XO Clock Oscillators

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Part	Manufacturer	Oscillator Type	Mounting Feature	No. of Terminals	Frequency Stability	Frequency Adjustment (Mechanical)	Package Body Material	Maximum Supply Voltage	Screening Level	Output Load	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Equivalence Code	Maximum Rise Time	Sub-Category	Physical Dimension	Minimum Supply Voltage	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Nominal Operating Frequency	Maximum Fall Time	Maximum Symmetry (%)	Qualification	Maximum Output Low Current	Additional Features	JESD-609 Code	Minimum Operating Frequency	Maximum Operating Frequency
AMJDGFH-A11	Abracon	CMOS	SURFACE MOUNT	4	25 %	NO		3.63 V		10 pF					2.2 ms		1.6mm x 1.2mm x 0.84mm	1.71 V	85 Cel	-40 Cel		50 MHz	2.2 ns	55/45			100 MHZ FREQ ALSO AVAILABLE; BULK; BAG
AMJDGFJ-A11	Abracon	CMOS	SURFACE MOUNT	4	25 %	NO		3.63 V		15 pF					1.5 ms		1.6mm x 1.2mm x 0.84mm	1.71 V	85 Cel	-40 Cel		50 MHz	1.5 ns	55/45			100 MHZ FREQ ALSO AVAILABLE; BULK; BAG
ECS-3518-320-B-TR	Ecs International	HCMOS	SURFACE MOUNT	4			CERAMIC				7 mA	1.8 V	1.8	DILCC4,.12		Other Oscillators			70 Cel	0 Cel	GOLD OVER NICKEL	32 MHz			Not Qualified			e4	1.544 MHz	125 MHz
ECS-3518-480-B-TR	Ecs International	HCMOS	SURFACE MOUNT	4			CERAMIC				15 mA	1.8 V	1.8	DILCC4,.12		Other Oscillators			70 Cel	0 Cel	GOLD OVER NICKEL	48 MHz			Not Qualified			e4	1.544 MHz	125 MHz
656P38D5C3T	Cts	LVPECL	SURFACE MOUNT		25 %	NO		3.465 V		50 OHM		3.3 V			.6 ms		7.0mm x 5.0mm x 1.85mm	3.135 V	70 Cel	-20 Cel	GOLD OVER NICKEL	38.84 MHz	.6 ns	55/45			TRI-STATE; ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; TR, 7 INCH	e4
ECS-3225SMV-240-FN-TR	Ecs International	HCMOS	SURFACE MOUNT	4	10 %	NO	CERAMIC	3.63 V		15 pF	10 mA			LCC4,.09X.12,83/65	5 ms		3.2mm x 2.5mm x 1.2mm	1.62 V	85 Cel	-40 Cel	GOLD	24 MHz	5 ns	45/55			TRI-STATE; ENABLE/DISABLE FUNCTION	e4
ECS-3225SMV-270-FN-TR	Ecs International	HCMOS	SURFACE MOUNT	4	10 %	NO	CERAMIC	3.63 V		15 pF	10 mA			LCC4,.09X.12,83/65	5 ms		3.2mm x 2.5mm x 1.2mm	1.62 V	85 Cel	-40 Cel	GOLD	27 MHz	5 ns	45/55			TRI-STATE; ENABLE/DISABLE FUNCTION	e4
DSC1201DI3-50M00000	Microchip Technology	CMOS	SURFACE MOUNT	6	20 %	NO		3.63 V		15 pF							2.5mm x 2.0mm x 0.9mm	2.25 V	85 Cel	-40 Cel		50 MHz		55/45			STANDBY; ENABLE/DISABLE FUNCTION; BULK
DSC1222DI2-156M2500	Microchip Technology	LVPECL	SURFACE MOUNT	6	25 %	NO		3.63 V		50 OHM					.25 ms		2.5mm x 2.0mm x 0.9mm	2.25 V	85 Cel	-40 Cel		156.25 MHz	.3 ns	52/48			ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK
DSC1223DI2-212M5000	Microchip Technology	LVDS	SURFACE MOUNT	6	25 %	NO		3.63 V		100 OHM					.22 ms		2.5mm x 2.0mm x 0.9mm	2.25 V	85 Cel	-40 Cel		212.5 MHz	.22 ns	52/48			ENABLE/DISABLE FUNCTION; DIFFERENTIAL OUTPUT; BULK
MO-9200AE-D3K-EE156M25000	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO		3.63 V			69 mA	3.3 V		SOLCC6,.12	.5 ms		5.0mm x 3.2mm x 0.75mm	2.97 V	85 Cel	-40 Cel		156.25 MHz	.5 ns	55/45			COMPLEMENTARY OUTPUT; ENABLE/DISABLE FUNCTION
