| Part | RoHS | Manufacturer | Oscillator Type | Mounting Feature | No. of Terminals | Frequency Stability | Frequency Adjustment (Mechanical) | Aging | Package Body Material | Maximum Supply Voltage | Technology | Screening Level | Output Load | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Equivalence Code | Maximum Rise Time | Sub-Category | Physical Dimension | Minimum Supply Voltage | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Nominal Operating Frequency | Maximum Fall Time | Maximum Symmetry (%) | Manufacturer Series | Qualification | Maximum Output Low Current | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
20 % |
NO |
3.63 V |
15 pF |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
50 MHz |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION; BULK |
||||||||||||||||||||
|
Microchip Technology |
LVPECL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
50 OHM |
.25 ms |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
156.25 MHz |
.3 ns |
52/48 |
ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
.22 ms |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
212.5 MHz |
.22 ns |
52/48 |
ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
69 mA |
3.3 V |
SOLCC6,.12 |
.5 ms |
5.0mm x 3.2mm x 0.75mm |
2.97 V |
85 Cel |
-40 Cel |
156.25 MHz |
.5 ns |
55/45 |
COMPLEMENTARY OUTPUT; ENABLE/DISABLE FUNCTION |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
7 mA |
3.3 V |
DILCC4,.12 |
6 ms |
5.0mm x 3.2mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
5 MHz |
6 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
CERAMIC |
3.63 V |
15 pF |
7 mA |
3.3 V |
DILCC4,.12 |
6 ms |
5.0mm x 3.2mm x 1.4mm |
2.97 V |
105 Cel |
-40 Cel |
8 MHz |
6 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
20 % |
NO |
3.45 V |
15 pF |
3.3 V |
4 ms |
3.2mm x 2.5mm x 1.2mm |
3.15 V |
85 Cel |
-40 Cel |
12 MHz |
4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; TAPE |
||||||||||||||||||
|
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
CERAMIC |
3.465 V |
100 OHM |
33 mA |
3.3 V |
LCC6,.1X.12,60/47 |
.5 ms |
3.2mm x 2.5mm x 1.2mm |
3.135 V |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
125 MHz |
.5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; DIFFERENTIAL OUTPUT |
e4 |
|||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
4 ms |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
25 MHz |
4 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE |
e0 |
||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
4 ms |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
25 MHz |
4 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE |
e0 |
||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
2.625 V |
100 OHM |
2.5 V |
.4 ms |
7.0mm x 5.0mm x 1.7mm |
2.375 V |
85 Cel |
-40 Cel |
TIN LEAD |
24.54 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT |
e0 |
||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
2.625 V |
100 OHM |
2.5 V |
.4 ms |
7.0mm x 5.0mm x 1.7mm |
2.375 V |
85 Cel |
-40 Cel |
TIN LEAD |
66.667 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT |
e0 |
||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
25 % |
NO |
2.625 V |
100 OHM |
2.5 V |
.4 ms |
7.0mm x 5.0mm x 1.7mm |
2.375 V |
85 Cel |
-40 Cel |
66.667 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE |
||||||||||||||||||
|
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
CERAMIC |
2.625 V |
100 OHM |
14 mA |
2.5 V |
DILCC6,.2 |
.4 ms |
7mm x 5mm x 1.7mm |
2.375 V |
70 Cel |
-10 Cel |
GOLD OVER NICKEL |
125 MHz |
.4 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT |
e4 |
|||||||||||
|
Microchip Technology |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.45 V |
15 pF |
3.3 V |
5 ms |
2.5mm x 2.0mm x 0.8mm |
3.15 V |
85 Cel |
-40 Cel |
40 MHz |
5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE |
||||||||||||||||||
|
Microchip Technology |
LVCMOS |
SURFACE MOUNT |
25 % |
NO |
3.45 V |
15 pF |
3.3 V |
5 ms |
2.5mm x 2.0mm x 0.8mm |
3.15 V |
85 Cel |
-40 Cel |
50 MHz |
5 ns |
55/45 |
ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE |
||||||||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
50 % |
NO |
3.63 V |
4.5 mA |
3.3 V |
DILCC4,.1,43 |
2 ms |
2.5mm x 2.0mm x 0.75mm |
2.97 V |
85 Cel |
-40 Cel |
16 MHz |
2 ns |
55/45 |
4 Amp |
ENABLE/DISABLE FUNCTION |
|||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
10 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
70 Cel |
0 Cel |
13.999 MHz |
10 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
10 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
18.432 MHz |
10 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
33 MHz |
6 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
70 Cel |
0 Cel |
111.992 MHz |
6 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
70 Cel |
0 Cel |
50 MHz |
6 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
37.4642 MHz |
6 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
50 MHz |
6 ns |
60/40 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
48 MHz |
6 ns |
45/55 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
50 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
25.175 MHz |
6 ns |
45/55 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
Microchip Technology |
HCMOS/TTL |
SURFACE MOUNT |
25 % |
NO |
3.63 V |
15 pF |
3.3 V |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
25.6 MHz |
6 ns |
45/55 |
ENABLE/DISABLE FUNCTION; TR, 7 INCH |
