0000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO		3.63 V					3.3 V	SOLCC4,.1,43	3 ms	2.5mm x 2.0mm x 0.75mm	2.97 V	125 Cel	-55 Cel		16 MHz	3 ns	55/45	4 Amp	ENABLE/DISABLE FUNCTION
VCC4-B3D-24M5760000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO		3.63 V			15 pF	20 mA	3.3 V	DILCC4,.12	4 ms	5mm x 3.2mm x 1.4mm	2.97 V	85 Cel	-40 Cel	GOLD OVER NICKEL	24.576 MHz	4 ns	45/55	8 Amp	TRI-STATE	e4
8N4S001FG-1076CDI	Renesas Electronics	LVDS	SURFACE MOUNT	10	50 %	NO	CERAMIC	2.625 V			50 OHM	155 mA	2.5 V	LCC10,.2X.27,100/39	.425 ms	7.0mm x 5.0mm x 1.55mm	2.375 V	85 Cel	-40 Cel		100 MHz	.425 ns	55/45		ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT
HX31C5018Q	Diodes Incorporated	LVCMOS	SURFACE MOUNT	4	50 %	NO		2.625 V		AEC-Q200	15 pF	15 mA	2.5 V	LCC4,.1X.12,83/65	2.5 ms	3.2mm x 2.5mm x 1.0mm	2.375 V	105 Cel	-40 Cel		125 MHz	2.5 ns	40/60	4 Amp	STANDBY; ENABLE/DISABLE FUNCTION
NX21G0001Q	Diodes Incorporated	LVCMOS	SURFACE MOUNT	4	50 %	NO		3.465 V		AEC-Q200	15 pF	60 mA	3.3 V	LCC4,.08X.1,74/52	3 ms	2.5mm x 2.0mm x 0.8mm	3.135 V	85 Cel	-40 Cel		160 MHz	3 ns	45/55		STANDBY; ENABLE/DISABLE FUNCTION
FN0180035	Diodes Incorporated	LVCMOS	SURFACE MOUNT	4	50 %	NO		3.63 V			15 pF	15 mA	3.3 V	DILCC4,.2,200	7 ms	7.0mm x 5.0mm x 1.4mm	2.97 V	70 Cel	-20 Cel		1.8432 MHz	7 ns	45/55		STANDBY; ENABLE/DISABLE FUNCTION
FN1200033	Diodes Incorporated	CMOS	SURFACE MOUNT	4	50 %	NO		5.5 V		MIL-STD-883	15 pF	20 mA	5 V	DILCC4,.2,200	5 ms	7mm x 5mm x 1.4mm	4.5 V	70 Cel	-20 Cel		12 MHz	5 ns	45/55		STANDBY; ENABLE/DISABLE FUNCTION
8N4Q001EG-2197CDI	Renesas Electronics	LVDS	SURFACE MOUNT	10	50 %	NO	CERAMIC	3.465 V			100 OHM	160 mA	3.3 V	DILCC10,.2	.425 ms	7mm x 5mm x 1.55mm	3.135 V	85 Cel	-40 Cel		100 MHz	.425 ns	55/45		ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; SELECTABLE O/P FREQUENCIES

XO Clock Oscillators

Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.

One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.

XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.

Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.