VC-801-EAE-FAAN-5M00000000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	CERAMIC	3.63 V		15 pF	7 mA	3.3 V		DILCC4,.12	6 ms		5.0mm x 3.2mm x 1.4mm	2.97 V	85 Cel	-40 Cel		5 MHz	6 ns	55/45			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VC-801-EAF-KAAN-8M00000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO	CERAMIC	3.63 V		15 pF	7 mA	3.3 V		DILCC4,.12	6 ms		5.0mm x 3.2mm x 1.4mm	2.97 V	105 Cel	-40 Cel		8 MHz	6 ns	55/45			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VC-820-EAE-EAAN-12M0000000	Microchip Technology	CMOS	SURFACE MOUNT		20 %	NO		3.45 V		15 pF		3.3 V			4 ms		3.2mm x 2.5mm x 1.2mm	3.15 V	85 Cel	-40 Cel		12 MHz	4 ns	55/45			ENABLE/DISABLE FUNCTION; TAPE
VC-827-EDE-KAAN-125M000000	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO	CERAMIC	3.465 V		100 OHM	33 mA	3.3 V		LCC6,.1X.12,60/47	.5 ms		3.2mm x 2.5mm x 1.2mm	3.135 V	85 Cel	-40 Cel	Gold (Au) - with Nickel (Ni) barrier	125 MHz	.5 ns	55/45			ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT; DIFFERENTIAL OUTPUT	e4
VCC1-B3D-25M0000000_SNPB	Microchip Technology	CMOS	SURFACE MOUNT		50 %	NO		3.63 V		15 pF		3.3 V			4 ms		7.0mm x 5.0mm x 1.6mm	2.97 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	25 MHz	4 ns	45/55			TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE	e0
VCC1-B3F-25M0000000_SNPB	Microchip Technology	CMOS	SURFACE MOUNT		25 %	NO		3.63 V		15 pF		3.3 V			4 ms		7.0mm x 5.0mm x 1.6mm	2.97 V	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	25 MHz	4 ns	45/55			TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE	e0
VC-709-HDE-FAAN-24M5400000_SNPB	Microchip Technology	LVDS	SURFACE MOUNT		25 %	NO		2.625 V		100 OHM		2.5 V			.4 ms		7.0mm x 5.0mm x 1.7mm	2.375 V	85 Cel	-40 Cel	TIN LEAD	24.54 MHz	.4 ns	55/45			ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT	e0
VC-709-HDE-FAAN-66M6670000_SNPB	Microchip Technology	LVDS	SURFACE MOUNT		25 %	NO		2.625 V		100 OHM		2.5 V			.4 ms		7.0mm x 5.0mm x 1.7mm	2.375 V	85 Cel	-40 Cel	TIN LEAD	66.667 MHz	.4 ns	55/45			ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT	e0
VC-709-HDE-FAAN-66M6670000	Microchip Technology	LVDS	SURFACE MOUNT		25 %	NO		2.625 V		100 OHM		2.5 V			.4 ms		7.0mm x 5.0mm x 1.7mm	2.375 V	85 Cel	-40 Cel		66.667 MHz	.4 ns	55/45			ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE
VC-709-HDW-KAAN-125M000000	Microchip Technology	LVDS	SURFACE MOUNT	6	50 %	NO	CERAMIC	2.625 V		100 OHM	14 mA	2.5 V		DILCC6,.2	.4 ms		7mm x 5mm x 1.7mm	2.375 V	70 Cel	-10 Cel	GOLD OVER NICKEL	125 MHz	.4 ns	55/45			ENABLE/DISABLE FUNCTION; COMPLEMENTARY OUTPUT	e4
VC-840-EAE-FAAN-40M0000000	Microchip Technology	LVCMOS	SURFACE MOUNT		25 %	NO		3.45 V		15 pF		3.3 V			5 ms		2.5mm x 2.0mm x 0.8mm	3.15 V	85 Cel	-40 Cel		40 MHz	5 ns	55/45			ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE
VC-840-EAE-FAAN-50M0000000	Microchip Technology	LVCMOS	SURFACE MOUNT		25 %	NO		3.45 V		15 pF		3.3 V			5 ms		2.5mm x 2.0mm x 0.8mm	3.15 V	85 Cel	-40 Cel		50 MHz	5 ns	55/45			ENABLE/DISABLE FUNCTION; COMPLEMENTARY OPUTPUT; TAPE
MO-9000AE-7K-EE-16M0000000	Microchip Technology	CMOS	SURFACE MOUNT	4	50 %	NO		3.63 V			4.5 mA	3.3 V		DILCC4,.1,43	2 ms		2.5mm x 2.0mm x 0.75mm	2.97 V	85 Cel	-40 Cel		16 MHz	2 ns	55/45		4 Amp	ENABLE/DISABLE FUNCTION