||||||||||||||||||
|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
15 pF |
28 mA |
3.3 V |
DILCC4,.2,200 |
6 ms |
7.0mm x 5.0mm x 1.4mm |
2.97 V |
70 Cel |
0 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
125 MHz |
6 ns |
60/40 |
ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS/TTL OUTPUT; TR, 7 INCH |
e4 |
|||||||||||
|
Microchip Technology |
||||||||||||||||||||||||||||||||||
|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
NO |
3.63 V |
3.3 V |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
125 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
114.285 MHz |
SUPPLY VOLTAGE IS ALSO AVAILABLE IN 1.8V,2.5V AND 5V; TAPE |
e4 |
||||||||||||||||||||
|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
NO |
3.63 V |
3.3 V |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
125 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
114.285 MHz |
SUPPLY VOLTAGE IS ALSO AVAILABLE IN 1.8V,2.5V AND 5V; TR |
e4 |
||||||||||||||||||||
|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
50 % |
NO |
1.89 V |
15 pF |
1.8 V |
4 ms |
7.0mm x 5.0mm x 1.6mm |
1.71 V |
125 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
27 MHz |
4 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE |
e4 |
|||||||||||||||
|
|
Microchip Technology |
LVCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
PLASTIC/EPOXY |
3.63 V |
AEC-Q100; MIL-STD-883 |
10 pF |
6 mA |
LCC6,.06X.08,37/30 |
2 ms |
2.0mm x 1.6mm x 0.89mm |
1.71 V |
105 Cel |
-40 Cel |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION |
.002 MHz |
100 MHz |
||||||||||||
|
|
Microchip Technology |
LVCMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
PLASTIC/EPOXY |
3.63 V |
AEC-Q100; MIL-STD-883 |
10 pF |
6 mA |
LCC6,.05X.06,30/24 |
2 ms |
1.6mm x 1.2mm x 0.89mm |
1.71 V |
125 Cel |
-40 Cel |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION |
.002 MHz |
100 MHz |
||||||||||||
|
|
Microchip Technology |
LVCMOS |
SURFACE MOUNT |
4 |
20 % |
NO |
PLASTIC/EPOXY |
3.63 V |
AEC-Q100; MIL-STD-883 |
10 pF |
6 mA |
LCC6,.05X.06,30/24 |
2 ms |
1.6mm x 1.2mm x 0.89mm |
1.71 V |
125 Cel |
-40 Cel |
2 ns |
55/45 |
STANDBY; ENABLE/DISABLE FUNCTION |
.002 MHz |
100 MHz |
||||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
NO |
3.63 V |
MIL-STD-883 |
15 pF |
50 mA |
3.3 V |
DILCC4,.2,200 |
2 ms |
7.0mm x 5.0mm x 1.6mm |
2.97 V |
85 Cel |
-40 Cel |
114.285 MHz |
2 ns |
55/45 |
SUPPLY VOLTAGE IS ALSO AVAILABLE IN 1.8V,2.5V AND 5V |
|||||||||||||||
|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
CERAMIC |
3.63 V |
MIL-STD-883 |
15 pF |
40 mA |
3.3 V |
DILCC4,.12 |
3 ms |
5.0mm x 3.2mm x 1.4mm |
2.97 V |
85 Cel |
-40 Cel |
GOLD OVER NICKEL |
100 MHz |
3 ns |
45/55 |
TRI-STATE; ENABLE/DISABLE FUNCTION |
e4 |
||||||||||
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
4 |
25 % |
NO |
3.63 V |
5 pF |
3.5 ms |
3.2mm x 2.5mm x 0.85mm |
1.71 V |
85 Cel |
-40 Cel |
.032768 MHz |
3.5 ns |
55/45 |
AEC-Q100; BULK |
||||||||||||||||||
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
148.5 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TUBE |
||||||||||||||||||
|
|
Microchip Technology |
LVPECL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
100 OHM |
.22 ms |
2.5mm x 2.0mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
MATTE TIN |
148.5 MHz |
.22 ns |
52/48 |
ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK |
e3 |
|||||||||||||||
|
|
Microchip Technology |
LVPECL |
SURFACE MOUNT |
6 |
25 % |
NO |
3.63 V |
50 OHM |
.4 ms |
3.2mm x 2.5mm x 0.9mm |
2.25 V |
85 Cel |
-40 Cel |
MATTE TIN |
100 MHz |
.5 ns |
52/48 |
ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK |
e3 |
|||||||||||||||
|
|
Microchip Technology |
HCSL |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
50 OHM |
.45 ms |
5.0mm x 3.2mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
156.25 MHz |
.45 ns |
52/48 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
|||||||||||||||
|
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
5.0mm x 3.2mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
148.5 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
|||||||||||||||
|
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
5.0mm x 3.2mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
322.265 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
|||||||||||||||
|
|
Microchip Technology |
CMOS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
.5 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
212.5 MHz |
.5 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; TR |
e3 |
||||||||||||||||
|
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
125 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT |
e3 |
|||||||||||||||
|
|
Microchip Technology |
HCSL |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
50 OHM |
.45 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
322.265 MHz |
.45 ns |
52/48 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e3 |
|||||||||||||||
|
|
Microchip Technology |
LVDS |
SURFACE MOUNT |
6 |
50 % |
NO |
3.63 V |
100 OHM |
.4 ms |
7.0mm x 5.0mm x 1.4mm |
2.375 V |
85 Cel |
-40 Cel |
MATTE TIN |
50 MHz |
.4 ns |
55/45 |
TRI-STATE; ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; TR |
e3 |
Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.
One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.
XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.
Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.