POWER SUPPLY MANAGEMENT CIRCUIT Power Management ICs 1,357

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Part	Manufacturer	Other IC type	Temperature Grade	No. of Terminals	Package Code	Package Shape	Surface Mount	Package Body Material	Maximum Supply Current (Isup)	No. of Functions	No. of Channels	Screening Level	Terminal Form	Nominal Supply Voltage (Vsup)	Package Style (Meter)	Package Equivalence Code	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Supply Voltage (Vsup)	Maximum Seated Height	Width (mm)	Minimum Supply Voltage (Vsup)	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Nominal Threshold Voltage (V)	Length	Adjustable Threshold
MC33PF8100CFESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8100CHESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8100CHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8100EAESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100EAES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100EPESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260		8 mm	YES
MC33PF8100EPES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V		e3	40	260		8 mm	YES
MC33PF8100EQESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260		8 mm	YES
MC33PF8100EQES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V		e3	40	260		8 mm	YES
MC33PF8100ERESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8100ERES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8100F3ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8100F3ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT																		TIN			3						e3	40	260
MC33PF8101A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V		e3	40	260		8 mm	YES
MC33PF8200A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V			40	260	+2.8V	8 mm	YES
MC33PF8200CXESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200CXES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200D2ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200D2ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DBESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DBES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DEESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DEES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DFESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DFES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DHESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200DHES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200EMESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200EMES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200ESESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200ESES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200ETESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8200ETES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8201A0ESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V		e3	40	260		8 mm	YES
MC33PF8201A0ES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V		e3	40	260		8 mm	YES
MC34PF8101A0EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V			40	260		8 mm	YES
MC34PF8101A0EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	9		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.7 V			40	260		8 mm	YES
BQ25125YFPT	Texas Instruments	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	25	VFBGA	RECTANGULAR	YES	PLASTIC/EPOXY		1	1		BALL	5 V	GRID ARRAY, VERY THIN PROFILE, FINE PITCH		.4 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	R-PBGA-B25	1	5.5 V	.5 mm	2.468 mm	3.4 V	ALSO REQUIRES 3.4V TO 20V SUPPLY	e1	30	260		2.53 mm	YES
PT7A7613M8-13	Diodes Incorporated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	8	TSSOP	SQUARE	YES	PLASTIC/EPOXY	.2 mA	1	1		GULL WING	3.3 V	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	TSSOP8,.19	.65 mm	85 Cel	-40 Cel		DUAL	S-PDSO-G8		5.5 V	1.1 mm	3 mm	3 V			NOT SPECIFIED	NOT SPECIFIED	+3.08V	3 mm	NO
PT7A7613S-13	Diodes Incorporated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	8	SOP	RECTANGULAR	YES	PLASTIC/EPOXY	.2 mA	1	1		GULL WING	3.3 V	SMALL OUTLINE	SOP8,.24	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		5.5 V	1.6 mm	3.85 mm	3 V			NOT SPECIFIED	NOT SPECIFIED	+3.08V	4.9 mm	NO
PT7A7614S-13	Diodes Incorporated	POWER SUPPLY MANAGEMENT CIRCUIT	INDUSTRIAL	8	SOP	RECTANGULAR	YES	PLASTIC/EPOXY	.2 mA	1	1		GULL WING	3.3 V	SMALL OUTLINE	SOP8,.24	1.27 mm	85 Cel	-40 Cel		DUAL	R-PDSO-G8		5.5 V	1.6 mm	3.85 mm	3 V			NOT SPECIFIED	NOT SPECIFIED	+2.93V	4.9 mm	NO
MC32PF1550A0EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel		QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm	2.5 V			40	260	+6.5V	5 mm	YES
MC32PF1550A9EPR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm	2.5 V		e4	40	260	+6.5V	5 mm	YES
MC32PF1550A9EP	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		40	QCCN	SQUARE	YES	PLASTIC/EPOXY		1	7		NO LEAD	3.6 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE		.4 mm	85 Cel	-40 Cel	NICKEL PALLADIUM GOLD	QUAD	S-PQCC-N40	3	4.5 V	.9 mm	5 mm	2.5 V		e4	40	260	+6.5V	5 mm	YES
L5965SQ-V0T	STMicroelectronics	POWER SUPPLY MANAGEMENT CIRCUIT	AUTOMOTIVE	48	HQCCN	SQUARE	YES	UNSPECIFIED		1	7	AEC-Q100	NO LEAD	14 V	CHIP CARRIER, HEAT SINK/SLUG	LCC48,.28SQ,20	.5 mm	125 Cel	-40 Cel		QUAD	S-XQCC-N48	3	32 V	1.05 mm	7 mm	4 V					+3.2,3.4V	7 mm	YES
MC33PF8100FJESR2	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES
MC33PF8100FJES	NXP Semiconductors	POWER SUPPLY MANAGEMENT CIRCUIT		56	HVQCCN	SQUARE	YES	PLASTIC/EPOXY		1	12		NO LEAD	5 V	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20	.5 mm	105 Cel	-40 Cel	TIN	QUAD	S-PQCC-N56	3	5.5 V	1 mm	8 mm	2.5 V		e3	40	260	+2.8V	8 mm	YES

Power Management ICs

Power Management ICs (PMICs) are electronic components that are used to regulate and manage the power supply in electronic systems. They are used to optimize power usage, reduce power consumption, and increase battery life in portable devices.

PMICs typically include a range of components such as voltage regulators, power switches, and battery management circuits. Voltage regulators are used to maintain a stable voltage output despite fluctuations in the input voltage or load. Power switches are used to control the flow of power in a circuit, and battery management circuits are used to monitor and manage the charging and discharging of batteries.

PMICs are used in a wide range of applications, including mobile phones, laptops, tablets, and other portable devices. They are also used in automotive electronics, power supplies, and industrial automation systems. PMICs play a critical role in managing power consumption in electronic systems, reducing energy waste and extending battery life.

One of the key advantages of PMICs is their ability to provide multiple functions in a single package, reducing the number of components needed in a system and simplifying design. They also help to improve system reliability by protecting against overvoltage, overcurrent, and overtemperature conditions.