VPC1-B1B-13M9990000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		50 %	NO		3.63 V		15 pF		3.3 V			10 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	70 Cel	0 Cel		13.999 MHz	10 ns	60/40			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B1C-18M4320000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		50 %	NO		3.63 V		15 pF		3.3 V			10 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	85 Cel	-40 Cel		18.432 MHz	10 ns	60/40			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B1C-33M0000000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		50 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	85 Cel	-40 Cel		33 MHz	6 ns	60/40			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B1E-111M992000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		25 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	70 Cel	0 Cel		111.992 MHz	6 ns	60/40			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B1E-50M0000000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		25 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	70 Cel	0 Cel		50 MHz	6 ns	60/40			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B1F-37M4642000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		25 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	85 Cel	-40 Cel		37.4642 MHz	6 ns	60/40			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B1F-50M0000000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		25 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	85 Cel	-40 Cel		50 MHz	6 ns	60/40			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B3C-48M0000000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		50 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	85 Cel	-40 Cel		48 MHz	6 ns	45/55			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B3D-25M1750000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		50 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	85 Cel	-40 Cel		25.175 MHz	6 ns	45/55			ENABLE/DISABLE FUNCTION; TR, 7 INCH
VPC1-B3F-25M6000000	Microchip Technology	HCMOS/TTL	SURFACE MOUNT		25 %	NO		3.63 V		15 pF		3.3 V			6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	85 Cel	-40 Cel		25.6 MHz	6 ns	45/55			ENABLE/DISABLE FUNCTION; TR, 7 INCH
CB3LV-3I-33M333000	Cts	HCMOS/TTL	SURFACE MOUNT	4	50 %	NO	CERAMIC	3.63 V		30 pF	35 mA	3.3 V		DILCC4,.2,200	5 ms		7.0mm x 5.0mm x 1.8mm	2.97 V	85 Cel	-40 Cel	Gold (Au) - with Nickel (Ni) barrier	33.333 MHz	5 ns	55/45		16 Amp	TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH	e4
VPC1-B1E-125M000000	Microchip Technology	CMOS	SURFACE MOUNT	4	25 %	NO	CERAMIC	3.63 V		15 pF	28 mA	3.3 V		DILCC4,.2,200	6 ms		7.0mm x 5.0mm x 1.4mm	2.97 V	70 Cel	0 Cel	Nickel/Palladium/Gold (Ni/Pd/Au)	125 MHz	6 ns	60/40			ENABLE/DISABLE FUNCTION; ALSO COMPATIBLE WITH HCMOS/TTL OUTPUT; TR, 7 INCH	e4
DSC612PI2A-0166T	Microchip Technology
ECS-2100A-049	Ecs International	HCMOS/TTL	THROUGH HOLE MOUNT		100 %	NO		5.25 V		10 TTL, 50 pF		5 V			5 ms		13.2mm x 13.2mm x 6.2mm	4.75 V	70 Cel	0 Cel		4.9152 MHz	5 ns	55/45
VCC1-B3F-25M0006250	Vectron International	CMOS	SURFACE MOUNT		25 %	NO		3.63 V		15 pF		3.3 V			4 ms		7.0mm x 5.0mm x 1.6mm	2.97 V	85 Cel	-40 Cel		25.000625 MHz	4 ns	45/55			TRI-STATE; ENABLE/DISABLE FUNCTION; TR, 7 INCH
VCC1-9004-114M285000	Microchip Technology	CMOS	SURFACE MOUNT			NO		3.63 V				3.3 V					7.0mm x 5.0mm x 1.6mm	2.97 V	125 Cel	-55 Cel	Gold (Au) - with Nickel (Ni) barrier	114.285 MHz					SUPPLY VOLTAGE IS ALSO AVAILABLE IN 1.8V,2.5V AND 5V; TAPE	e4
VCC1-9004-114M285000TR	Microchip Technology	CMOS	SURFACE MOUNT			NO		3.63 V				3.3 V					7.0mm x 5.0mm x 1.6mm	2.97 V	125 Cel	-55 Cel	Gold (Au) - with Nickel (Ni) barrier	114.285 MHz					SUPPLY VOLTAGE IS ALSO AVAILABLE IN 1.8V,2.5V AND 5V; TR	e4
VCC1-H3R-27M00000000	Microchip Technology	CMOS	SURFACE MOUNT		50 %	NO		1.89 V		15 pF		1.8 V			4 ms		7.0mm x 5.0mm x 1.6mm	1.71 V	125 Cel	-55 Cel	Gold (Au) - with Nickel (Ni) barrier	27 MHz	4 ns	45/55			TRI-STATE; ENABLE/DISABLE FUNCTION; TAPE	e4
510CAB8M00000BAGR	Skyworks Solutions	CMOS	SURFACE MOUNT	4	50 %	NO		3.63 V	MIL-STD-883	15 pF	26 mA	3.3 V		DILCC4,.12	1.2 ms		5mm x 3.2mm x 1.28mm	2.97 V	85 Cel	-40 Cel			1.2 ns	52/48		8 Amp	TRI-STATE; ENABLE/DISABLE FUNCTION		.1 MHz	212.5 MHz
510CCAM409600CAGR	Skyworks Solutions	CMOS	SURFACE MOUNT	4	20 %	NO		3.63 V	MIL-STD-883	15 pF	26 mA	3.3 V		DILCC4,.1,83	1.2 ms		3.2mm x 2.5mm x 1.1mm	2.97 V	85 Cel	-40 Cel			1.2 ns	52/48		8 Amp	TRI-STATE; ENABLE/DISABLE FUNCTION		.1 MHz	212.5 MHz
510KAA50M0000CAG	Skyworks Solutions	CMOS	SURFACE MOUNT	4	50 %	NO		1.89 V	MIL-STD-883	15 pF		1.8 V		DILCC4,.1,83	1.2 ms		3.2mm x 2.5mm x 1.1mm	1.71 V	85 Cel	-40 Cel		50 MHz	1.2 ns	52/48		4 Amp	TRI-STATE; ENABLE/DISABLE FUNCTION
510KCA200M000CAGR	Skyworks Solutions	CMOS	SURFACE MOUNT	4	20 %	NO		1.89 V	MIL-STD-883	15 pF		1.8 V		DILCC4,.1,83	1.2 ms		3.2mm x 2.5mm x 1.1mm	1.71 V	85 Cel	-40 Cel		200 MHz	1.2 ns	52/48		4 Amp	TRI-STATE; ENABLE/DISABLE FUNCTION
511BCA233M333CAGR	Skyworks Solutions	LVDS	SURFACE MOUNT	6	20 %	NO		3.63 V	MIL-STD-883		23 mA	3.3 V		DILCC6,.1,49	.8 ms		3.2mm x 2.5mm x 1.1mm	2.97 V	85 Cel	-40 Cel		233.333 MHz	.8 ns	52/48			TRI-STATE; ENABLE/DISABLE FUNCTION
DSA612NL2A-01CPTVAO	Microchip Technology	LVCMOS	SURFACE MOUNT	4	25 %	NO	PLASTIC/EPOXY	3.63 V	AEC-Q100; MIL-STD-883	10 pF	6 mA			LCC6,.06X.08,37/30	2 ms		2.0mm x 1.6mm x 0.89mm	1.71 V	105 Cel	-40 Cel			2 ns	55/45			STANDBY; ENABLE/DISABLE FUNCTION		.002 MHz	100 MHz

Crystal Oscillator (XO) Clock Oscillators are electronic devices that generate a stable clock signal with a fixed frequency. They use a quartz crystal resonator as the frequency-determining element, which provides a stable and accurate frequency over a wide temperature range.

One of the main advantages of XO Clock Oscillators is their ability to generate a stable and precise clock signal with a fixed frequency. This makes them ideal for use in applications that require precise timing, such as in digital signal processing, telecommunications, and scientific research.

XO Clock Oscillators offer a low phase noise, which is important in applications that require a clean and stable clock signal. They are capable of generating frequencies ranging from a few kilohertz to several hundred megahertz, making them suitable for use in various electronic circuits.

Additionally, XO Clock Oscillators have a relatively simple design and are easy to integrate into electronic systems. They are available in a range of package sizes and configurations, allowing them to be used in various applications, including in communication systems, network equipment, and instrumentation.